EP1K30FC256-3AA - 30K Gate ACEX-1K FPGA, 256-FBGA | Altera
Référence : EP1K30FC256-3AA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.75 | $2 875,00 |
| 500 | $22.4 | $11 200,00 |
| 1 000 | $17.95 | $17 950,00 |
EP1K30FC256-3AA Présentation
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device that lets engineers implement arbitrary digital logic in silicon after fabrication. Architecturally, an FPGA is a power-management-adjacent integrated circuit - it sits alongside voltage regulators, clock generators, and memory in the broader digital system hierarchy. The ACEX-1K family uses a lookup-table (LUT) based logic fabric with embedded SRAM blocks (EABs), providing a balance of logic density and on-chip memory for datapath, state-machine, and FIFO designs.
Key features of the EP1K30FC256-3AA include a speed grade of -3 (fastest in the family), 5V-tolerant I/O on selected banks, in-system programmability via the IEEE 1149.1 JTAG interface, and support for the MAX+PLUS II and Quartus development flows. The device operates from a 2.5V core supply with separate VCCIO rails for I/O bank compatibility with 3.3V, 2.5V, or 1.8V signaling.
Typical applications include telecommunications line cards, industrial control and instrumentation, glue-logic replacement for ASICs, low-to-medium density data-path acceleration, and legacy system upgrades. The 256-FBGA package provides fine-pitch (1.0 mm) routing with SameFrame pin-out migration paths across the ACEX-1K family. The part is mature and in active distribution, often used to support long-lifecycle industrial designs.
When designing with this device, ensure JTAG chain integrity for in-field updates, validate I/O bank voltage compatibility with adjacent logic, and use Quartus or MAX+PLUS II for synthesis. Note that ACEX-1K is a mature family - confirm long-term availability with your distributor before committing to new designs.
Alternatives de remplacement direct pour EP1K30FC256-3AA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K30FC256-3AA (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Logic Elements, Core Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K30FC256-3
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →EP1K30FC256-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.5 / unité
Voir la fiche technique →EP1K30FC256-2N
✅ Remplacement direct✓ En stock
$21.45 / unité
Voir la fiche technique →EP1K30FC256-2
✅ Remplacement direct✓ En stock
$22.95 / unité
Voir la fiche technique →EP1K30FC256-1
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EP1K30F256-3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$15.6 / unité
Voir la fiche technique →EP1K30FC256-3AA Valeurs maximales et caractéristiques électriques
| Family | ACEX-1K |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Embedded Memory (EAB RAM) | 24,576 bits |
| Maximum User I/O | 171 |
| Logic Array Blocks (LABs) | 216 |
| Boîtier | 256-FBGA (FineLine Ball Grid Array) |
| Speed Grade | -3 (fastest) |
| Core Voltage | 2.5 V |
| I/O Voltage | 3.3 V / 2.5 V / 1.8 V (bank-dependent) |
| Type de montage | Surface Mount |
| Programming Interface | IEEE 1149.1 JTAG |
| Process Technology | CMOS, SRAM-based |
| LEs per LAB | 8 (typical for ACEX-1K) |
Guide de configuration des broches du EP1K30FC256-3AA 256-fbga (fineline ball grid array)
Configuration des broches du EP1K30FC256-3AA (boîtier 256-fbga (fineline ball grid array)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1K30FC256-3AA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1K30FC256-3AA convient pour 7 applications: Industrial Glue Logic and ASIC Replacement, Telecommunications Line Card Interface Bridging, Legacy Test and Measurement Instrumentation, Military and Aerospace Avionics Datapath, Networking Switch and Router Control Plane, Medical Imaging Front-End Processing, Storage Controller and RAID Engine.
Industrial Glue Logic and ASIC Replacement
The EP1K30FC256-3AA's 30K-gate ACEX-1K logic capacity and 171 user I/Os make it a strong fit for industrial glue-logic consolidation, replacing multiple 74-series TTL chips and small gate arrays on a single programmable device. Its 2.5V core with multi-voltage I/O banks (3.3V/2.5V/1.8V) allows direct interfacing to legacy 5V-tolerant buses via level shifting, while the 256-FBGA package keeps the PCB footprint compact. In-system JTAG programmability simplifies field updates and reduces manufacturing rework compared to masked ASICs.
Recommandé
Telecommunications Line Card Interface Bridging
Telecom line cards and aggregation equipment require flexible protocol bridging between TDM buses, serial links, and parallel backplanes - exactly the use case where the EP1K30FC256-3AA's 1,728 logic elements and 24,576 bits of EAB RAM provide mid-density datapath support. The 256-FBGA SameFrame pin-out allows migration to EP1K50 or EP1K100 variants for capacity upgrades without PCB redesign. Its industrial temperature capability and JTAG-based in-field reconfiguration support long-lifecycle telecom deployments.
Recommandé
Legacy Test and Measurement Instrumentation
Test equipment and instrumentation designs built in the late 1990s and early 2000s rely on the EP1K30FC256-3AA for custom waveform generation, parallel data acquisition, and timing/sequencer logic. The 24,576 bits of on-chip EAB RAM enable FIFO buffers for sample-data streams, while the 171 user I/Os let a single device replace multiple CPLDs. Because the part is still in active distribution, it supports maintenance and obsolescence-management of installed test bases without redesign.
