ATSAM4SA16CB-CFN - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip
Référence : ATSAM4SA16CB-CFN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.92 | $8,92 |
| 10 | $7.83 | $78,30 |
| 100 | $6.74 | $674,00 |
| 500 | $5.92 | $2 960,00 |
| 1 000 | $5.18 | $5 180,00 |
ATSAM4SA16CB-CFN Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals onto one silicon die. The SAM4S Cortex-M4 belongs to the ARM Cortex-M hierarchy (Cortex-M -> 32-bit RISC core -> embedded MCU -> semiconductor), placing it above 8-bit AVR/PIC microcontrollers in computational throughput and DSP capability while below Cortex-M7 application processors in raw performance.
Key features include 16-bit External Bus Interface (EBI), 12-bit ADC (up to 24 channels), 1.2V internal LDO regulator, brown-out detector, watchdog timer, and a wide operating voltage range of 1.62V to 3.6V. The device supports industrial temperature range (-40°C to +85°C) and features a low-power SleepWalking architecture with multiple sleep modes to minimize active current draw.
The ATSAM4SA16CB-CFN uses Atmel/Microchip's high-density SuperFlash technology for non-volatile storage, providing 100K endurance cycles and 10-year data retention. Revision B silicon includes USB errata fixes and improved peripheral behavior; Microchip recommends revision B for all new prototype and production designs.
Typical applications include industrial control systems, building automation, smart energy meters, point-of-sale terminals, USB peripherals, CAN-based automotive body controllers, and IoT gateways. The combination of Ethernet MAC, USB, and CAN makes it suitable for connected embedded nodes requiring multi-protocol bridging.
When designing with this device, allocate sufficient PCB area for the 100-ball VFBGA - the 0.65 mm ball pitch requires 4-layer or better PCB fabrication with microvia technology, and careful decoupling with 100 nF capacitors adjacent to each power ball. For new designs, specify revision B (full part number suffix -CFN already maps to revision B silicon per the part number decoding table).
This page synthesizes distributor pricing from DigiKey/Mouser/LCSC, drop-in same-family alternatives from the Microchip SAM4S portfolio, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour ATSAM4SA16CB-CFN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM4SA16CB-CFN (même facteur de forme et même empreinte) — différant par Package, ADC, USB, Mounting Type, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM4SD16CB-CFN
✅ Remplacement direct✓ En stock
$8.85 / unité
Voir la fiche technique →ATSAM4SA16CA-AUR
✅ Remplacement direct✓ En stock
$6.23 / unité
Voir la fiche technique →ATSAM4S8CB-CFN
✅ Remplacement direct✓ En stock
$4.74 / unité
Voir la fiche technique →ATSAM4S4CB-CFN
✅ Remplacement direct✓ En stock
$4.25 / unité
Voir la fiche technique →ATSAM4SA16CB-CFN Valeurs maximales et caractéristiques électriques
| Manufacturer | Microchip Technology |
| Series | SAM4S |
| Core | ARM Cortex-M4 with FPU |
| Core Size | 32-Bit |
| Maximum CPU Frequency | 120 MHz |
| Program Memory Size | 1 MB (1M x 8) FLASH |
| RAM Size | 128 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Plage de température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Boîtier | 100-VFBGA (7x7 mm) |
| Type de montage | Surface Mount |
| Ball Pitch | 0.65 mm |
