A3PE3000L-FGG484I - 3M-Gate ProASIC3L Flash FPGA | Microchip
Référence : A3PE3000L-FGG484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
A3PE3000L-FGG484I Présentation
A flash FPGA is a programmable logic device whose routing and logic configuration data is stored in on-chip flash memory rather than volatile SRAM. This places ProASIC3L in the broader power-management-of-systems hierarchy as an instant-on, low-static-power fabric used where ASIC replacement, design security, and board-space savings matter.
Key features include a 1.2 V to 1.5 V core voltage with a 1.14 V to 1.575 V supply tolerance, dramatic dynamic power reduction via Flash*Freeze technology, up to 616 user I/Os across the family (341 on the 484-ball package), and 130-nm, 7-layer-metal (6 copper) flash-based CMOS process technology. The industrial temperature rating (-40 C to +100 C TJ) suits harsh-environment deployments.
Architecturally, the device uses the ProASIC3 VersaTile logic structure plus embedded true dual-port SRAM blocks, supporting DDR controllers, FIFOs, and soft CPU implementations. Flash switching elements draw negligible static current versus SRAM cells, and the Flash*Freeze mode freezes I/O state while cutting dynamic power for battery-sensitive designs.
Typical applications include industrial automation control, portable and battery-powered instrumentation, secure military/aerospace subsystems, and communications line-card glue logic - all cases where instant-on operation, low static power, and single-chip configuration are decisive.
Design consideration: budget the 1.2 V/1.5 V core rail carefully and use Libero SoC to verify Flash*Freeze entry/exit timing; BGA routing on 1 mm pitch requires via-in-pad or dogbone fanout on at least 8-layer PCBs.
This page synthesizes distributor pricing context, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour A3PE3000L-FGG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE3000L-FGG484I (même facteur de forme et même empreinte) — différant par Package, Family, RoHS Status, Process Technology, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE3000L-FGG484
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000L-1FGG484I
✅ Remplacement direct✓ En stock
$104.5 / unité
Voir la fiche technique →A3PE3000L-FG484I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000L-FGG484M
✅ Remplacement direct✓ En stock
$298 / unité
Voir la fiche technique →A3PE3000-FGG484
✅ Remplacement direct✓ En stock
$152.6 / unité
Voir la fiche technique →A3PE3000L-FGG484I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 |
| Logic Cells (CLBs) | 75264 |
| User I/Os (this package) | 341 |
| Embedded SRAM | 504 kbits true dual-port |
| Core Voltage | 1.2 V to 1.5 V |
| Supply Voltage Range | 1.14 V to 1.575 V |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration | Nonvolatile flash, Live-At-Power-Up (Level 0), single chip |
| Low Power Feature | Flash*Freeze technology |
| Température de fonctionnement | -40 C to +100 C (TJ), industrial (I) |
| Boîtier | 484-FPBGA (23 x 23 mm, 1 mm pitch, FBGA-484) |
| Type de montage | Surface Mount |
| Logic Family | CMOS |
| Packaging | Tray |
| Statut RoHS | RoHS3 Compliant |
Guide de configuration des broches du A3PE3000L-FGG484I 484-fpbga (23 x 23 mm, 1 mm pitch, fbga-484)
Configuration des broches du A3PE3000L-FGG484I (boîtier 484-fpbga (23 x 23 mm, 1 mm pitch, fbga-484)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE3000L-FGG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE3000L-FGG484I convient pour 6 applications: Industrial Automation and Control, Battery-Powered Portable Instrumentation, Secure Military and Avionics Subsystems, Communications Line-Card Glue Logic, ASIC Prototyping and Replacement, Medical Diagnostic Equipment.
Industrial Automation and Control
In factory automation, PLC I/O modules, motor-control interfaces, and machine-vision timing controllers, the A3PE3000L-FGG484I fits because its 3 million gates and 75,264 logic cells absorb glue logic, encoders/decoders, and soft-CPU wrappers while 341 user I/Os interface sensors and actuators directly. Its industrial -40 C to +100 C (TJ) rating survives harsh cabinet environments, and the nonvolatile flash fabric configures instantly at power-up - critical for safety interlocks that must be live before an operator reset cycle. Placed as the system's I/O hub between a host CPU and field wiring, it adds no configuration-boot delay unlike SRAM FPGAs, and Flash*Freeze can cut dynamic power during idle production shifts, reducing cabinet thermal load.
Recommandé
Battery-Powered Portable Instrumentation
Portable test instruments, handheld data loggers, and field measurement devices benefit directly from ProASIC3L's low static power and Flash*Freeze technology. The A3PE3000L-FGG484I's 1.2 V to 1.5 V core with 1.14 V to 1.575 V tolerance lets designers run the rail from a single-cell boost converter with wide droop, while flash switching elements draw negligible standby current versus SRAM-cell fabrics - extending sleep-battery life measurably. The 504 kbits of true dual-port SRAM buffers measurement data between the analog front end and the host MCU without external FIFO chips, cutting BOM count in space-constrained enclosures. When the instrument idles, Flash*Freeze freezes I/O and clock state, and the fabric resumes deterministically on wake, so no reconfiguration time is added to the measurement cycle.
Recommandé
Secure Military and Avionics Subsystems
Defense and avionics subsystems - secure communications boards, sensor hub processors, and bus interface controllers - select the A3PE3000L-FGG484I (and its M-suffix sibling A3PE3000L-FGG484M) for single-chip security: the configuration bitstream lives in nonvolatile on-chip flash with no external PROM to read back or spoof, per the Microchip ProASIC3L datasheet. The instant-on Live-At-Power-Up behavior matters for power-cycling payloads on aircraft where boot sequencing is constrained. With 3M gates, designers implement ARINC/MIL-STD-style protocol engines and redundancy voting logic, while the 484-ball 23 x 23 mm FBGA provides abundant 341-I/O for parallel legacy buses. Designers should verify program-flow and anti-fuse/flash security whitepapers from Microchip against their certification requirements.