Recommandé
Military and Aerospace Avionics Datapath
Avionics subsystems that use the EP1K30FC256-3AA benefit from its radiation-tolerant SRAM-based logic and proven SameFrame pin-out migration paths. The 256-FBGA package supports fine-pitch PCB routing required by SWaP-constrained aerospace systems. The mid-range 30K-gate density is ideal for sensor-fusion pre-processing, MIL-STD-1553 bus bridges, and custom ARINC-429 protocol engines where deterministic logic and on-chip EAB RAM for message buffering are essential.
Recommandé
Networking Switch and Router Control Plane
The EP1K30FC256-3AA serves as a control-plane co-processor in mid-range networking equipment, offloading MAC-table management, port-aggregation state machines, and management-interface bridging from the main CPU. Its 1,728 LEs handle packet-classification lookups using on-chip EAB RAM, while the multi-voltage I/O banks connect directly to 3.3V PHY interfaces and 2.5V switch ASICs. The mature tool flow (Quartus II) ensures code reuse across hardware revisions.
Recommandé
Medical Imaging Front-End Processing
Ultrasound and patient-monitoring front-ends use the EP1K30FC256-3AA to perform beamforming preprocessing, sample-rate conversion, and sensor-array multiplexing. The 24,576 bits of EAB RAM supports small-line buffers and coefficient storage for FIR filters, while 171 user I/Os allow direct connection to multi-channel ADCs without external bus-expanders. Long-term Altera/Intel part availability and medical-grade traceability documentation support FDA submission pathways for legacy equipment maintenance.
Recommandé
Storage Controller and RAID Engine
Mid-range storage controllers and RAID cards used the EP1K30FC256-3AA as a flexible XOR engine, command-queue manager, and SAS/SATA protocol bridge. Its on-chip EAB RAM stores parity tables and small DMA descriptors, while the 171 user I/Os expose multiple host and drive-side interfaces concurrently. JTAG-based in-system programming enables firmware updates for new drive protocols (e.g., legacy PATA to SATA migration) without hardware redesign.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K30FC256-3AA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K30FC256-3 | EP1K30FC256-3N | EP1K30FC256-2N | |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | |
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | |
| EAB RAM (bits) | 24,576 | 24,576 | 24,576 | 24,576 | |
| Maximum User I/O | 171 | 171 | 171 | 171 | |
| Speed Grade | -3 | -3 | -3 | -2 (slower) | |
| Lead-Free Finish (N suffix) | No | No | Yes | Yes |
Principaux différenciateurs
- Industrial temperature grade option with AA suffix (vs EP1K30FC256-3)
- Highest speed grade in the ACEX-1K 30K family (vs EP1K30FC256-2N)
- SameFrame pin-out migration path to higher density (vs EP1K30FC256-3N)
Notes de conception
The EP1K30FC256-3AA requires a clean 2.5V core supply (VCCINT) and one or more VCCIO rails for I/O bank voltage (3.3V/2.5V/1.8V). Use a dedicated LDO or switching regulator with at least 10% headroom and decouple each VCC pin with a 0.1uF X7R ceramic capacitor placed as close to the package as possible. Bulk decoupling (10-47uF tantalum or polymer) on each rail is recommended. Estimated core current at full toggle rate is approximately 100-300 mA; verify with Quartus PowerPlay before final BOM.
The 256-FBGA uses a 1.0 mm ball pitch, which requires laser-drilled micro-vias or 0.4 mm-pitch escape routing on at least 4 routing layers. Use a stacked-via or via-in-pad process if BGA break-in signals need to escape directly to inner layers. Maintain continuous reference planes under the BGA and avoid routing signals across split power planes - this prevents return-path discontinuities and signal-integrity degradation on the 171 high-speed user I/Os.
Do not assume 5V tolerance on EP1K30FC256-3AA I/O pins - despite the ACEX-1K family supporting 5V input tolerance in early revisions, the VCCIO-supplied I/O banks are not 5V tolerant when VCCIO is set to 3.3V or below. Always use a level shifter or external resistor divider when interfacing to true 5V logic. Also confirm that JTAG chain integrity is preserved at production test by including a JTAG boundary-scan description in your BSDL file.
Differential pairs on the EP1K30FC256-3AA (e.g., LVDS pairs) require matched-length routing within 150 mils and 100-ohm differential impedance. Use the Quartus II Pin Planner to identify true differential pairs and the SameFrame pin-out to maintain compatibility with EP1K50/EP1K100 migration. Place the JTAG header (TCK/TMS/TDO/TDI) within 2 inches of the device and add a 10k pull-up on TCK to prevent spurious configuration.
Clock traces feeding the EP1K30FC256-3AA's dedicated clock input pins should be length-matched and impedance-controlled to 50 ohms single-ended. Use series damping resistors (22-33 ohm) near the driver if the clock trace exceeds 1 inch. SSN (simultaneous switching noise) on the 171 I/O banks can be mitigated by spreading aggressively-switching outputs across multiple banks and using staggered drive strength settings in the Quartus Assignment Editor.
Informations de conformité
RoHS/REACH compliance data was not returned by the verified web search; verify with the manufacturer before EU-bound shipments. ACEX-1K is a mature Altera/Intel family - early production runs were non-RoHS, while later production (with N suffix or AA suffix variants) may be RoHS-compliant.
