EP1K50TI144-1X - 50K Gate ACEX 1K FPGA, 144-LQFP | Intel / Altera
Référence : EP1K50TI144-1X ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $12.1 | $6 050,00 |
| 1 000 | $10.95 | $10 950,00 |
EP1K50TI144-1X Présentation
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), embedded memory blocks (EABs / ESBs in ACEX 1K), and programmable routing. FPGAs belong to the semiconductor hierarchy: programmable logic IC -> PLD -> digital IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are configured by the user after manufacture using an HDL bitstream and a vendor toolchain (Quartus for ACEX 1K), making them ideal for prototyping, low-volume production, and glue-logic consolidation.
Key features of the EP1K50TI144-1X include on-chip SRAM-based configuration (volatile, requires external configuration device on power-up), embedded array blocks (EABs) for efficient memory and multiplier implementation, multi-volt I/O support for interfacing to 2.5 V, 3.3 V, and 5 V systems, and an industrial operating temperature range (-40 C to +85 C) suitable for factory and outdoor equipment. The ACEX 1K architecture combines look-up-table based logic fabric with EAB memory, giving it a hybrid advantage over pure LUT-based contemporaries.
In the broader ACEX 1K portfolio the EP1K50 sits between the EP1K10 (10K gates) and EP1K100 (100K gates), making it a sweet spot for medium-complexity glue logic, bridge designs, and pre-ASIC prototyping. The "-1" speed grade is the slowest of three available grades and offers the lowest cost; the "-2" and "-3" grades provide higher Fmax but consume more power. The "X" suffix indicates industrial temperature grade and tape-and-reel packaging per the Altera ordering code convention.
Typical applications include industrial control glue logic, communication protocol bridges (UART/SPI/I2C consolidation), legacy peripheral replacement, test and measurement front-ends, and low-volume embedded control where a microcontroller's fixed peripherals are insufficient. Designers transitioning away from discrete 74-series TTL logic or older CPLDs use this part to consolidate 5 to 20 chips onto a single programmable device.
When designing with the EP1K50TI144-1X, plan for an external EPC configuration ROM (e.g., EPC2 or EPC4) on the board because the ACEX 1K configuration is volatile. Use the Quartus II design tool (legacy version 9.0 or later) for HDL entry, synthesis, and place-and-route; the bitstream must be reformatted if migrating to a different package.
This page synthesizes distributor pricing snapshots, drop-in package-compatible ACEX 1K family variants, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1K50TI144-1X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K50TI144-1X (même facteur de forme et même empreinte) — différant par Speed Grade, Process Technology, Package, Operating Temperature, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K50TI144-2N
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K50TI144-3N
✅ Remplacement direct✓ En stock
$19.8 / unité
Voir la fiche technique →EP1K30TI144-2N
✅ Remplacement direct✓ En stock
$25 / unité
Voir la fiche technique →EP1K30TI144-3N
✅ Remplacement direct✓ En stock
$21.8 / unité
Voir la fiche technique →EP1C6T144C8N
✅ Remplacement direct✓ En stock
$12.95 / unité
Voir la fiche technique →EP1K50TI144-1X Valeurs maximales et caractéristiques électriques
| Family | ACEX 1K |
| Series | EP1K50 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | 50,000 |
| Logic Elements / Cells | 2,880 |
| Configurable Logic Blocks (CLBs) | 360 |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Number of Terminals | 144 |
| Package Code | QFP / TQFP-144 (Industrial) |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch |
| Terminal Form | Gull Wing |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) |
| Fréquence d'horloge maximale | 90 MHz |
| Température de fonctionnement | -40 C to +85 C (Industrial) |
| Configuration Method | Volatile SRAM, external configuration device required |
| Type de montage | Surface Mount |
| Speed Grade | -1 (slowest, lowest cost) |
| Design Toolchain | Quartus II (legacy support) |
Configuration des broches de EP1K50TI144-1X
| Broche 1 | GND — Ground |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | GND — Ground |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | VCCINT — Core supply voltage (2.5 V) |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | VCCINT — Core supply voltage (2.5 V) |
| Broche 44 | GND — Ground |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 3) |
| Broche 59 | GND — Ground |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | I/O — User I/O pin (bank 3) |
| Broche 62 | I/O — User I/O pin (bank 3) |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | VCCINT — Core supply voltage (2.5 V) |
| Broche 67 | GND — Ground |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | I/O — User I/O pin (bank 4) |
| Broche 76 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | I/O — User I/O pin (bank 4) |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O pin (bank 4) |
| Broche 83 | I/O — User I/O pin (bank 4) |
| Broche 84 | I/O — User I/O pin (bank 4) |
| Broche 85 | I/O — User I/O pin (bank 4) |
| Broche 86 | I/O — User I/O pin (bank 4) |
| Broche 87 | VCCINT — Core supply voltage (2.5 V) |
| Broche 88 | GND — Ground |
| Broche 89 | I/O — User I/O pin (bank 5) |
| Broche 90 | I/O — User I/O pin (bank 5) |
| Broche 91 | I/O — User I/O pin (bank 5) |
| Broche 92 | I/O — User I/O pin (bank 5) |
| Broche 93 | I/O — User I/O pin (bank 5) |
| Broche 94 | I/O — User I/O pin (bank 5) |
| Broche 95 | I/O — User I/O pin (bank 5) |
| Broche 96 | I/O — User I/O pin (bank 5) |
| Broche 97 | I/O — User I/O pin (bank 5) |
| Broche 98 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 99 | I/O — User I/O pin (bank 5) |
| Broche 100 | I/O — User I/O pin (bank 5) |
| Broche 101 | I/O — User I/O pin (bank 5) |
| Broche 102 | I/O — User I/O pin (bank 5) |
| Broche 103 | GND — Ground |
| Broche 104 | I/O — User I/O pin (bank 5) |
| Broche 105 | I/O — User I/O pin (bank 5) |
| Broche 106 | I/O — User I/O pin (bank 5) |
| Broche 107 | I/O — User I/O pin (bank 5) |
| Broche 108 | I/O — User I/O pin (bank 5) |
| Broche 109 | VCCINT — Core supply voltage (2.5 V) |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O pin (bank 6) |
| Broche 112 | I/O — User I/O pin (bank 6) |
| Broche 113 | I/O — User I/O pin (bank 6) |
| Broche 114 | I/O — User I/O pin (bank 6) |
| Broche 115 | I/O — User I/O pin (bank 6) |
| Broche 116 | I/O — User I/O pin (bank 6) |
| Broche 117 | I/O — User I/O pin (bank 6) |
| Broche 118 | I/O — User I/O pin (bank 6) |
| Broche 119 | I/O — User I/O pin (bank 6) |
| Broche 120 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 121 | I/O — User I/O pin (bank 6) |
| Broche 122 | I/O — User I/O pin (bank 6) |
| Broche 123 | I/O — User I/O pin (bank 6) |
| Broche 124 | I/O — User I/O pin (bank 6) |
| Broche 125 | GND — Ground |
| Broche 126 | I/O — User I/O pin (bank 6) |
| Broche 127 | I/O — User I/O pin (bank 6) |
| Broche 128 | I/O — User I/O pin (bank 6) |
| Broche 129 | I/O — User I/O pin (bank 6) |
| Broche 130 | I/O — User I/O pin (bank 6) |
| Broche 131 | nCONFIG — Configuration control (active-low reset) |
| Broche 132 | nSTATUS — Configuration status (active-low) |
| Broche 133 | CONF_DONE — Configuration done (open-drain) |
| Broche 134 | MSEL0 — Configuration mode select 0 |
| Broche 135 | MSEL1 — Configuration mode select 1 |
| Broche 136 | TCK — JTAG test clock |
| Broche 137 | TMS — JTAG test mode select |
| Broche 138 | TDI — JTAG test data in |
| Broche 139 | TDO — JTAG test data out |
| Broche 140 | CLK0 — Dedicated global clock input 0 |
| Broche 141 | CLK1 — Dedicated global clock input 1 |
| Broche 142 | CLK2/DATA0 — Dedicated clock / data input |
| Broche 143 | CLK3/DATA1 — Dedicated clock / data input |
| Broche 144 | GND — Ground |
Applications typiques
EP1K50TI144-1X convient pour 6 applications: Industrial Glue Logic Consolidation, Legacy Peripheral Bridge (UART/SPI/I2C), Pre-ASIC Prototyping Platform, Test and Measurement Front-End, Communication Protocol Consolidation, Legacy System Maintenance / EOL Replacement.
Industrial Glue Logic Consolidation
The EP1K50TI144-1X is widely used to consolidate 5 to 20 discrete 74-series TTL or HC logic chips onto a single programmable device in industrial control cabinets. With 50,000 equivalent gates and 2,880 logic elements, it provides enough capacity for complex state machines, address decoding, and bus steering logic, while its 102 user I/O pins support direct connection to many parallel peripherals. Industrial temperature grade (-40 C to +85 C) ensures reliable operation in factory floor enclosures where ambient temperatures can fluctuate widely. Compared to discrete logic, the FPGA reduces PCB area, lowers assembly cost, and enables late-stage design changes without board rework. Designers pair it with an EPC configuration ROM and a 2.5 V LDO regulator on a compact industrial backplane.
Recommandé
Legacy Peripheral Bridge (UART/SPI/I2C)
Many factory automation and test systems use the EP1K50TI144-1X as a bridge between mismatched serial protocols (UART to SPI, I2C to parallel, RS-232 to RS-485). The FPGA's flexible I/O banks can interface with 2.5 V, 3.3 V, and 5 V peripherals in the same design, while the embedded array blocks (EABs) provide small FIFO buffers for protocol rate matching. Industrial temperature rating and the 144-pin TQFP's proven reliability make this part common in long-lifecycle equipment that must operate for 15+ years. The volatile SRAM configuration requires an EPC configuration ROM on the board, but the resulting design can be updated in the field by reprogramming the ROM.
Recommandé
Pre-ASIC Prototyping Platform
Design teams use the EP1K50TI144-1X as a low-cost pre-ASIC prototype target because Quartus II synthesis results transfer cleanly to larger ACEX 1K devices or to Cyclone IV ASIC replacements. With 50K gates and 90 MHz Fmax at the -1 speed grade, the device validates DSP datapaths, embedded processor cores (Nios), and bus architectures before committing to a masked ASIC. The 144-pin TQFP is easy to hand-solder during early bring-up, and the industrial temperature grade allows prototype validation in harsh environments. Although the part is now obsolete, existing engineering inventory supports many legacy prototype platforms still in production use.
Recommandé
Test and Measurement Front-End
Test equipment manufacturers integrate the EP1K50TI144-1X into bench instruments such as logic analyzers, protocol analyzers, and custom ATE platforms because its high I/O count and reconfigurable fabric allow one board to support multiple test personalities. The 102 user I/Os can fan out to multiple DUT connectors, while embedded array blocks implement capture buffers and trigger logic. The industrial temperature grade supports lab-to-floor deployment, and the 144-pin TQFP package is straightforward to assemble on multilayer test backplanes. Engineers write custom test personalities in VHDL or Verilog and recompile via Quartus II, dramatically shortening test-program development cycles.
Recommandé
Communication Protocol Consolidation
Embedded networking equipment uses the EP1K50TI144-1X to consolidate custom packet processing, framing, and error-correction logic that would otherwise require multiple CPLDs and discrete FIFOs. The FPGA's EAB blocks implement small CAMs and lookup tables for protocol headers, while general logic handles CRC and framing. Multi-volt I/O support allows direct connection to 3.3 V PHYs and 5 V legacy buses. The industrial temperature range is critical for outdoor telecom and roadside cabinet installations where commercial-grade parts would fail.
Recommandé
Legacy System Maintenance / EOL Replacement
Because the EP1K50TI144-1X is now obsolete, industrial customers with installed equipment use it primarily as a form-fit-function replacement board for legacy systems that cannot be redesigned. Authorized distributors, brokers (Octopart-listed vendors, Vemeko, Vyrian), and OEM surplus channels carry remaining stock. For new designs, Intel recommends migrating to MAX 10 (10M08SCE144) or Cyclone IV (EP4CE6E22C8N) in similar TQFP packages, which offer comparable or greater logic density, non-volatile configuration, and active toolchain support. Designers porting legacy ACEX 1K designs should plan a Quartus II to Quartus Prime migration path before committing to the modern replacement.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K50TI144-1X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K50TI144-2N | EP1K50TI144-3N | EP1K30TI144-2N | EP1K30TI144-3N | EP1C6T144C8N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | Cyclone |
| Logic Elements | 2,880 | 2,880 | 2,880 | 1,728 | 1,728 | 5,980 |
| Speed Grade | -1 (slowest) | -2 (medium) | -3 (fastest) | -2 (medium) | -3 (fastest) | -8 (Cyclone family) |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 98 |
| Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.5 V core |
| Configuration Method | Volatile SRAM (EPC ROM required) | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM (AS mode) |
| Toolchain | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (active) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | NRND / Last time buy |
Principaux différenciateurs
- Same die as EP1K50TI144-2N and -3N; only speed grade differs (vs EP1K50TI144-2N)
- Higher logic density than EP1K30TI144 family (vs EP1K30TI144-2N)
- Modern Cyclone alternative in same package (vs EP1C6T144C8N)
Notes de conception
Estimated: The EP1K50TI144-1X core current at 90 MHz with typical utilization is approximately 100 mA from a 2.5 V rail. Provide at least three 0.1 uF ceramic decoupling capacitors near VCCINT pins (pins 21, 43, 66, 87, 109), plus one bulk 10 uF tantalum or ceramic capacitor. Each VCCIO bank (pins 7, 31, 54, 76, 98, 120) requires its own decoupling network sized for the I/O switching current. A linear LDO such as a 2.5 V regulator is acceptable for low-noise designs; for higher I/O switching loads, a switching regulator followed by an LDO provides better efficiency.
Route the JTAG chain (TCK, TMS, TDI, TDO) with impedance-controlled traces and keep them short (< 50 mm) to avoid signal integrity issues during in-system programming. Place the EPC configuration ROM within 50 mm of the FPGA's DATA/DCLK pins to meet ACEX 1K configuration timing. Provide a 1 kohm pull-up on nCONFIG and a 10 kohm pull-up on CONF_DONE per the Altera reference design. Decoupling capacitors must be placed as close as possible to the corresponding power pins to minimize supply inductance.
Do not leave MSEL0/MSEL1 floating; tie them to VCCINT or GND to select the correct configuration mode (typically AS mode for EPC1/EPC2). Ensure the EPC configuration ROM is correctly programmed before solder reflow because the ACEX 1K will not boot without valid configuration data. Verify that all VCCIO banks are powered even if unused, otherwise the FPGA's I/O pins enter indeterminate states. When migrating designs between speed grades, re-run Quartus II timing analysis because the -1, -2, and -3 grades have different Fmax and tCO specifications.
Estimated: At typical utilization (50% logic, 50% I/O toggling at 50 MHz) the EP1K50TI144-1X dissipates approximately 0.5 W, well within the TQFP-144's thermal envelope without a heatsink. Under worst-case utilization (100% logic at 90 MHz), dissipation can reach 1.0 to 1.5 W; in enclosed industrial enclosures with minimal airflow, attach a small clip-on heatsink or provide thermal vias under the package thermal pad. Industrial temperature grade (-40 C to +85 C) ensures reliable operation but does not substitute for proper thermal management.
Informations de conformité
RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-mineral status were not present in the verified distributor data. ACEX 1K parts are obsolete and predate modern compliance documentation standards; verify compliance with your supplier at the time of order.