Recommandé
Communications Line-Card Glue Logic
Networking line cards, backplane adapters, and telecom transport shelves use the A3PE3000L-FGG484I as high-pin-count glue logic between PHYs, framers, and the main processor. Its 341 user I/Os on the 484-ball FBGA handle wide parallel buses and multiple SPI/I2C/UART banks simultaneously, while 504 kbits of true dual-port SRAM implement rate-adaptation FIFOs crossing asynchronous clock domains. The flash fabric eliminates the configuration PROM that would otherwise occupy scarce line-card area and adds boot latency to hot-swap events - the FPGA is usable within the single-chip power-up sequence. Operating from a 1.5 V or 1.2 V core rail common on modern boards simplifies power-tree integration alongside DSPs and ASICs.
Recommandé
ASIC Prototyping and Replacement
The ProASIC3 family is positioned by Microchip/Microsemi as a cost-effective ASIC replacement, and the A3PE3000L-FGG484I at 3 million system gates is the family's high-density point for this role. Engineers migrate retired ASICs, gate arrays, or obsolete ASSPs onto the fabric: 75,264 VersaTiles absorb legacy RTL, and 504 kbits of dual-port SRAM replace embedded RAM macros. Because the flash fabric is single-chip and instant-on, the replacement reproduces the original ASIC's power-up behavior without firmware changes to the host board - a common requirement when repairing legacy medical or industrial equipment. Non-recurring cost is limited to Libero SoC design work and the PCB footprint already matching 484-ball FGG packages used across the ProASIC3 family.
Recommandé
Medical Diagnostic Equipment
Benchtop diagnostic analyzers, ultrasound front-end controllers, and patient-monitoring interface boards use the A3PE3000L-FGG484I where deterministic power-up and quiet, low-EMI operation matter. The flash FPGA produces no configuration readback traffic and no boot PROM switching activity, easing EMC design in sensitive analog front ends; its 1.2 V to 1.5 V core keeps internal supply noise low. With 341 I/Os it aggregates multiple sensor channels into timing-precise acquisition windows, and the embedded 504-kbit dual-port SRAM provides jitter-tolerant sample buffering. The industrial -40 C to +100 C rating covers cold-chain transport of equipment, while the single-chip configuration supports service-safe firmware updates managed by the host processor over JTAG.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE3000L-FGG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE3000L-FGG484 | A3PE3000L-1FGG484I | A3PE3000L-FG484I | A3PE3000-FGG484 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 484-FPBGA (23 x 23 mm) | 484-FPBGA - same | 484-FPBGA - same | 484-FPBGA (FG, lead balls) | 484-FPBGA - same |
| System Gates | 3000000 | 3000000 | 3000000 | 3000000 | 3000000 |
| User I/Os | 341 | 341 | 341 | 341 | 341 |
| Speed Grade | Standard | Standard | -1 (faster) | Standard | Standard |
| Flash*Freeze Low Power | Yes (ProASIC3L) | Yes | Yes | Yes | No (ProASIC3E) |
| RoHS / Green Balls | RoHS3 compliant (FGG) | Yes (FGG green) | Yes (FGG green) | No (FG lead balls) | Yes (FGG green) |
| Embedded SRAM | 504 kbits dual-port | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
Principaux différenciateurs
- Flash*Freeze low-power mode (vs A3PE3000-FGG484)
- Industrial temperature with RoHS green balls (vs A3PE3000L-FG484I)
- Timing-closure headroom available at same footprint (vs A3PE3000L-1FGG484I)
- Single-chip instant-on configuration (vs SRAM FPGAs (Xilinx Artix-7 class))
Notes de conception
The 484-ball 1 mm-pitch FBGA requires controlled fanout: plan an 8-layer or greater stackup with via-in-pad or dogbone escapes, and dedicate internal layers to a solid ground plane under the die area for I/O return currents. Assign I/O banks in Libero SoC before routing so that each bank's VCCI voltage matches the connected interface standard - mixing 3.3 V and 1.8 V I/O on one bank is the most common re-spin cause on ProASIC3 boards. Follow the Microchip ProASIC3L datasheet ball-map for bank boundaries.
Supply the core at 1.2 V to 1.5 V (1.14 V to 1.575 V tolerance) and sequence VCCI banks per the datasheet power-up requirements. Estimated: static power scales with utilization, so run Microchip's SmartPower estimator on your final netlist rather than trusting worst-case family numbers. Flash*Freeze entry/exit requires the dedicated flashfreeze pin handshake - pull it through a controlled GPIO, never a raw pull-up, and verify wake latency in simulation if your system expects sub-millisecond resume.
Do not confuse ordering suffixes: FGG484I is green/lead-free, FG484I contains lead balls, and -1 changes only speed grade. Second, the FGG484 package exposes 341 user I/Os, not the family-maximum 616 - reserve larger ballout (FGG896) only if your I/O budget exceeds 341. Third, mature ProASIC3L stock carries an 8-week factory lead time (per Microchip USA); qualify at least one drop-in sibling (e.g., A3PE3000L-1FGG484I) in your AVL to avoid single-source allocation stalls.
Informations de conformité
RoHS3 Compliant per Microchip USA product page. REACH, halogen-free, and conflict-minerals status not stated in retrieved data - confirm via Microchip compliance portal.
