A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
Référence : A3PE600-1FGG256I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $44.2 | $442,00 |
| 100 | $39.8 | $3 980,00 |
| 500 | $36.1 | $18 050,00 |
| 1 000 | $33.5 | $33 500,00 |
A3PE600-1FGG256I Présentation
A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory cells rather than volatile SRAM or an external configuration device. Within the programmable logic hierarchy, the A3PE600-1FGG256I sits as a mid-density member of the ProASIC3E flash FPGA family, below the A3PE1500 and A3PE3000, and belongs to the broader class of power management system components used for glue logic, control, and data-path integration.
Key differentiating features include single-chip, Live-at-Power-Up (Level 0) operation enabled by the 130-nm, 7-layer metal (6 copper) flash-based CMOS process, which removes the external boot PROM required by SRAM FPGAs and improves system security. The ProASIC3E fabric delivers system performance up to 272 MHz, abundant embedded SRAM, and reprogrammability without a configuration controller.
Architecturally, the device combines VersaTiles (fine-grained logic tiles) with embedded true dual-port SRAM blocks and a flexible I/O structure supporting multiple single-ended and differential standards. The FlashFreeze-style low-power characteristics of the flash fabric reduce static power compared with SRAM FPGA alternatives, and the 1.425 V to 1.575 V core supply range accommodates typical 1.5 V rail tolerance.
Typical applications include industrial automation control, communications line-card glue logic, medical instrumentation data-path bridging, aerospace/defense secure single-chip designs, and test-and-measurement subsystems where instant-on operation is required.
A key design consideration is supply sequencing: the 1.5 V core and I/O rails should ramp within datasheet limits, and BGA fanout on a 1.0 mm pitch requires via-in-pad or dog-bone escape routing on at least 6 signal layers.
This page synthesizes distributor pricing tiers, drop-in same-family alternatives, design guidance, and comparison data not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour A3PE600-1FGG256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE600-1FGG256I (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Process Technology, Operating Temperature, Reprogrammability.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE600-FGG256I
✅ Remplacement direct✓ En stock
$41.8 / unité
Voir la fiche technique →A3PE600-2FGG256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE600-2FGG256
✅ Remplacement direct✓ En stock
$33.15 / unité
Voir la fiche technique →A3PE600-FGG256
✅ Remplacement direct✓ En stock
$19.6 / unité
Voir la fiche technique →A3PE600-1FGG256YI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE600-1FGG256I Valeurs maximales et caractéristiques électriques
| System Gates | 600000 |
| Logic Cells | 13824 |
| Embedded SRAM | 110592 bits (up to 504 kbits family density) |
| User I/O | 165 |
| Maximum System Performance | 272 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | On-chip Flash (Live at Power-Up, Level 0) |
| Boîtier | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| Température de fonctionnement | -40C to +100C (TJ), industrial |
| Type de montage | Surface Mount |
| Logic Family | CMOS |
| Speed Grade | -1 |
| Family | ProASIC3E |
| Reprogrammability | Yes (single-chip, no external boot PROM) |
| Typical Application Domains | Industrial, communications, medical, aerospace/defense |
Guide de configuration des broches du A3PE600-1FGG256I 256-lbga (fbga-256), 1.0 mm ball pitch
Configuration des broches du A3PE600-1FGG256I (boîtier 256-lbga (fbga-256), 1.0 mm ball pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE600-1FGG256I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE600-1FGG256I convient pour 6 applications: Industrial Automation Control, Communications Line-Card Glue Logic, Medical Instrumentation Data-Path Bridging, Aerospace and Defense Secure Single-Chip Designs, Test and Measurement Subsystems, Battery-Powered Portable Systems.
Industrial Automation Control
The A3PE600-1FGG256I fits industrial automation controllers because its 600K system gates and 165 user I/Os absorb motor-control sequencing, safety interlock logic, and sensor aggregation that would otherwise need several discrete devices. Its flash configuration delivers Live-at-Power-Up Level 0 operation, so control outputs are valid within microseconds of applying the 1.5 V core rail - important for machinery that must not float in an undefined state during boot. The -40C to +100C industrial junction rating covers unconditioned cabinet environments, and the single-chip flash fabric eliminates the external configuration PROM that adds cost and boot delay in SRAM FPGA designs. Placed between PLC backplane transceivers and local motor drivers, the 272 MHz-class fabric handles PWM generation and quadrature decoding deterministically, while 110592 bits of embedded true dual-port SRAM buffer sensor histories and parameter tables without external memory.
Recommandé
Communications Line-Card Glue Logic
In networking and telecom line cards, the A3PE600-1FGG256I serves as glue logic between PHYs, MACs, and backplane connectors, where its 165 I/Os mapped across independently powered banks accommodate mixed-voltage interfaces on a single device. The 600K-gate ProASIC3E fabric implements address decoding, interrupt aggregation, and status multiplexing at deterministic latency, and 110592 bits of true dual-port SRAM implement FIFOs between clock domains without external SRAM parts. Because configuration resides in on-chip flash, the card is link-ready immediately at power application - valuable in redundant systems where a failed blade must recover within milliseconds of hot-swap insertion. The 1.5 V core rail (1.425-1.575 V) integrates directly into standard telecom power trees, and the 1.0 mm pitch 256-ball LBGA supports the dense, high-layer-count fanout typical of line-card PCBs.
Recommandé
Medical Instrumentation Data-Path Bridging
Medical diagnostic instruments benefit from the A3PE600-1FGG256I's combination of instant-on flash configuration and deterministic fabric: patient-facing subsystems such as ultrasound front-ends, blood-analysis readers, and patient-monitor bridges require logic that is operational before an operator can initiate a scan. The 600K system gates and 13824 logic cells implement trigger generation, ADC framing, and filter pre-processing, while 110592 bits of embedded dual-port SRAM stage sample streams toward a host processor. Its quiet flash fabric avoids the configuration-bitstream emissions of SRAM devices, an advantage in sensitive analog front-ends. The -1 speed grade comfortably meets the sub-100 MHz clocking typical of acquisition paths, and the industrial temperature rating suits benchtop instruments with wide ambient swings. Board designers should partition the 165 I/Os so that analog-adjacent banks switch at the lowest feasible I/O voltage to minimize coupling into the measurement chain.
Recommandé
Aerospace and Defense Secure Single-Chip Designs
The A3PE600-1FGG256I is a natural fit for aerospace and defense systems because its on-chip flash configuration keeps the bitstream stored inside the die, eliminating the external configuration read that exposes SRAM FPGAs to interception, and requiring no boot PROM on reliability-critical boards. The 600K-gate fabric implements bus interfaces, telemetry framing, and custom protocol engines, and the device is live at power-up (Live-at-Power-Up Level 0), which matters for payload systems that must act within milliseconds of launcher power application. The -40C to +100C industrial junction range covers many avionics bays, and Microchip offers defense-supply flow options in the same ProASIC3E family for programs needing extended screening. Designs should use Libero's security features to lock programming interfaces and should derate timing at the -1 speed grade across the full temperature corner.
Recommandé
Test and Measurement Subsystems
Bench instruments, automated test equipment, and protocol analyzers use the A3PE600-1FGG256I for channel sequencing, trigger logic, and interface conversion. The 272 MHz-class fabric supports fine-grained timing generation for stimulu channels, and 165 user I/Os provide the parallel pin count required to probe or drive multi-channel targets, partitioned across I/O banks with independently selectable standards. Embedded true dual-port SRAM (110592 bits in this density) implements capture buffers and pattern memory without adding external SRAM access latency. Flash-based Live-at-Power-Up operation means the instrument is measurement-ready at power-on without a multi-second configuration load, improving test throughput in production environments. Designers should place the 1.0 mm pitch BGA on at least six signal layers with via-in-pad escape for the dense I/O rings, and should enforce a clean 1.5 V core plane to keep clock jitter within timing closure budgets for high-rate capture paths.
Recommandé
Battery-Powered Portable Systems
Portable and battery-backed equipment gains from the ProASIC3E flash fabric's low static power characteristics compared with SRAM FPGAs of similar density, which carry configuration-leakage and bitstream-hold current. The A3PE600-1FGG256I's 1.5 V core rail (1.425-1.575 V) supports efficient point-of-load regulation from a single-cell stack, and the single-chip architecture removes the configuration device that consumes board area in compact enclosures. Applications include handheld test tools, portable medical monitors, and rugged field controllers, where the -40C to +100C industrial rating tolerates storage and cold-start extremes. The 600K-gate fabric and 110592 bits of embedded SRAM handle sensor fusion, display refresh pipelines, and power-sequencing state machines. For maximum battery life, gate all high-rate clocks when idle, drive unused I/Os to static levels per Microchip power guidelines, and reserve the -1 speed grade, whose slower-class timing reduces dynamic switching energy relative to faster grades.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE600-1FGG256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE600-FGG256I | A3PE600-2FGG256I | A3PE600-2FGG256 | A3PE600-FGG256 | A3PE600-1FGG256YI |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FBGA-256), 1.0 mm pitch | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-ball S-PBGA-B256, 1.0 mm pitch - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/O | 165 | 165 | 165 | 165 | 165 | 165 |
| Embedded SRAM | 110592 bits | 110592 bits | 110592 bits | 110592 bits | 110592 bits | 110592 bits |
| Speed Grade | -1 | base ordering grade | -2 (faster) | -2 (faster) | base ordering grade | -1 class |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | Commercial (0C to +85C class) | Commercial (0C to +85C class) | -40C to +100C (industrial, YI suffix) |
| Configuration Memory | On-chip flash, Live-at-Power-Up Level 0 | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Principaux différenciateurs
- Single-chip flash configuration, no external boot PROM (vs SRAM FPGAs of similar density)
- Faster timing available without PCB change (vs A3PE600-1FGG256I self vs A3PE600-2FGG256I)
- Industrial temperature coverage (vs A3PE600-FGG256 (commercial))
Notes de conception
The 256-ball LBGA at 1.0 mm pitch requires a deliberate fanout strategy: plan dog-bone escape routing on outer rows and via-in-pad for interior balls, and allocate at least 6 signal layers for a design using most of the 165 I/Os. Follow the manufacturer's land-pattern recommendation for ball diameter and mask opening, and keep the BGA escape pattern symmetric to reduce reflow tombstoning risk. Verify non-solder-mask-defined (NSMD) pads against the ProASIC3E datasheet mechanical drawing before fab release.
Supply the core rail at 1.5 V with the permitted 1.425-1.575 V window per the ProASIC3E datasheet. Use a dedicated point-of-load regulator with local bulk plus high-frequency ceramic decoupling at each VCC ball group, and keep the core plane solid and unbroken under the device. I/O banks must be powered per the standards assigned in Libero; power only the banks actually used, and sequence I/O rails so no bank sees voltage through clamp paths before its own rail is established.
Do not substitute a commercial-temperature A3PE600-FGG256 or A3PE600-2FGG256 into an industrial application rated below 0C - the suffix conventions matter (I = industrial, YI = industrial fine-pitch variant). Also, when moving between -1 and -2 speed grades, re-run static timing analysis in Microchip Libero and regenerate programming files; pin-compatible does not mean timing-identical. Finally, lock the flash security fuses in production to protect the on-chip bitstream.
Informations de conformité
Compliance status not stated in the retrieved distributor snippets; verify RoHS/REACH declarations on the Microchip product page before procurement.
