AFS600-1FG256K vs M7AFS600-FGG256 Comparação

Comparação detalhada lado a lado de AFS600-1FG256K por Microchip Technology e M7AFS600-FGG256 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
AFS600-1FG256K AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip

AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip

AFS600-1FG256K ✓ Ativo
Microchip Technology
M7AFS600-FGG256 M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip

M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip

M7AFS600-FGG256 ✓ Ativo

Comparação de especificações

Parâmetro AFS600-1FG256K M7AFS600-FGG256
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Device Type Fusion mixed-signal field-programmable gate array (FPGA) —
Programmable Logic Flash-based programmable logic —
Equivalent System Gates 600,000 gates —
Logic Cells 13,824 logic cells —
User I/O 119 I/O 119
Maximum Frequency 1282.05 MHz 1098.9 MHz (distributor listing)
Core Supply Voltage 1.5 V 1.5 V
Integrated Analog Configurable analog resources —
Embedded Memory Large flash memory blocks —
Clock Management Comprehensive clock generation and management circuitry —
Encapsulamento 256-terminal plastic ball grid array (256-LBGA) 256-LBGA / 256-FBGA
Terminal Count 256 terminals —
Package Shape Square —
Terminal Pitch 1.00 mm —
Package Dimensions 17 mm x 17 mm —
Tipo de montagem Surface mount Surface Mount
Ordering Package Option Tray —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS Status]
REACH Status [DATA_NEEDED: REACH status] —
Faixa de temperatura de operação [DATA_NEEDED: operating temperature range] —
Family — Fusion (M7AFS600)
System Gates — 600K
Flip-Flops — 110592
Embedded Processor — ARM CoreMP7
Process Technology — 130 nm flash-based
Ball Pitch — 1 mm
Configuration Memory — Flash (single-chip, non-volatile)
Analog Features — Integrated configurable analog blocks, clock generation and management
Temperatura de operação — [DATA_NEEDED: Operating Temperature Range]
Packaging — Tray
Nível MSL — [DATA_NEEDED: Moisture Sensitivity Level]

Fichas técnicas e recursos

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