EP2S180F1020I4 vs EP2S130F1020I4 Сравнение
Подробное сравнение бок о бок EP2S180F1020I4 от Intel и EP2S130F1020I4 от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP2S180F1020I4 | EP2S130F1020I4 |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Obsolete | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $11.250,00 | $1.395,00 |
| Series | Stratix II | — |
| Family | Stratix II (EP2S180) | Stratix II |
| Logic Elements | 179,400 | 132,540 |
| Number of LABs/CLBs | 8,970 | — |
| Total RAM Bits | 9,383,040 (8,979,840 per alternate sources) | — |
| Number of I/O | 742 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count per Stratix II EP2S180 datasheet - typically 12] | — |
| Number of PLLs | [DATA_NEEDED: PLL count per EP2S180 datasheet] | — |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | — |
| Maximum Operating Frequency | 711.24 MHz | — |
| Рабочая температура | -40C to +100C (Industrial grade, "I4" suffix) | — |
| Корпус | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) | 1020-ball FC-FBGA (33x33 mm) |
| Тип монтажа | Surface Mount (BGA) | Surface Mount (FC-FBGA) |
| Уровень MSL | [DATA_NEEDED: MSL rating from Altera packaging spec] | — |
| Статус RoHS | Compliant | Compliant (per distributor listings) |
| Lead-Free | Yes | — |
| Configuration Method | Passive serial, Active serial, Fast passive parallel, JTAG | — |
| Configuration Memory Type | SRAM (volatile; requires external configuration device) | — |
| Supplier Device Package | 1020-FBGA | — |
| Base Part Number | EP2S180 | — |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Speed Grade | — | I (industrial performance) |
| Device Revision | — | 4 |
| Рабочая температура перехода | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |