EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
Référence : EP2SGX60DF780C4N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $485 | $485,00 |
| 5 | $460 | $2 300,00 |
| 25 | $425 | $10 625,00 |
| 100 | $395 | $39 500,00 |
| 250 | $365 | $91 250,00 |
EP2SGX60DF780C4N Présentation
What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs/LEs), programmable interconnect, and dedicated hard IP blocks such as transceivers, block RAM, multipliers, and PLLs. FPGAs occupy the same role in the digital-hierarchy taxonomy as ASICs but allow post-fabrication logic changes. Stratix II GX sits at the top tier of the programmable-logic hierarchy, between mainstream FPGAs and structured ASICs, with embedded multi-gigabit transceivers that previously required external PHY chips.
Key features of the EP2SGX60DF780C4N include 60,440 logic elements organized into 3,022 Logic Array Blocks (LABs), 2,544,192 bits of on-chip RAM, dedicated DSP blocks for high-throughput filtering and FFT, and up to 20 embedded transceivers supporting serial rates up to 6.375 Gbps. The device also exposes 12 full-duplex source-synchronous channels, supports PCI Express x1/x4/x8 hard IP, and integrates four PLL blocks plus 16 global clock networks for robust clock distribution across the fabric.
From a technical-depth perspective, the Stratix II GX architecture replaces the 4-input LUT of earlier Stratix with an adaptive logic module (ALM) that combines two 4-LUTs and a dedicated adder, improving effective logic density by roughly 25 percent versus prior generations. Combined with the 90 nm strained-silicon process and 1.2 V core, the part delivers high Fmax on DSP-heavy designs while still meeting industrial-grade thermal envelopes. The transceiver block supports a wide range of protocols including PCI Express Gen1, Serial RapidIO, CEI-6G, and 10 GbE XAUI through protocol-specific soft IPs.
Typical applications include 10G/40G telecom line cards, ASIC prototyping platforms, high-end broadcast video processing, defense signal-intelligence backplanes, and medical imaging reconstruction. The high pin count and 364 I/O support wide external memory buses (DDR2/QDRII+) and multiple standard connectors simultaneously. Designers should budget 20 percent of logic for clock-domain crossing, apply Quartus II pin-planner constraints early, and ensure the board supplies a 1.2 V VCCH/LVDS-clean supply for the transceiver PHY. This page synthesizes distributor pricing, drop-in Altera/Intel alternatives, and Quartus II design notes that are not aggregated in the standalone datasheet PDF.
Alternatives de remplacement direct pour EP2SGX60DF780C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX60DF780C4N (même facteur de forme et même empreinte) — différant par Speed Grade, Package, RoHS Status, DSP Blocks, Device Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX60CF780C4N
✅ Remplacement direct✓ En stock
$220 / unité
Voir la fiche technique →EP2SGX60DF780C3N
✅ Remplacement direct✓ En stock
$188 / unité
Voir la fiche technique →EP2SGX60DF780C4
✅ Remplacement direct✓ En stock
$1350 / unité
Voir la fiche technique →EP2SGX60DF780C3
✅ Remplacement direct✓ En stock
$218 / unité
Voir la fiche technique →EP2SGX90DF780C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP2SGX60DF780C4N Valeurs maximales et caractéristiques électriques
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| Adaptive Logic Modules (ALMs) | 24,176 |
| User I/Os | 364 |
| Total RAM Bits | 2,544,192 |
| Embedded Multipliers (18x18) | 144 |
| DSP Blocks | 36 |
| Transceivers | Up to 20 (up to 6.375 Gbps) |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Core Voltage | 1.2 V |
| Process Node | 90 nm CMOS |
| Boîtier | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Maximum Internal Frequency | 717 MHz |
| Température de fonctionnement | Commercial 0C to +85C |
| Speed Grade | C4 |
| Statut RoHS | Lead-free (per part suffix N) |
Guide de configuration des broches du EP2SGX60DF780C4N 780-ball fbga (29 x 29 mm, 1.0 mm pitch)
Configuration des broches du EP2SGX60DF780C4N (boîtier 780-ball fbga (29 x 29 mm, 1.0 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX60DF780C4N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX60DF780C4N convient pour 6 applications: 10G/40G Telecom Line Card, ASIC Prototyping Platform, High-End Broadcast Video Processing, Defense Signal-Intelligence Backplane, Medical Imaging Reconstruction, Industrial Automation Controller.
10G/40G Telecom Line Card
The EP2SGX60DF780C4N's 20 transceivers at 6.375 Gbps natively aggregate into 10G XAUI or 40G backplanes without external PHYs, making it ideal for OTU2/OTU3 line cards. With 60,440 logic elements and 144 18x18 multipliers, the FPGA can also perform framer and FEC processing in fabric, reducing BOM cost. The 364 user I/Os sustain wide external buses to QDRII+ packet memory and a network processor. Power budget for 16 active transceivers at 6.375 Gbps is roughly 8 W plus 4 W of fabric, requiring a controlled-impedance stack-up and a solid thermal copper pour beneath the 29 x 29 mm FBGA.
Recommandé
ASIC Prototyping Platform
The 60,440 LE fabric of the EP2SGX60DF780C4N maps to ASICs of roughly 1.5-2.0 M gates, which covers most controller and DSP prototypes. The 2,544,192 RAM bits emulate large register files and scratchpad memories, while 36 DSP blocks accelerate the multiply-accumulate units common in audio and baseband ASICs. Designers partition the ASIC design into FPGA-friendly clock domains and verify at 100-150 MHz operating frequency. Quartus II TimeQuest closure on a C4 speed grade typically requires 2-3 iteration loops, and the high 364 I/O count permits direct access to 32-40 ASIC pins for boundary-scan debugging.
Recommandé
High-End Broadcast Video Processing
The EP2SGX60DF780C4N's combination of 36 DSP blocks and 6.375 Gbps transceivers makes it suitable for uncompressed 3G-SDI/HD-SDI video routers and multi-channel up/down/cross converters. The 364 user I/Os support parallel BT.1120/BT.656 video buses alongside 10-bit component video, while embedded RAM buffers line-store and frame-store data without external SDRAM. Latency through the FPGA fabric is deterministic at 1-2 lines, which is critical for broadcast switching. Designers typically run 8-12 channels of HD-SDI or 3-4 channels of 3G-SDI per device, with the transceiver PHY providing cable equalization for runs up to 120 m of Belden 1694A.
Recommandé
Defense Signal-Intelligence Backplane
The EP2SGX60DF780C4N is well suited to wideband SIGINT receivers where 20 transceivers digitize multi-channel IF inputs and the 60K-LE fabric performs real-time channelization, FFT, and modulation recognition. The 1.2 V core combined with industrial-temperature screening makes the part robust to vibration and thermal stress typical of mobile platforms. Firmware updates can be applied in the field via the Stratix II GX dedicated configuration controller, supporting rapid algorithm iteration. The 780-ball FBGA provides 364 user I/Os to interface with high-speed ADCs, DACs, and a CPU/FPGA interconnect, eliminating the need for a separate glue ASIC in many designs.
Recommandé
Medical Imaging Reconstruction
The 144 18x18 multipliers of the EP2SGX60DF780C4N deliver 36 GMACS of DSP performance, sufficient for CT, MRI, and ultrasound back-projection and iterative reconstruction algorithms in real time. The 2,544,192 bits of on-chip RAM cache line projections and sinograms, allowing the host CPU to focus on display rendering. PCIe hard IP (x1/x4/x8 Gen1) simplifies the host interface to a workstation. The 780-ball FBGA with 364 user I/Os can directly drive a stack of LVDS-channel ADCs and DACs for a 64-channel ultrasound beamformer. Quartus II DSP Builder accelerates the path from MATLAB to FPGA bitstream for OEM medical equipment vendors.
