EP1K30TC144-1N vs EP1K10TC144-3N Comparaison
Comparaison détaillée côte à côte de EP1K30TC144-1N par Altera et EP1K10TC144-3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K30TC144-1N | EP1K10TC144-3N |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $11,50 | $10,50 |
| Series | ACEX-1K | — |
| Number of Logic Elements (LEs) | 1,728 | — |
| Typical Gates | 30,000 | 10,000 |
| Number of Logic Array Blocks (LABs) | 216 | — |
| Embedded Memory (EAB) | 24,576 bits (6 EABs) | — |
| Number of User I/O | 102 | — |
| Number of I/O Banks | 4 | — |
| Package Type | 144-LQFP (TQFP) | — |
| Type de montage | Surface Mount | Surface Mount |
| Core Voltage | 2.5 V | 2.5 V |
| I/O Voltage | 3.3 V (LVCMOS/LVTTL); 2.5 V tolerant | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Process Technology | 0.18 µm SRAM | 0.22 um CMOS |
| Configuration | SRAM-based, JTAG (IEEE 1149.1) + serial/parallel passive | — |
| PLLs | 6 (per device family) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: confirm lead-free status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Niveau MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Family | — | ACEX-1K |
| Logic Elements / Cells | — | 576 |
| Total RAM Bits | — | 12,288 |
| User I/O Pins | — | 92 |
| Number of LABs | — | 72 |
| Number of EABs | — | 3 |
| Boîtier | — | 144-LQFP (TQFP) |
| Speed Grade | — | -3N (enhanced) |
| Plage de température de fonctionnement | — | [DATA_NEEDED: industrial or commercial grade] |
| JTAG Boundary-Scan | — | Yes (IEEE Std. 1149.1-1990 compliant) |
| PCI Compliance (-1 grade) | — | 5.0 V operation per PCI Local Bus Spec 2.2 |