A3PE3000-1FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
Référence : A3PE3000-1FGG324I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
A3PE3000-1FGG324I Présentation
An FPGA (field programmable gate array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and programmable I/O that designers configure in the field. The ProASIC3E family belongs to the flash-based FPGA category, which sits within the broader hierarchy of programmable logic: FPGA -> programmable logic device -> digital logic IC. Unlike SRAM-based FPGAs, flash-based parts configure instantly at power-up (Live-at-Power-Up Level 0 support) and operate as true single-chip solutions without an external configuration device.
Key features include 3 million system gates, up to 504 kbits of true dual-port SRAM, optional soft ARM support, reprogrammability with low total cost of ownership, and industrial temperature operation. The 324-ball FBGA (19x19 mm, 1 mm pitch) surface-mount package provides 221 user I/Os on this device while the family supports up to 616 user I/Os in larger packages.
The ProASIC3E fabric achieves system performance up to approximately 310 MHz and integrates embedded block RAM for FIFOs, buffers, and soft CPU implementations. The flash switch technology is inherently non-volatile and secure against cloning, an advantage over SRAM FPGAs that require bitstream loading.
Typical applications include industrial automation control, aerospace and defense systems, communications and networking equipment, and medical instrumentation where single-chip, instant-on, secure programmable logic is required.
When designing with this device, verify I/O bank voltage assignments and thermal budget: the junction temperature range is -40C to +100C (TJ), and used differential I/O pairs reduce available single-ended I/O count per the datasheet.
This page synthesizes distributor pricing references, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet. Pricing as of 2026-09-02; A3PE3000 family listed as Active by distributors with a typical 8-week manufacturer lead time.
Alternatives de remplacement direct pour A3PE3000-1FGG324I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE3000-1FGG324I (même facteur de forme et même empreinte) — différant par Package, Family, Process Technology, Operating Temperature, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE3000-2FGG324I
✅ Remplacement direct✓ En stock
$1 / unité
Voir la fiche technique →A3PE3000-FGG324I
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →A3PE3000-FGG324
✅ Remplacement direct✓ En stock
$335.22 / unité
Voir la fiche technique →A3PE3000-2FGG324
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$216 / unité
Voir la fiche technique →A3PE3000L-FGG324I
✅ Remplacement direct✓ En stock
$62.65 / unité
Voir la fiche technique →A3PE3000L-1FGG324I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000-1FGG324I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3E (Flash-based FPGA) |
| System Gates | 3,000,000 |
| User I/Os (this package) | 221 |
| Max User I/Os (family) | 616 |
| Embedded SRAM | 504 kbits true dual-port |
| Supply Voltage (core) | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration | Flash-based, Live-at-Power-Up Level 0, single-chip |
| Soft CPU Support | Optional soft ARM support |
| Boîtier | 324-BGA FBGA (19x19 mm, 1 mm pitch) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (TJ) |
| Number of Gates | 3,000,000 |
| Speed Grade | -1 |
| Packaging | Tray |
| Statut RoHS | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
Guide de configuration des broches du A3PE3000-1FGG324I 324-bga fbga (19x19 mm, 1 mm pitch)
Configuration des broches du A3PE3000-1FGG324I (boîtier 324-bga fbga (19x19 mm, 1 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE3000-1FGG324I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE3000-1FGG324I convient pour 6 applications: Industrial Automation and Control, Aerospace and Defense Electronics, Communications and Networking Equipment, Medical Instrumentation, Test and Measurement Systems, Secure Embedded Systems.
Industrial Automation and Control
The A3PE3000-1FGG324I fits industrial automation controllers because its 3-million-gate flash fabric integrates PLC logic, motor-control state machines, and fieldbus interfaces in one chip, while its -40C to +100C junction rating covers harsh cabinet environments. Live-at-Power-Up flash configuration means the FPGA is functional within microseconds of supply ramp, eliminating boot delay in safety-relevant interlocks and removing the external configuration flash that adds a failure point on noisy factory floors. Used as the main control fabric between 1.5V core and 3.3V I/O banks, it implements deterministic logic with family performance up to ~310 MHz. Trade-off: as an LUT-based fabric rather than an MCU, control algorithms are implemented in HDL, and power dissipation must be budgeted since the part is not the lowest-power option in the ProASIC3 lineup.
Recommandé
Aerospace and Defense Electronics
Flash-based ProASIC3E devices are widely used in aerospace and defense because the non-volatile flash switch technology is inherently resistant to bitstream interception and configuration readback, and the single-chip configuration removes SEU-prone external boot flash at power-up. The A3PE3000-1FGG324I provides 3 million system gates and 504 kbits of true dual-port SRAM, enough for sensor-interface bridging, encryption preprocessing, and bus protocol conversion (MIL-STD-1553-style interfaces built as soft IP). The -1 speed grade with industrial temperature operation suits avionics auxiliary processing where instant-on behavior matters more than peak fabric frequency. Design consideration: differential I/O pair usage reduces available single-ended I/O count per the datasheet, so pin budgeting in constrained 221-I/O designs requires early planning.
