AFS600-1FG256K vs M7AFS600-FGG256 Comparaison
Comparaison détaillée côte à côte de AFS600-1FG256K par Microchip Technology et M7AFS600-FGG256 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256K ✓ ActifMicrochip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ ActifComparaison des spécifications
| Paramètre | AFS600-1FG256K | M7AFS600-FGG256 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Device Type | Fusion mixed-signal field-programmable gate array (FPGA) | — |
| Programmable Logic | Flash-based programmable logic | — |
| Equivalent System Gates | 600,000 gates | — |
| Logic Cells | 13,824 logic cells | — |
| User I/O | 119 I/O | 119 |
| Maximum Frequency | 1282.05 MHz | 1098.9 MHz (distributor listing) |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Integrated Analog | Configurable analog resources | — |
| Embedded Memory | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | — |
| Boîtier | 256-terminal plastic ball grid array (256-LBGA) | 256-LBGA / 256-FBGA |
| Terminal Count | 256 terminals | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.00 mm | — |
| Package Dimensions | 17 mm x 17 mm | — |
| Type de montage | Surface mount | Surface Mount |
| Ordering Package Option | Tray | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Family | — | Fusion (M7AFS600) |
| System Gates | — | 600K |
| Flip-Flops | — | 110592 |
| Embedded Processor | — | ARM CoreMP7 |
| Process Technology | — | 130 nm flash-based |
| Ball Pitch | — | 1 mm |
| Configuration Memory | — | Flash (single-chip, non-volatile) |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| Température de fonctionnement | — | [DATA_NEEDED: Operating Temperature Range] |
| Packaging | — | Tray |
| Niveau MSL | — | [DATA_NEEDED: Moisture Sensitivity Level] |