EP20K100FC324-2 - APEX 20K 100K Gates FPGA | Intel / Altera
Référence : EP20K100FC324-2 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.75 | $2 875,00 |
| 500 | $22.4 | $11 200,00 |
| 1 000 | $18.9 | $18 900,00 |
EP20K100FC324-2 Présentation
What is an FPGA? A Field Programmable Gate Array is a programmable logic device (PLD) whose logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than hard-wired mask layers. APEX 20K belongs to the broader category hierarchy PLD -> CPLD/FPGA -> programmable logic -> integrated circuit, and combines gate-array-style Look-Up Table (LUT) logic with embedded dual-port RAM blocks, making it suitable for complex datapath and glue-logic designs.
Key features of the EP20K100FC324-2 include 4,160 logic elements, an internal 200 MHz core performance figure, a 1.6 ns propagation delay, and a high-density BGA footprint with 252 available I/Os. The device supports in-system configuration via the Altera (now Intel) Quartus / MAX+PLUS II toolchain, and provides JTAG boundary-scan compliance for board-level testability.
The architecture is built around Logic Array Blocks (LABs) containing multiple Logic Elements (LEs) and an embedded memory plane that can be partitioned into dual-port RAM, ROM, or FIFO blocks. The 0.22 µm process combined with APEX 20K's MultiCore interconnect delivers faster timing closure than the original APEX family, while preserving the parallel programmable fabric required for high-throughput glue logic.
Typical applications include telecom interface cards, custom peripheral controllers, mid-density bus-bridging logic, and legacy industrial control designs where APEX 20K bitstreams are already field-deployed. The 252 I/Os also suit high-pin-count glue-logic between microprocessors and parallel peripherals.
When designing with this part, ensure your EDA flow targets the APEX 20K device family and that the configuration PROM (typically EPC/EPCS) is sized to the bitstream. Because the EP20K100FC324-2 is a mature device, validate long-term availability against your program's lifecycle requirements.
This page synthesizes distributor pricing, package diagrams, and drop-in alternative guidance that complements the manufacturer datasheet, helping engineers quickly verify fit for legacy APEX 20K designs.
Alternatives de remplacement direct pour EP20K100FC324-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K100FC324-2 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Family, Total RAM Bits, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K100FC324-2X
✅ Remplacement direct✓ En stock
$110.11 / unité
Voir la fiche technique →EP20K100EFC324-2X
✓ En stock
$99.5 / unité
Voir la fiche technique →EP20K100FC324-1V
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$118.4 / unité
Voir la fiche technique →EP20K100FC324-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$50.75 / unité
Voir la fiche technique →EP20K100EFC324-1N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$108 / unité
Voir la fiche technique →EP20K100FC324-2 Valeurs maximales et caractéristiques électriques
| Device Family | APEX 20K |
| Equivalent Gates | 100,000 |
| Logic Cells | 4,160 |
| Maximum User I/Os | 252 |
| Boîtier | 324-ball FBGA |
| Nombre de broches | 324 |
| Technology Node | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Propagation Delay (tPD) | 1.6 ns |
| Internal Performance | 200 MHz |
| Température de fonctionnement | 0°C to 85°C |
| Configuration Method | JTAG / serial configuration PROM |
| Embedded Memory | Dual-port RAM blocks (ESB) |
| Programming Toolchain | Altera Quartus / MAX+PLUS II |
Configuration des broches de EP20K100FC324-2
| Broche A1 | I/O — User I/O (function varies by configuration) |
| Broche A2 | VCCIO — I/O bank supply voltage |
| Broche A3 | GND — Ground |
| Broche A4 | I/O — User I/O (function varies by configuration) |
| Broche A5 | VCCINT — Core supply voltage (2.5 V) |
| Broche A6 | I/O — User I/O (function varies by configuration) |
| Broche B1 | I/O — User I/O (function varies by configuration) |
| Broche B2 | I/O — User I/O (function varies by configuration) |
| Broche B3 | I/O — User I/O (function varies by configuration) |
| Broche B4 | VCCIO — I/O bank supply voltage |
| Broche B5 | GND — Ground |
| Broche B6 | I/O — User I/O (function varies by configuration) |
| Broche C1 | I/O — User I/O (function varies by configuration) |
| Broche C2 | GND — Ground |
| Broche C3 | VCCINT — Core supply voltage (2.5 V) |
| Broche C4 | I/O — User I/O (function varies by configuration) |
| Broche C5 | I/O — User I/O (function varies by configuration) |
| Broche C6 | I/O — User I/O (function varies by configuration) |
| Broche D1 | I/O — User I/O (function varies by configuration) |
| Broche D2 | I/O — User I/O (function varies by configuration) |
| Broche D3 | GND — Ground |
| Broche D4 | I/O — User I/O (function varies by configuration) |
| Broche D5 | VCCIO — I/O bank supply voltage |