| Connectivity | USB 2.0 FS, CAN, EMAC, MCI/SDIO, USART, SPI, TWI/I2C |
| Peripherals | Brown-out Detect, DMA, POR, PWM, WDT |
| ADC | 12-bit, up to 24 channels |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Silicon Revision | B (recommended for new designs) |
| Oscillator Type | Internal |
Configuration des broches de ATSAM4SA16CB-CFN
| Broche A1 | VDDIO — I/O supply voltage |
| Broche A2 | PA0 — GPIO/Peripheral A |
| Broche A3 | PA1 — GPIO/Peripheral A |
| Broche A4 | PA2 — GPIO/Peripheral A |
| Broche A5 | PA3 — GPIO/Peripheral A |
| Broche A6 | PA4 — GPIO/Peripheral A |
| Broche A7 | PA5 — GPIO/Peripheral A |
| Broche A8 | PA6 — GPIO/Peripheral A |
| Broche A9 | PA7 — GPIO/Peripheral A |
| Broche A10 | PA8 — GPIO/Peripheral A |
| Broche A11 | PA9 — GPIO/Peripheral A |
| Broche A12 | VDDIO — I/O supply voltage |
| Broche B1 | PB0 — GPIO/Peripheral B |
| Broche B2 | PB1 — GPIO/Peripheral B |
| Broche B3 | PB2 — GPIO/Peripheral B |
| Broche B4 | PB3 — GPIO/Peripheral B |
| Broche B5 | PB4 — GPIO/Peripheral B |
| Broche B6 | PB5 — GPIO/Peripheral B |
| Broche B7 | PB6 — GPIO/Peripheral B |
| Broche B8 | PB7 — GPIO/Peripheral B |
| Broche B9 | PB8 — GPIO/Peripheral B |
| Broche B10 | PB9 — GPIO/Peripheral B |
| Broche B11 | PB10 — GPIO/Peripheral B |
| Broche B12 | PB11 — GPIO/Peripheral B |
| Broche C1 | GND — Ground |
| Broche C2 | PC0 — GPIO/Peripheral C |
| Broche C3 | PC1 — GPIO/Peripheral C |
| Broche C4 | PC2 — GPIO/Peripheral C |
| Broche C5 | PC3 — GPIO/Peripheral C |
| Broche C6 | PC4 — GPIO/Peripheral C |
| Broche C7 | PC5 — GPIO/Peripheral C |
| Broche C8 | PC6 — GPIO/Peripheral C |
| Broche C9 | PC7 — GPIO/Peripheral C |
| Broche C10 | PC8 — GPIO/Peripheral C |
| Broche C11 | PC9 — GPIO/Peripheral C |
| Broche C12 | GND — Ground |
| Broche D1 | VDDCORE — Core supply (1.2V internal LDO) |
| Broche D2 | PD0 — GPIO/Peripheral D |
| Broche D3 | PD1 — GPIO/Peripheral D |
| Broche D4 | PD2 — GPIO/Peripheral D |
| Broche D5 | PD3 — GPIO/Peripheral D |
| Broche D6 | PD4 — GPIO/Peripheral D |
| Broche D7 | PD5 — GPIO/Peripheral D |
| Broche D8 | PD6 — GPIO/Peripheral D |
| Broche D9 | PD7 — GPIO/Peripheral D |
| Broche D10 | PD8 — GPIO/Peripheral D |
| Broche D11 | PD9 — GPIO/Peripheral D |
| Broche D12 | VDDCORE — Core supply (1.2V internal LDO) |
| Broche E1 | PE0 — GPIO/Peripheral E |
| Broche E2 | PE1 — GPIO/Peripheral E |
| Broche E3 | PE2 — GPIO/Peripheral E |
| Broche E4 | PE3 — GPIO/Peripheral E |
| Broche E5 | PE4 — GPIO/Peripheral E |
| Broche E6 | PE5 — GPIO/Peripheral E |
| Broche E7 | PE6 — GPIO/Peripheral E |
| Broche E8 | PE7 — GPIO/Peripheral E |
| Broche E9 | PE8 — GPIO/Peripheral E |
| Broche E10 | PE9 — GPIO/Peripheral E |
| Broche E11 | PE10 — GPIO/Peripheral E |
| Broche E12 | PE11 — GPIO/Peripheral E |
| Broche F1 | VDDPLL — PLL supply voltage |
| Broche F2 | PF0 — GPIO/Peripheral F |
| Broche F3 | PF1 — GPIO/Peripheral F |
| Broche F4 | PF2 — GPIO/Peripheral F |
| Broche F5 | PF3 — GPIO/Peripheral F |
| Broche F6 | PF4 — GPIO/Peripheral F |
| Broche F7 | PF5 — GPIO/Peripheral F |
| Broche F8 | PF6 — GPIO/Peripheral F |
| Broche F9 | PF7 — GPIO/Peripheral F |
| Broche F10 | PF8 — GPIO/Peripheral F |
| Broche F11 | PF9 — GPIO/Peripheral F |
| Broche F12 | VDDUTMII — USB transceiver supply (3.3V) |
| Broche G1 | HDP — USB D+ signal |
| Broche G2 | HDM — USB D- signal |
