A3PE600-FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
Référence : A3PE600-FG484 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $89 | $89,00 |
| 10 | $82.5 | $825,00 |
| 100 | $74 | $7 400,00 |
| 500 | $66.5 | $33 250,00 |
| 1 000 | $59 | $59 000,00 |
A3PE600-FG484 Présentation
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash cells rather than SRAM. Unlike SRAM FPGAs, flash FPGAs power up instantly with no external configuration PROM, simplify system bring-up, and provide inherent protection against cloning and bitstream tampering. Within the power-management hierarchy of programmable logic, the ProASIC3E family sits alongside Microchip's Igloo (low-power) and Fusion (mixed-signal) families, all built on the same flash switch fabric.
Key features include 13824 versatile logic cells (CLBs), 600K system gates, support for soft ARM processors, abundant embedded block RAM, up to 270 single-ended user I/Os with support for common I/O standards, and footprint compatibility between FG256 and FG484 packages, allowing migration across the ProASIC3E family on the same PCB.
The A3PE600 architecture uses a Sea-of-Gates flash fabric with routing switches programmed by flash cells, delivering deterministic timing and 231 MHz system performance in a 1.5V core with 3.3V auxiliary supply. Nonvolatile configuration eliminates the boot delay and the external flash of SRAM-based alternatives, and Flash*Freeze-style low-power modes (in the L variants) complement the family for power-sensitive systems.
Typical applications include industrial automation control, networking and communications line cards, avionics and defense electronics requiring single-chip secure configuration, test and measurement instrumentation, and cost-effective ASIC replacement in consumer and computing platforms.
A key design consideration: ensure power sequencing-free simplicity is exploited, but verify I/O banking and VREF placement when using voltage-referenced I/O standards, assigning one VREF pin per minibank.
This page synthesizes distributor pricing context, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour A3PE600-FG484 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE600-FG484 (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Operating Temperature, Family, System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE600-FGG484
✅ Remplacement direct✓ En stock
$53.7 / unité
Voir la fiche technique →A3PE600-FG484I
✅ Remplacement direct✓ En stock
$86.1 / unité
Voir la fiche technique →A3PE600-FGG484I
✅ Remplacement direct✓ En stock
$44.03 / unité
Voir la fiche technique →A3PE600L-FG484M
✅ Remplacement direct✓ En stock
$44.9 / unité
Voir la fiche technique →A3PE600L-FGG484M
✅ Remplacement direct✓ En stock
$79.9 / unité
Voir la fiche technique →A3PE600-FG484 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 600000 |
| Logic Cells (CLBs) | 13824 |
| User I/Os | 270 |
| Embedded Memory | 110592 |
| Maximum System Frequency | 231 MHz |
| Core Voltage | 1.5 V |
| Technology | 130 nm CMOS flash |
| Boîtier | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) |
| Package Height | 2.23 mm |
| Type de montage | Surface Mount |
| Configuration | Nonvolatile flash (single-chip, no external configuration PROM) |
| Package Footprint Compatibility | FG256 and FG484 footprint-compatible |
| Soft Processor Support | Soft ARM support |
| Packaging | Tray |
Guide de configuration des broches du A3PE600-FG484 fg256 and fg484 footprint-compatible
Configuration des broches du A3PE600-FG484 (boîtier fg256 and fg484 footprint-compatible). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE600-FG484.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE600-FG484 convient pour 6 applications: Industrial Automation Control, Networking and Communications, Avionics and Defense Electronics, Test and Measurement Instrumentation, ASIC Replacement and Prototyping, Secure Embedded Systems and IoT Gateways.
Industrial Automation Control
In factory automation controllers, motor drive sequencing, and I/O concentrators, the A3PE600-FG484 integrates glue logic, state machines, and bus bridging into one 600K-gate flash FPGA. Its nonvolatile configuration means the controller powers up functional within milliseconds - no configuration PROM or microprocessor boot handshake - improving line-start reliability. The 270 user I/Os accommodate dense industrial I/O banks at 3.3V and other common standards, while 231 MHz system performance handles multi-axis coordination. Flash storage of the bitstream also resists tampering of proprietary control IP on the plant floor.
Recommandé
Networking and Communications
Line cards, switch fabric bridges, and protocol converters benefit from the A3PE600-FG484's combination of 13824 logic cells and 110592 bits of embedded block RAM for FIFOs, packet buffers, and CAM-style lookup structures. At 231 MHz, the fabric supports common 8-bit/16-bit parallel interfaces and bridging logic between MACs, PHYs, and backplanes. Because the ProASIC3E configures from on-chip flash, network equipment recovers instantly after power events without reconfiguration servers, an advantage for unattended telecom cabinets and remote access nodes deployed across dispersed sites.