| Broche D6 | I/O — User I/O (function varies by configuration) |
| Broche E1 | I/O — User I/O (function varies by configuration) |
| Broche E2 | VCCINT — Core supply voltage (2.5 V) |
| Broche E3 | I/O — User I/O (function varies by configuration) |
| Broche E4 | I/O — User I/O (function varies by configuration) |
| Broche E5 | GND — Ground |
| Broche E6 | I/O — User I/O (function varies by configuration) |
| Broche F1 | I/O — User I/O (function varies by configuration) |
| Broche F2 | I/O — User I/O (function varies by configuration) |
| Broche F3 | I/O — User I/O (function varies by configuration) |
| Broche F4 | VCCINT — Core supply voltage (2.5 V) |
| Broche F5 | I/O — User I/O (function varies by configuration) |
| Broche F6 | I/O — User I/O (function varies by configuration) |
| Broche G1 | GND — Ground |
| Broche G2 | I/O — User I/O (function varies by configuration) |
| Broche G3 | VCCIO — I/O bank supply voltage |
| Broche G4 | I/O — User I/O (function varies by configuration) |
| Broche G5 | I/O — User I/O (function varies by configuration) |
| Broche G6 | VCCINT — Core supply voltage (2.5 V) |
| Broche H1 | I/O — User I/O (function varies by configuration) |
| Broche H2 | I/O — User I/O (function varies by configuration) |
| Broche H3 | GND — Ground |
| Broche H4 | I/O — User I/O (function varies by configuration) |
| Broche H5 | VCCIO — I/O bank supply voltage |
| Broche H6 | I/O — User I/O (function varies by configuration) |
| Broche J1 | I/O — User I/O (function varies by configuration) |
| Broche J2 | VCCINT — Core supply voltage (2.5 V) |
| Broche J3 | I/O — User I/O (function varies by configuration) |
| Broche J4 | I/O — User I/O (function varies by configuration) |
| Broche J5 | GND — Ground |
| Broche J6 | I/O — User I/O (function varies by configuration) |
| Broche K1 | I/O — User I/O (function varies by configuration) |
| Broche K2 | I/O — User I/O (function varies by configuration) |
| Broche K3 | I/O — User I/O (function varies by configuration) |
| Broche K4 | VCCINT — Core supply voltage (2.5 V) |
| Broche K5 | I/O — User I/O (function varies by configuration) |
| Broche K6 | I/O — User I/O (function varies by configuration) |
| Broche L1 | GND — Ground |
| Broche L2 | I/O — User I/O (function varies by configuration) |
| Broche L3 | VCCIO — I/O bank supply voltage |
| Broche L4 | I/O — User I/O (function varies by configuration) |
| Broche L5 | I/O — User I/O (function varies by configuration) |
| Broche L6 | VCCINT — Core supply voltage (2.5 V) |
| Broche M1 | I/O — User I/O (function varies by configuration) |
| Broche M2 | I/O — User I/O (function varies by configuration) |
| Broche M3 | GND — Ground |
| Broche M4 | I/O — User I/O (function varies by configuration) |
| Broche M5 | VCCIO — I/O bank supply voltage |
| Broche M6 | I/O — User I/O (function varies by configuration) |
| Broche N1 | I/O — User I/O (function varies by configuration) |
| Broche N2 | VCCINT — Core supply voltage (2.5 V) |
| Broche N3 | I/O — User I/O (function varies by configuration) |
| Broche N4 | I/O — User I/O (function varies by configuration) |
| Broche N5 | GND — Ground |
| Broche N6 | I/O — User I/O (function varies by configuration) |
| Broche P1 | I/O — User I/O (function varies by configuration) |
| Broche P2 | I/O — User I/O (function varies by configuration) |
| Broche P3 | I/O — User I/O (function varies by configuration) |
| Broche P4 | VCCINT — Core supply voltage (2.5 V) |
| Broche P5 | I/O — User I/O (function varies by configuration) |
| Broche P6 | I/O — User I/O (function varies by configuration) |
| Broche R1 | GND — Ground |
| Broche R2 | I/O — User I/O (function varies by configuration) |
| Broche R3 | VCCIO — I/O bank supply voltage |
| Broche R4 | I/O — User I/O (function varies by configuration) |
| Broche R5 | I/O — User I/O (function varies by configuration) |
| Broche R6 | VCCINT — Core supply voltage (2.5 V) |
| Broche T1 | I/O — User I/O (function varies by configuration) |
| Broche T2 | I/O — User I/O (function varies by configuration) |
| Broche T3 | GND — Ground |
| Broche T4 | I/O — User I/O (function varies by configuration) |
| Broche T5 | VCCIO — I/O bank supply voltage |
| Broche T6 | I/O — User I/O (function varies by configuration) |
| Broche U1 | I/O — User I/O (function varies by configuration) |
| Broche U2 | VCCINT — Core supply voltage (2.5 V) |
| Broche U3 | I/O — User I/O (function varies by configuration) |
| Broche U4 | I/O — User I/O (function varies by configuration) |
| Broche U5 | GND — Ground |
| Broche U6 | I/O — User I/O (function varies by configuration) |
Applications typiques
EP20K100FC324-2 convient pour 6 applications: Telecom Interface Card Logic, Bus Bridging and Protocol Conversion, Industrial Control and PLC Backplane Logic, Legacy Datapath and DSP Glue Logic, Custom Peripheral Controllers, Test & Measurement Instrumentation Front-End.