Recommandé
Industrial Automation Controller
The 60,440 logic elements of the EP2SGX60DF780C4N support deterministic motion control loops for multi-axis CNC and robotics platforms, while the 364 user I/Os interface with quadrature encoders, resolver-to-digital converters, and high-speed digital I/O modules. The industrial-temperature variant (EP2SGX60CF780I4N) operates from -40C to +100C, suiting factory-floor enclosures. PCIe hard IP integrates into a PC-based controller, and on-chip transceivers drive industrial Ethernet protocols such as EtherCAT and PROFINET IRT over 100 Mbit copper or fiber. Quartus II Qsys system-integration tool simplifies connecting CPU, memory, and I/O subsystems in a single tool flow.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX60DF780C4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX60CF780C4N | EP2SGX60DF780C3N | EP2SGX60DF780C4 | EP2SGX60DF780C3 | EP2SGX90DF780C4N |
|---|---|---|---|---|---|---|
| Package | 780-ball FBGA (29x29 mm, 1.0 mm pitch) | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same | 780-ball FBGA (29x29 mm, 1.0 mm pitch) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 90,960 |
| Speed Grade | C4 | C4 | C3 (faster) | C4 | C3 (faster) | C4 |
| User I/Os | 364 | 364 | 364 | 364 | 364 | 364 |
| Embedded RAM (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 4,415,040 |
| Embedded Multipliers (18x18) | 144 | 144 | 144 | 144 | 144 | 176 |
| Transceivers (max rate) | 20 (6.375 Gbps) | 20 (6.375 Gbps) | 20 (6.375 Gbps) | 20 (6.375 Gbps) | 20 (6.375 Gbps) | 20 (6.375 Gbps) |
| Operating Temperature | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| RoHS / Lead-Free | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free (N suffix) | Leaded (no N suffix) | Leaded (no N suffix) | Lead-free (N suffix) |
Principaux différenciateurs
- C3 speed grade for tighter timing margin at same footprint (vs EP2SGX60DF780C4N (this part))
- Higher logic density at identical 780-ball footprint (vs EP2SGX60DF780C4N (this part))
- Alternate silicon revision (CF) for second-source supply chain (vs EP2SGX60DF780C4N (this part))
Notes de conception
Estimated: The EP2SGX60DF780C4N at full fabric utilization (60 percent ALMs, 144 multipliers active, 16 transceivers at 6.375 Gbps) draws approximately 12-14 W from VCCINT (1.2 V) plus 4-6 W from VCCH (1.2 V transceiver) plus 1-2 W from VCCPD and VCCIO combined. Designers should budget a 25 W thermal envelope with adequate copper-in-pour and a controlled-impedance stack-up. The 780-ball FBGA's center balls are dedicated VCCH and require a solid 1 oz copper pour on the top layer to spread heat. Quartus II Early Power Estimator (EPE) is mandatory before schematic freeze for accurate rail-by-rail current prediction.
The 780-ball FBGA at 1.0 mm pitch requires a 12-layer stack-up with 4-6 routing layers and dedicated ground/power planes. BGA breakout is best done with 4 mil traces and 8 mil spacing on the top layer, with via-in-pad (VIPPO) recommended for the inner balls to escape from the center of the array. Transceiver differential pairs must be length-matched to within 5 mil and routed on a controlled 100-ohm differential impedance layer. Refer to the Altera AN 521 reference design for the complete breakout and stack-up recommendation. The board also requires a dedicated 1.2 V VCCH island for the transceiver PHY that is decoupled with 0.1 uF and 10 uF capacitors placed within 100 mil of the PHY balls.
Do not confuse the EP2SGX60DF780C4N with the EP2SGX60EF780 package variant - the EF suffix is a different pinout and is not drop-in compatible. Ensure the Quartus II device family setting matches the part's speed grade (C4) before compilation; mixing speed grades can produce a bitstream that fails configuration. The 'N' suffix denotes lead-free (RoHS compliant); older non-N variants still ship with leaded balls and should not be used in RoHS-restricted regions. Finally, never operate the device without a verified 1.2 V VCCH supply on the transceiver balls - missing VCCH can permanently damage the PHY during initial power-up.
For 3.125 Gbps and higher transceiver rates, place AC-coupling capacitors within 200 mil of the EP2SGX60DF780C4N balls and route the transmit pairs with a continuous reference plane on layer 2. Use 4 mil spacing between transmit and receive pairs to minimize crosstalk, and avoid right-angle bends on the differential traces - use 45-degree or curved bends. The reference clock input to the transceiver requires a 100-ohm differential source and a clean 0.1 uF AC-coupling cap. Designers should also route JTAG, MSEL, and configuration pins to a header for board bring-up debugging before locking the schematic.
Informations de conformité
Lead-free per N suffix. Halogen-free status not specified in the provided data - marked unknown. AEC-Q100 not applicable for FPGAs of this generation. RoHS and conflict-minerals statements are taken from the Altera/Intel product page and from the leading distributor listings.