Recommandé
Avionics and Defense Electronics
Avionics subsystems value the ProASIC3E's single-chip nonvolatile configuration and proven security features: the bitstream never leaves the device, reducing supply-chain tampering risk. The A3PE600-FG484's 600K gates implement MIL-STD-style bus interfaces, ARINC-style data formatting, and sensor aggregation in one device. Industrial-grade A3PE600-FGG484I equivalents extend temperature range for cockpit-adjacent or external pods. Flash FPGA determinism (no configuration error window during power-up) simplifies DO-relevant safety analyses for load management, display drivers, and mission-data recorders.
Recommandé
Test and Measurement Instrumentation
Bench and automated test equipment use the A3PE600-FG484 for timing generators, bus emulators, and trigger fan-out logic. The 231 MHz fabric timing supports sub-10ns event resolution, and 270 user I/Os allow one FPGA to interface with multiple instrument front-ends simultaneously. Instant-on flash configuration means instruments are ready the moment power is applied - valuable for production test stations cycling power between DUTs. FG256/FG484 footprint compatibility lets instrument OEMs scale designs across the ProASIC3E family without PCB respins as channel counts grow.
Recommandé
ASIC Replacement and Prototyping
The ProASIC3E family is explicitly positioned by Microchip as a cost-effective ASIC replacement for consumer, computing, and communications markets. Designers prototype ASIC control logic on the A3PE600-FG484's 13824-cell fabric, then either ship the FPGA directly in low/medium volumes or use the validated design as an ASIC handoff artifact. Nonvolatile flash eliminates the FPGA configuration flash that would otherwise duplicate ROM/OTP in ASIC-like products, cutting BOM cost. 130nm flash technology delivers stable, deterministic timing without the configuration-time variability of SRAM alternatives.
Recommandé
Secure Embedded Systems and IoT Gateways
Embedded gateways and secure edge devices use the A3PE600-FG484 as a cryptographic bridge, secure boot manager, or sensor-fusion controller. ProASIC3E flash fabric provides protection against design theft: configuration resides on-chip, so competitors cannot intercept bitstreams during board programming. The device implements soft ARM processor support, allowing a small control CPU plus custom accelerators in one chip. Designers preferring lower static power in battery-assisted nodes can drop in the A3PE600L-FGG484M, which adds Flash*Freeze instantaneous static mode on the identical PCB footprint.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE600-FG484 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE600-FGG484 | A3PE600-FGG484I | A3PE600-FG484I | A3PE600L-FG484M |
|---|---|---|---|---|---|
| Package | FBGA-484 (23 x 23 mm) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| User I/Os | 270 | 270 | 270 | 270 | 270 |
| Max System Frequency | 231 MHz | 231 MHz | 231 MHz | 231 MHz | 231 MHz |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V - 1.5 V |
| Temperature Grade | Commercial | Commercial (RoHS pkg) | Industrial | Industrial | Industrial (M grade) |
| Low-Power Flash*Freeze Mode | No | No | No | No | Yes |
Principaux différenciateurs
- Nonvolatile flash configuration - true single-chip solution (vs SRAM FPGAs (Xilinx/Intel equivalents))
- Low-power Flash*Freeze option within the same footprint (vs A3PE600L-FG484M)
- RoHS-compliant package option available (vs A3PE600-FGG484)
Notes de conception
Supply the A3PE600-FG484 with a 1.5V core rail and 3.3V auxiliary/I/O rail per the ProASIC3E power architecture in the manufacturer datasheet. Because configuration is nonvolatile, there is no configuration-current surge at power-up, simplifying regulator sizing versus SRAM FPGAs. Nonetheless, decouple each supply ball pair with 0.1uF ceramics placed within 2 mm of the balls, plus bulk 10uF-22uF per rail. Verify core current against your post-place-and-route power estimate in Libero rather than worst-case table values.
The FG484 uses a 1.0 mm ball pitch and 23 x 23 mm body, requiring a standard 484-ball BGA land pattern with via-in-pad or dogbone fanout on at least 0.8 mm channel width; plan for 4+ PCB layers to break out 270 user I/Os. Per the datasheet, FG256 and FG484 packages are footprint-compatible, so designing the FG484 footprint allows future migration to FG256-family members. When using voltage-referenced I/O standards, assign one VREF pin per minibank as required.
A frequent error is ordering the plain FG484 for RoHS-mandated production: in ProASIC3E ordering codes the 'G' denotes RoHS-compliant packaging, so lead-free builds require A3PE600-FGG484 (or FGG484I). Another pitfall is treating higher-density ProASIC3E parts (A3PE1500/A3PE3000) as drop-ins; densities differ far beyond 30% and timing closure must be redone. Finally, recompile the design in Libero SoC and re-verify I/O assignment and timing whenever swapping speed/temperature grade variants.
Informations de conformité
Per manufacturer datasheet notes, the 'G' in ProASIC3E ordering codes indicates RoHS-compliant packages; the base A3PE600-FG484 lacks 'G', so specify A3PE600-FGG484/FGG484I for RoHS builds. Other compliance statuses not found in provided data.