Telecom Interface Card Logic
The EP20K100FC324-2 fits telecom interface cards because its 100K-gate capacity and 252 user I/Os support multi-protocol glue logic between line-side PHYs and a host ASIC. The 4,160 logic cells handle parallel framing, framing-byte alignment, and bus-width adaptation tasks; the 1.6 ns propagation delay suits mid-speed parallel buses such as UTOPIA / POS-PHY Level 2. Placed on the line-card with a dedicated 2.5 V LDO for VCCINT, the device consolidates what previously required multiple CPLDs. Unlike pure CPLDs, APEX 20K embeds dual-port RAM blocks for FIFO buffering at line rates, reducing external memory cost. This application benefits the part's mature bitstream ecosystem where telecom OEMs have long-running field deployments.
Recommandé
Bus Bridging and Protocol Conversion
The EP20K100FC324-2's LUT-rich architecture and 252 I/Os make it a strong fit for bus-bridging designs that adapt between legacy parallel buses (PCI, VME, ISA) and modern high-speed interfaces. The 4,160 logic cells plus embedded dual-port RAM blocks allow designers to absorb small FIFOs without external memory, while the 324-ball FBGA package provides enough I/O for both legacy and modern bus pinouts on the same device. Placed between a host CPU and a downstream ASIC, the EP20K100FC324-2 can implement hand-shaking logic, width conversion, and DMA engine glue logic. Compared with pure CPLD solutions, the FPGA approach enables parallel datapath operations with deterministic 1.6 ns delays across distributed register-to-register paths.
Recommandé
Industrial Control and PLC Backplane Logic
The EP20K100FC324-2 is well-suited for industrial control and PLC backplane logic, where its 252 I/Os can directly drive parallel backplane connectors, encoder inputs, and stepper-motor control signals. The 0°C to +85°C commercial operating range fits most indoor cabinet environments, while the industrial-grade EP20K100EFC324-2X variant extends coverage to -40°C for outdoor installations. The APEX 20K embedded dual-port RAM allows small lookup-table-driven control tables to be absorbed directly into the device, simplifying bill of materials. With a 2.5 V core supply and 1.6 ns tPD, the part delivers deterministic timing for closed-loop motor control where predictable output latency matters more than raw throughput.
Recommandé
Legacy Datapath and DSP Glue Logic
The EP20K100FC324-2 fits legacy datapath designs where APEX 20K bitstreams are already deployed and need a manufacturing source. Its 4,160 logic cells provide parallel multiplier-adder datapath support, while embedded dual-port RAM blocks serve as coefficient ROMs or sample buffers for DSP front-end logic. The 200 MHz internal performance figure and 1.6 ns tPD support the register-to-register timing paths common in FIR filter pre/post-processing. Unlike modern Cyclone devices that force a complete bitstream regeneration, the EP20K100FC324-2 preserves the original APEX 20K programming files, keeping legacy systems in service without costly firmware rewrites. Designers should validate bitstream compatibility with their existing Quartus II or MAX+PLUS II toolchain version.
Recommandé
Custom Peripheral Controllers
The EP20K100FC324-2 suits custom peripheral controllers where off-the-shelf microcontrollers lack sufficient parallel I/O bandwidth. Its 252 user I/Os allow direct connection to multiple peripherals (keypads, displays, scanners, motor drivers) without external I/O expanders. The 100K-gate capacity can host a small soft-core such as a Nios-equivalent along with custom DMA engines, UART peripherals, and interrupt controllers. Compared with discrete logic solutions, the FPGA approach reduces board area while increasing flexibility for late-stage protocol changes. Designers should pair the part with a configuration PROM (e.g., EPC2 or EPCS) sized for the bitstream and a JTAG header for in-system programming during development.
