AFS600-1FG256K vs M7AFS600-FGG256 Vergleich
Detaillierter Direktvergleich von AFS600-1FG256K von Microchip Technology und M7AFS600-FGG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip
AFS600-1FG256K ✓ AktivMicrochip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ AktivSpezifikationsvergleich
| Parameter | AFS600-1FG256K | M7AFS600-FGG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Device Type | Fusion mixed-signal field-programmable gate array (FPGA) | — |
| Programmable Logic | Flash-based programmable logic | — |
| Equivalent System Gates | 600,000 gates | — |
| Logic Cells | 13,824 logic cells | — |
| User I/O | 119 I/O | 119 |
| Maximum Frequency | 1282.05 MHz | 1098.9 MHz (distributor listing) |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Integrated Analog | Configurable analog resources | — |
| Embedded Memory | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | — |
| Gehäuse | 256-terminal plastic ball grid array (256-LBGA) | 256-LBGA / 256-FBGA |
| Terminal Count | 256 terminals | — |
| Package Shape | Square | — |
| Terminal Pitch | 1.00 mm | — |
| Package Dimensions | 17 mm x 17 mm | — |
| Montageart | Surface mount | Surface Mount |
| Ordering Package Option | Tray | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Family | — | Fusion (M7AFS600) |
| System Gates | — | 600K |
| Flip-Flops | — | 110592 |
| Embedded Processor | — | ARM CoreMP7 |
| Process Technology | — | 130 nm flash-based |
| Ball Pitch | — | 1 mm |
| Configuration Memory | — | Flash (single-chip, non-volatile) |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| Betriebstemperatur | — | [DATA_NEEDED: Operating Temperature Range] |
| Packaging | — | Tray |
| MSL-Level | — | [DATA_NEEDED: Moisture Sensitivity Level] |