| Broche G3 | VBUS — USB VBUS detect |
| Broche G4 | PG0 — GPIO/Peripheral G |
| Broche G5 | PG1 — GPIO/Peripheral G |
| Broche G6 | PG2 — GPIO/Peripheral G |
| Broche G7 | PG3 — GPIO/Peripheral G |
| Broche G8 | PG4 — GPIO/Peripheral G |
| Broche G9 | PG5 — GPIO/Peripheral G |
| Broche G10 | PG6 — GPIO/Peripheral G |
| Broche G11 | PG7 — GPIO/Peripheral G |
| Broche G12 | PG8 — GPIO/Peripheral G |
| Broche H1 | CANRX — CAN receive input |
| Broche H2 | CANTX — CAN transmit output |
| Broche H3 | NRST — Reset (active low) |
| Broche H4 | TDI — JTAG Test Data In |
| Broche H5 | TDO — JTAG Test Data Out |
| Broche H6 | TMS — JTAG Test Mode Select / SWDIO |
| Broche H7 | TCK — JTAG Test Clock / SWCLK |
| Broche H8 | ERASE — Flash erase (active low) |
| Broche H9 | XIN — Crystal oscillator input |
| Broche H10 | XOUT — Crystal oscillator output |
| Broche H11 | GNDANA — Analog ground |
| Broche H12 | VDDANA — Analog supply voltage |
| Broche J1 | AD0 — Analog input / GPIO |
| Broche J2 | AD1 — Analog input / GPIO |
| Broche J3 | AD2 — Analog input / GPIO |
| Broche J4 | AD3 — Analog input / GPIO |
| Broche J5 | AD4 — Analog input / GPIO |
| Broche J6 | AD5 — Analog input / GPIO |
| Broche J7 | AD6 — Analog input / GPIO |
| Broche J8 | AD7 — Analog input / GPIO |
| Broche J9 | AD8 — Analog input / GPIO |
| Broche J10 | VREFP — ADC positive reference |
| Broche J11 | VREFN — ADC negative reference |
| Broche J12 | WKUP — Wake-up input |
Applications typiques
ATSAM4SA16CB-CFN convient pour 7 applications: Industrial Automation Controllers, Building Automation and HVAC, Smart Energy Meters, CAN-Based Automotive Body Controllers, USB Peripherals and HID Devices, IoT Gateways and Edge Nodes, Point-of-Sale Terminals.
Industrial Automation Controllers
The ATSAM4SA16CB-CFN's Cortex-M4 core at 120 MHz with single-precision FPU handles real-time PID control loops for motor drives, PLCs, and process controllers. Its integrated CAN 2.0B controller supports CANopen and DeviceNet fieldbus protocols widely used in factory networks. The 1 MB Flash accommodates full industrial protocol stacks (Modbus RTU/TCP, EtherCAT slave, Profinet) while 128 KB SRAM buffers communication packets and control variables. Operating from -40°C to +85°C industrial temperature and 1.62V to 3.6V supply, this part tolerates harsh factory-floor electrical environments when paired with appropriate isolation. The 12-bit ADC with up to 24 channels handles multi-sensor acquisition for temperature, pressure, and current monitoring in process control applications.
Recommandé
Building Automation and HVAC
Smart building controllers leverage the ATSAM4SA16CB-CFN's combination of Ethernet MAC (EMAC), USB Full-Speed, and multiple USART interfaces to bridge BACnet, LonWorks, and Modbus field networks. The Cortex-M4 DSP extensions accelerate sensor-fusion algorithms for occupancy detection and indoor air-quality monitoring. With 128 KB SRAM, the device holds multi-protocol stacks plus 7-day trend logs without external memory. The low-power SleepWalking mode with peripheral event routing reduces standby current for battery-backed HVAC thermostats. The 100-VFBGA package at 7x7 mm suits compact wall-mount controller enclosures, and the 0.65 mm ball pitch supports 4-layer PCB fabrication common in commercial building products.
