EP2S180F1020I4 vs EP2S130F1020I4 Comparaison
Comparaison détaillée côte à côte de EP2S180F1020I4 par Intel et EP2S130F1020I4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2S180F1020I4 | EP2S130F1020I4 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $11 250,00 | $1 395,00 |
| Series | Stratix II | — |
| Family | Stratix II (EP2S180) | Stratix II |
| Logic Elements | 179,400 | 132,540 |
| Number of LABs/CLBs | 8,970 | — |
| Total RAM Bits | 9,383,040 (8,979,840 per alternate sources) | — |
| Number of I/O | 742 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count per Stratix II EP2S180 datasheet - typically 12] | — |
| Number of PLLs | [DATA_NEEDED: PLL count per EP2S180 datasheet] | — |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | — |
| Maximum Operating Frequency | 711.24 MHz | — |
| Température de fonctionnement | -40C to +100C (Industrial grade, "I4" suffix) | — |
| Boîtier | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) | 1020-ball FC-FBGA (33x33 mm) |
| Type de montage | Surface Mount (BGA) | Surface Mount (FC-FBGA) |
| Niveau MSL | [DATA_NEEDED: MSL rating from Altera packaging spec] | — |
| Statut RoHS | Compliant | Compliant (per distributor listings) |
| Lead-Free | Yes | — |
| Configuration Method | Passive serial, Active serial, Fast passive parallel, JTAG | — |
| Configuration Memory Type | SRAM (volatile; requires external configuration device) | — |
| Supplier Device Package | 1020-FBGA | — |
| Base Part Number | EP2S180 | — |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Speed Grade | — | I (industrial performance) |
| Device Revision | — | 4 |
| Température de jonction en fonctionnement | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |