EP1SGX40DF1020I6N vs EP1SGX25DF1020I6N Comparaison
Comparaison détaillée côte à côte de EP1SGX40DF1020I6N par Intel et EP1SGX25DF1020I6N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1SGX40DF1020I6N | EP1SGX25DF1020I6N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 450,00 | $165,00 |
| Series | Stratix GX | EP1SGX25 |
| Family | Stratix (First Generation) | Stratix GX |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.425 V to 1.575 V (1.5 V nominal) |
| Number of Logic Elements (LEs) | 41,250 | — |
| Number of LABs (Logic Array Blocks) | 4,125 | — |
| Total RAM Bits | 3,423,744 | — |
| Maximum User I/O Pins | 624 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| High-Speed Transceivers | Integrated GX SerDes (channels, data rate: [DATA_NEEDED: per Stratix GX handbook]) | — |
| Embedded DSP Blocks | Yes (DSP block count: [DATA_NEEDED: per device datasheet]) | — |
| Boîtier / Format | 1020-BBGA / 1020-FBGA | — |
| Package Size | 33 x 33 mm, 1.0 mm pitch | — |
| Supplier Device Package | 1020-FBGA (33 x 33) | — |
| Température de fonctionnement | 0 C to 85 C (industrial grade 'I') | 0 °C to +85 °C (industrial) |
| Speed Grade | 6 (I6) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Niveau MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Statut RoHS | [DATA_NEEDED: confirm RoHS on datasheet] | Compliant |
| Logic Family | CMOS (SRAM-based configuration) | — |
| Packaging | Tray / Bulk | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG (per Stratix GX handbook) | — |
| Logic Elements | — | 25,660 |
| Configurable Logic Blocks (CLBs) | — | 2,566 |
| User I/Os | — | 607 |
| Maximum Operating Frequency | — | [DATA_NEEDED: max internal clock frequency in MHz] |
| Process Technology | — | 130 nm CMOS |
| Multi-Gigabit Transceivers | — | Integrated (up to 3.125 Gbps per channel) |
| Boîtier | — | 1020-ball FC-FBGA, 33 mm × 33 mm, 1.0 mm pitch |
| Lead Finish | — | Lead Free |
| Memory | — | Embedded TriMatrix memory blocks |
| DSP Blocks | — | Integrated DSP blocks for fixed/floating-point arithmetic |
| Clock Management | — | PLLs with dynamic phase alignment (DPA) |
| Grade Identifier | — | I6 (industrial, speed grade 6) |