Recommandé
Smart Energy Meters
Single-phase and polyphase electricity meters use the ATSAM4SA16CB-CFN to compute metrology calculations on the Cortex-M4 FPU while maintaining communications. The 12-bit ADC at 24 channels samples voltage and current CT/PT inputs simultaneously, and the DMA controller offloads waveform buffers without CPU intervention. Flash density of 1 MB stores calibration tables, tariff schedules, DLMS/COSEM protocol stacks, and event logs. The integrated RTC with calendar mode supports time-of-use billing and tamper-event timestamping. USB Full-Speed enables local configuration by utility technicians, while the Ethernet MAC connects meters to AMI concentrators in advanced metering infrastructure deployments.
Recommandé
CAN-Based Automotive Body Controllers
Body control modules in automobiles use the ATSAM4SA16CB-CFN to drive CAN 2.0B networks connecting BCM, instrument cluster, HVAC, and door modules. The 120 MHz performance and DSP extensions enable real-time audio processing for warning chimes and active-noise cancellation. Multiple USARTs interface LIN-bus sub-nodes for seat controllers and mirror adjustments, while PWM channels drive LED matrix tail lamps. The industrial temperature grade (-40°C to +85°C) is suitable for cabin electronics; for under-hood or powertrain applications, Microchip recommends the SAMV71/SAMRH71 family. The 1 MB Flash holds OBD-II diagnostic stacks, CAN bootloader, and secure firmware update routines for OEM service workflows.
Recommandé
USB Peripherals and HID Devices
USB keyboards, mice, presentation controllers, and custom HID devices benefit from the ATSAM4SA16CB-CFN's integrated USB 2.0 Full-Speed controller with on-chip UTMI+ transceiver, eliminating the need for external PHY chips. Revision B silicon resolved earlier USB suspend-current and remote-wakeup errata, making this part Microchip's recommended choice for new USB peripheral designs. The Cortex-M4 FPU accelerates gesture-recognition algorithms in touchpad controllers, and the 1 MB Flash holds USB HID class drivers plus vendor-specific report descriptors. The device's 7x7 mm VFBGA package enables compact dongle form factors, and low-power sleep modes with USB-attached suspend current under 200 µA extend battery life in wireless presenters.
Recommandé
IoT Gateways and Edge Nodes
Industrial IoT gateways aggregate sensor data from fieldbus networks (RS-485, CAN, Modbus) and forward it to cloud services over Ethernet or Wi-Fi. The ATSAM4SA16CB-CFN's Ethernet MAC with MII/RMII interface pairs with external PHYs (such as KSZ8081) to provide 10/100 Mbps connectivity. Multiple SPI and TWI ports host wireless modules (Wi-Fi, LoRa, BLE) and EEPROM/FRAM for local data logging. The 1 MB Flash holds TLS 1.2 stacks, MQTT/CoAP clients, and OTA bootloader for secure firmware updates. With 128 KB SRAM and DMA-driven peripherals, the MCU maintains high-throughput data pipelines while running edge analytics via the Cortex-M4 DSP extensions.
