EP2S180F1020I4 vs EP2S130F1020I4 比較
詳細な並列比較: EP2S180F1020I4 メーカー: Intel および EP2S130F1020I4 メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EP2S180F1020I4 | EP2S130F1020I4 |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | Obsolete | Obsolete |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $11,250.00 | $1,395.00 |
| Series | Stratix II | — |
| Family | Stratix II (EP2S180) | Stratix II |
| Logic Elements | 179,400 | 132,540 |
| Number of LABs/CLBs | 8,970 | — |
| Total RAM Bits | 9,383,040 (8,979,840 per alternate sources) | — |
| Number of I/O | 742 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count per Stratix II EP2S180 datasheet - typically 12] | — |
| Number of PLLs | [DATA_NEEDED: PLL count per EP2S180 datasheet] | — |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | — |
| Maximum Operating Frequency | 711.24 MHz | — |
| 動作温度 | -40C to +100C (Industrial grade, "I4" suffix) | — |
| パッケージ | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) | 1020-ball FC-FBGA (33x33 mm) |
| 実装タイプ | Surface Mount (BGA) | Surface Mount (FC-FBGA) |
| MSLレベル | [DATA_NEEDED: MSL rating from Altera packaging spec] | — |
| RoHS ステータス | Compliant | Compliant (per distributor listings) |
| Lead-Free | Yes | — |
| Configuration Method | Passive serial, Active serial, Fast passive parallel, JTAG | — |
| Configuration Memory Type | SRAM (volatile; requires external configuration device) | — |
| Supplier Device Package | 1020-FBGA | — |
| Base Part Number | EP2S180 | — |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (bits) | — | 6,747,840 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Speed Grade | — | I (industrial performance) |
| Device Revision | — | 4 |
| 動作接合温度 | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |