EP20K600CF672C8N vs EP20K600CF672C6 Comparaison
Comparaison détaillée côte à côte de EP20K600CF672C8N par Intel et EP20K600CF672C6 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K600CF672C8N | EP20K600CF672C6 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $108,00 | $480,00 |
| Device Type | SPLD | — |
| Product Type | FPGA / programmable logic device | — |
| Family | APEX 20KC | APEX 20KC |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | — |
| Package Terminals | 652 pins | — |
| Boîtier | BGA-652, 45 x 45 mm, 1.27 mm pitch | 672-ball FineLine BGA (CF672) |
| Package Description | 672-pin FC-FBGA | — |
| Tension d'alimentation | 1.8 V | — |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | — |
| Fabrication Process | 0.15 µm | — |
| Température de fonctionnement | 0°C to 85°C | 0 °C to +85 °C (commercial) |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| Type de montage | Surface mount | — |
| Statut RoHS | unknown | Non-RoHS (legacy process) |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | SRAM-based, JTAG, EPC16/EPC2 |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Résistance thermique | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Typical Gate Count | — | 600,000 gates |
| Logic Elements (LEs) | — | 24,320 |
| Embedded System Blocks (ESBs) | — | 160 (each 2,048 bits) |
| Maximum Embedded RAM | — | 311,296 bits (311 kbit) |
| Maximum User I/O Pins | — | 508 |
| Package Body Size | — | 27 mm × 27 mm |
| Speed Grade | — | -6 (C6) |
| Core Voltage | — | 1.8 V |
| I/O Standards Supported | — | LVCMOS, LVTTL, HSTL, SSTL, GTL+ |
| Embedded PLLs | — | 4 |
| Process Technology | — | 0.18 µm CMOS, 6 metal layers |