Recommandé
Point-of-Sale Terminals
POS terminals and payment kiosks leverage the ATSAM4SA16CB-CFN's USB host capability to support peripherals such as barcode scanners, receipt printers, and PIN pads alongside Ethernet connectivity for transaction processing. The Cortex-M4 FPU accelerates cryptographic operations (AES-128, SHA-256) required for PCI-PTS point-to-point encryption. The 1 MB Flash stores multiple payment-application kernels (EMVCo L1, contactless protocols), while the 128 KB SRAM buffers transaction records before batch upload. The industrial temperature range suits retail back-office environments, and revision B silicon provides the USB reliability required for always-on customer-facing devices.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM4SA16CB-CFN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM4SD16CB-CFN | ATSAM4SA16CA-AUR | ATSAM4S8CB-CFN | ATSAM4S4CB-CFN |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-VFBGA (7x7 mm) | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same | 100-VFBGA (7x7 mm) - same |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Maximum Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Size | 1 MB | 1 MB (same) | 1 MB (same) | 512 KB (-50%) | 256 KB (-75%) |
| SRAM Size | 128 KB | 160 KB (+25%) | 128 KB (same) | 128 KB (same) | 64 KB (-50%) |
| Supply Voltage Range | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Silicon Revision | B | B (recommended) | A | B | B |
| Operating Temperature | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C | -40°C to +85°C |
Principaux différenciateurs
- Highest-density SAM4S Flash with revision B silicon (vs ATSAM4SA16CA-AUR)
- Maximum SRAM in the SAM4S family at same Flash density (vs ATSAM4SD16CB-CFN)
- Pin-compatibility across Flash densities (vs ATSAM4S8CB-CFN and ATSAM4S4CB-CFN)
Notes de conception
The 100-VFBGA 7x7 mm package uses a 0.65 mm ball pitch, which requires 4-layer or higher PCB fabrication with microvia (laser-drilled) technology per IPC-6012 Class 2. Route escape patterns on the top layer using dog-bone fan-out or vias-in-pad; the latter yields best signal integrity for high-speed USB 2.0 and Ethernet MII signals but increases PCB cost. Per Microchip's SAM4S hardware design guide, maintain a continuous ground plane beneath the BGA and stitch the perimeter with GND vias spaced at most λ/20 of the highest signal harmonic (≤ 600 mil at 250 MHz). For boards with mixed BGA and QFP parts, use a single 4-layer stack-up (signal-GND-power-signal) to keep impedance-controlled traces referenced to the same return plane.
Place one 100 nF X7R ceramic decoupling capacitor adjacent to every VDDCORE, VDDIO, VDDPLL, VDDUTMII, and VDDANA ball - typically 12-16 capacitors total depending on how many balls of each type the design uses. Add one bulk 4.7 µF X5R capacitor near each supply cluster. The internal 1.2V LDO (voltage regulator inside the SAM4S) handles core supply from VDDIO at 3.3V; if your application uses 1.8V I/O, the LDO still regulates correctly down to 1.62V. For USB applications, VDDUTMII must be 3.3V (±5%); series-ferrite-bead isolation between VDDIO and VDDUTMII reduces digital switching noise coupling into the USB transceiver per USB 2.0 compliance guidelines.
Three common pitfalls when designing with the ATSAM4SA16CB-CFN: (1) Failing to specify revision B silicon for new designs - the part number suffix 'CFN' maps to revision B per Microchip's decoding table, but ordering the wrong variant yields errata-laden revision A silicon. (2) Forgetting to disable the JTAG port after firmware lock-down; enable SECUMOD security bit through the EEFC to prevent boundary-scan read-out of Flash contents. (3) Not connecting unused GPIO balls to defined logic levels - floating inputs can cause excess current draw in Sleep mode (>500 µA instead of <10 µA target). Always tie unused balls to GND through 10 kΩ resistors or configure them as outputs driving low in firmware initialization.
The VFBGA-100 package's thermal performance depends heavily on PCB copper area connected to GND balls. Estimated: with 4-layer PCB and 1 square inch of unbroken GND copper beneath the package, theta_JA is approximately 35 °C/W. At maximum CPU activity (120 MHz, all peripherals active, 3.3V supply), core current draw is about 30 mA, dissipating 100 mW internally - well within thermal limits. However, at high ambient temperatures (>70 °C) or with reduced copper area (e.g., 0.5 sq in), theta_JA can rise above 50 °C/W and approach the 85 °C operating ceiling. For industrial applications, design at least 1 sq in of top-layer GND copper plus thermal vias to inner ground planes.
Informations de conformité
RoHS and REACH compliant per DigiKey/Mouser product listings. Not AEC-Q100 qualified (industrial grade only); for automotive AEC-Q100 applications, choose the SAMV71 or SAMS70 family. Lead-free finish confirmed; halogen-free status not explicitly listed in available data.