Recommandé
Communications and Networking Equipment
In networking line cards and aggregation equipment, the A3PE3000-1FGG324I serves as glueless bridge logic between PHYs, MACs, and backplane interfaces. Its 221 user I/Os in a compact 19x19 mm 324-FBGA support multiple I/O standards with differential signaling options, and the 504-kbit true dual-port SRAM implements FIFOs and packet buffers without external memory for moderate throughput paths. The flash fabric starts operating instantly at power-up, which is valuable in systems with strict link-establishment timing, and reprogrammability enables in-field feature updates without board changes. Performance consideration: family fabric speed reaches approximately 310 MHz, sufficient for many protocol engines, but designs needing multi-gigabit SERDES must look to transceiver-equipped FPGA families instead, since ProASIC3E has no hardened serial links.
Recommandé
Medical Instrumentation
Medical diagnostic equipment benefits from the A3PE3000-1FGG324I's deterministic, instant-on flash fabric for sensor timing, front-end sequencing, and interface conversion between analog front ends and host processors. The 3-million-gate capacity hosts soft ARM support for embedded control, while the true dual-port SRAM (504 kbits) buffers acquisition data with independent read/write ports. Live-at-Power-Up Level 0 support ensures measurement chains are ready before host software boots, shortening startup sequences in clinical workflows, and the reprogrammable fabric supports instrument reconfiguration for multi-modality platforms. The industrial-grade -40C to +100C junction range comfortably covers controlled clinical environments with margin. Designers should verify I/O bank voltages against sensor interface levels and budget thermal dissipation within enclosure airflow limits.
Recommandé
Test and Measurement Systems
Bench instruments and automated test equipment use the A3PE3000-1FGG324I as a reconfigurable timing, triggering, and instrumentation-bus engine. The 3-million-gate fabric implements timestamping counters, trigger matrices, and protocol-decoding IP, while 221 user I/Os with multiple single-ended and differential standards connect to analog front ends and digital channel boards. Flash-based Live-at-Power-Up configuration guarantees the instrument's protection and interlock logic is active the instant power is applied - important for protecting devices under test. The 19x19 mm FBGA conserves card space in modular instrument chassis. Trade-off: the -1 speed grade's fabric performance (~310 MHz family maximum) is adequate for most triggering but designs requiring multi-GHz sampling control need dedicated ASIC or transceiver FPGA solutions.
Recommandé
Secure Embedded Systems
Applications requiring design IP protection choose the A3PE3000-1FGG324I because flash-based FPGA configuration is stored on-chip and does not require loading a bitstream at boot, removing the interception window that SRAM FPGAs have during configuration. The single-chip Live-at-Power-Up architecture means no external configuration device can be probed or substituted. With 3 million system gates and optional soft ARM support, the device hosts proprietary processing logic plus soft-processor control, and 504 kbits of true dual-port SRAM supports on-chip buffering that minimizes external bus exposure. This makes it suitable for licensing-control dongles, secure industrial gateways, and proprietary algorithm acceleration. Consideration: flash cells have finite program/erase endurance, so field reprogramming frequency should be bounded per the datasheet endurance specification.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE3000-1FGG324I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE3000-2FGG324I | A3PE3000-FGG324I | A3PE3000L-FGG324I | A3PE3000L-1FGG324I |
|---|---|---|---|---|---|
| Package | 324-FBGA (19x19 mm, 1 mm pitch) | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 (low-power) | 3,000,000 (low-power) |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 | -2 (faster) | standard | standard (L) | -1 (L) |
| Temperature Range | -40C to +100C (TJ, industrial) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) |
| Configuration | Flash-based, Live-at-Power-Up, single-chip | Flash-based - same | Flash-based - same | Flash-based - same | Flash-based - same |
Principaux différenciateurs
- Lowest-cost speed grade with full 3M-gate capacity (vs A3PE3000-2FGG324I)
- Industrial temperature rating (vs A3PE3000-FGG324)
- Standard-grade alternative for non-timing-critical rebuilds (vs A3PE3000-FGG324I)
- Full-power fabric for maximum logic throughput (vs A3PE3000L-FGG324I)
Notes de conception
The A3PE3000-1FGG324I requires a 1.5V core supply regulated to 1.425V-1.575V. Estimate core current by running static and dynamic power analysis in Libero SoC for your specific design; dynamic power scales with toggle rate and clock tree loading, and a 3M-gate fabric can dissipate watts at high utilization. Provide dedicated 1.5V and I/O bank regulators with adequate margin, and sequence I/O banks after core per the ProASIC3E datasheet power-up requirements to avoid latch-up risk.
The 324-ball FBGA at 1 mm pitch requires a fine-pitch BGA footprint with via-in-pad or dogbone escape routing; a 19x19 mm body with full 221-I/O usage may need 4+ signal layers plus dedicated power/ground planes for clean I/O bank returns. Solder the exposed ball array with a standard SAC lead-free profile per JEDEC-style BGA reflow guidelines and inspect with X-ray given the hidden joints. Follow the DS0098 datasheet ball map exactly when generating the land pattern.
Remember that each used differential I/O pair reduces available single-ended I/Os by two, and for A3PE3000 devices the usage of certain I/O standards is limited (per the DS0098 datasheet). Designers converting from SRAM FPGAs often forget the flash fabric is instant-on: ensure board power sequencing assumes the FPGA I/O may drive immediately at power-up. Also note the -40C to +100C rating is junction temperature (TJ), not ambient - derate for self-heating in enclosed systems.
Informations de conformité
ROHS3 Compliant per Microchip USA distributor listing. REACH, halogen-free, and conflict-minerals status not stated in retrieved data - confirm on official Microchip product page.
