EP1SGX40DF1020I6N vs EP1SGX25DF1020I6N Сравнение
Подробное сравнение бок о бок EP1SGX40DF1020I6N от Intel и EP1SGX25DF1020I6N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP1SGX40DF1020I6N - Stratix GX FPGA, 41.25K LEs, 1020-FBGA | Intel
EP1SGX40DF1020I6N ✓ Активен
Сравнение характеристик
| Параметр | EP1SGX40DF1020I6N | EP1SGX25DF1020I6N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1.450,00 | $165,00 |
| Series | Stratix GX | EP1SGX25 |
| Family | Stratix (First Generation) | Stratix GX |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.425 V to 1.575 V (1.5 V nominal) |
| Number of Logic Elements (LEs) | 41,250 | — |
| Number of LABs (Logic Array Blocks) | 4,125 | — |
| Total RAM Bits | 3,423,744 | — |
| Maximum User I/O Pins | 624 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| High-Speed Transceivers | Integrated GX SerDes (channels, data rate: [DATA_NEEDED: per Stratix GX handbook]) | — |
| Embedded DSP Blocks | Yes (DSP block count: [DATA_NEEDED: per device datasheet]) | — |
| Корпус / Типоразмер | 1020-BBGA / 1020-FBGA | — |
| Package Size | 33 x 33 mm, 1.0 mm pitch | — |
| Supplier Device Package | 1020-FBGA (33 x 33) | — |
| Рабочая температура | 0 C to 85 C (industrial grade 'I') | 0 °C to +85 °C (industrial) |
| Speed Grade | 6 (I6) | — |
| Тип монтажа | Surface Mount (BGA) | Surface Mount (BGA) |
| Уровень MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Статус RoHS | [DATA_NEEDED: confirm RoHS on datasheet] | Compliant |
| Logic Family | CMOS (SRAM-based configuration) | — |
| Packaging | Tray / Bulk | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG (per Stratix GX handbook) | — |
| Logic Elements | — | 25,660 |
| Configurable Logic Blocks (CLBs) | — | 2,566 |
| User I/Os | — | 607 |
| Maximum Operating Frequency | — | [DATA_NEEDED: max internal clock frequency in MHz] |
| Process Technology | — | 130 nm CMOS |
| Multi-Gigabit Transceivers | — | Integrated (up to 3.125 Gbps per channel) |
| Корпус | — | 1020-ball FC-FBGA, 33 mm × 33 mm, 1.0 mm pitch |
| Lead Finish | — | Lead Free |
| Memory | — | Embedded TriMatrix memory blocks |
| DSP Blocks | — | Integrated DSP blocks for fixed/floating-point arithmetic |
| Clock Management | — | PLLs with dynamic phase alignment (DPA) |
| Grade Identifier | — | I6 (industrial, speed grade 6) |