EP2SGX90EF1152I3 vs EP2SGX90EF1152I2N Comparaison
Comparaison détaillée côte à côte de EP2SGX90EF1152I3 par Intel et EP2SGX90EF1152I2N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2SGX90EF1152I3 | EP2SGX90EF1152I2N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 480,00 | $1 320,00 |
| Series | Stratix II GX | — |
| Logic Elements | 90,960 | 90,960 |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | — |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial (I2) |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | Compliant | Compliant |
| Family | — | Stratix II GX |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Array Blocks (LABs) | — | 4,548 |
| Total Embedded RAM Bits | — | 4,520,448 bits |
| User I/Os | — | 558 |
| Boîtier | — | 1152-BBGA (FC-FBGA, flip-chip) |
| Core Voltage | — | 1.2 V |
| Process Node | — | 90 nm |
| Transceivers | — | Up to 12 high-speed serial channels (family spec) |
| Lead-Free | — | Yes |
| Statut du cycle de vie | — | Active (Stratix II GX family) |