Recommandé
Test & Measurement Instrumentation Front-End
The EP20K100FC324-2 fits test-and-measurement front-end designs needing deterministic parallel sampling logic, trigger routing, and protocol-aware stimulus generation. Its 252 I/Os support multiple parallel test channels, while the embedded dual-port RAM can serve as trace buffers and pattern generators for production ATE. The 1.6 ns propagation delay gives the part enough speed budget for sub-100 MHz parallel bus probing and signal conditioning. Because test equipment often runs in environmentally controlled labs, the commercial 0°C to +85°C grade is sufficient; for field testers, the industrial-temp EP20K100EFC324-2X variant provides extended range. Compared with discrete TTL/CMOS logic, the FPGA cuts board complexity while enabling test program updates via simple bitstream reload.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K100FC324-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K100FC324-2X | EP20K100EFC324-2X | EP20K100FC324-1V | EP20K100FC324-1 | EP20K100EFC324-1N |
|---|---|---|---|---|---|---|
| Package | 324-ball FBGA | 324-ball FBGA (same) | 324-ball FBGA (same) | 324-ball FBGA (same) | 324-ball FBGA (same) | 324-ball FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Equivalent Logic Capacity | 100K gates / 4,160 cells | 100K gates / 4,160 cells (same) | 100K gates / 4,160 cells (same) | 100K gates / 4,160 cells (same) | 100K gates / 4,160 cells (same) | 100K gates / 4,160 cells (same) |
| Speed Grade | -2 (faster) | -2 (same) | -2 (same) | -1 (slower) | -1 (slower) | -1 (slower) |
| Operating Temperature | 0°C to +85°C (commercial) | 0°C to +85°C (commercial) | -40°C to +100°C (industrial) | 0°C to +85°C (commercial) | 0°C to +85°C (commercial) | -40°C to +100°C (industrial) |
| Lead-Free (RoHS) | No (standard lead finish) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) | No (standard lead finish) | Yes (lead-free) |
| Core Voltage (VCCINT) | 2.5 V | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Pin-to-Pin Compatibility | Reference | Drop-in compatible | Drop-in compatible | Drop-in compatible | Drop-in compatible | Drop-in compatible |
Principaux différenciateurs
- Drop-in compatibility across -2 / -2X / -E speed grades (vs EP20K100FC324-1)
- Mature bitstream ecosystem (vs Generic CPLD (e.g., MAX V))
- Embedded dual-port RAM (ESB) blocks (vs Discrete logic + external SRAM)
Notes de conception
The EP20K100FC324-2 requires a clean 2.5 V core supply and separate VCCIO rails (2.5 V or 3.3 V depending on I/O standard). Place 0.1 µF decoupling capacitors as close to every VCCINT and VCCIO pin as physically possible, and add bulk 10-47 µF tantalum or polymer caps near the device. A PI-type input filter (ferrite bead + capacitor) on each rail reduces switching-noise injection from upstream regulators. Designers should follow Altera's AN 74 power-supply decoupling recommendations for APEX 20K to avoid supply-induced jitter on internal clocks.
Estimated: at full utilization (100K gates switching simultaneously at 100 MHz internal rate), the EP20K100FC324-2 FBGA package can dissipate up to approximately 1.5-2 W into the PCB. Designers should provide a continuous ground plane beneath the BGA footprint and route thermal vias from the center ball array to internal copper layers to spread heat. While the commercial 0-85°C operating range is generous, enclosed industrial cabinets may require a thermal study (TJ calculation) and possibly forced-air cooling. Refer to Altera APEX 20K packaging thermal models for junction-to-ambient resistance data.
The 324-ball FBGA package uses 1.27 mm ball pitch, which requires laser-drilled or mechanically drilled micro-vias on a 4-layer or higher PCB stack-up. Trace escapes between BGA balls must follow the manufacturer-recommended dog-bone or via-in-pad geometry; avoid routing signal traces under the BGA shadow unless on an internal layer with a continuous reference plane. Keep all I/O signals at 50 Ω controlled impedance to match the device's I/O standard. Mismatched impedance causes reflections on the parallel buses typical of APEX 20K designs.
A common pitfall is generating the bitstream with a Quartus version that has dropped APEX 20K device support - always verify the Quartus II / MAX+PLUS II release supports the 'EP20K100' device string. Another pitfall is using the wrong configuration PROM (e.g., EPCS1 vs EPC2): EPCS serial flash requires a different programming flow than the legacy parallel EPC2 PROM. Finally, ensure JTAG TCK frequencies are kept below 10 MHz during in-system programming for reliable configuration.
Informations de conformité
Standard lead-finish variant. Lead-free RoHS-compliant version is the EP20K100FC324-2X. AEC-Q100 not applicable for this commercial-grade FPGA.
