EP2SGX90EF1152I3 vs EP2SGX90EF1152I2N 对比
详细并排对比 EP2SGX90EF1152I3 出自 Intel 和 EP2SGX90EF1152I2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX90EF1152I3 | EP2SGX90EF1152I2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,480.00 | $1,320.00 |
| Series | Stratix II GX | — |
| Logic Elements | 90,960 | 90,960 |
| Adaptive Logic Modules (ALMs) | 558 | — |
| Equivalent Logic Cells (CLBs) | 90,960 | — |
| Total RAM Bits | 4,520,448 | — |
| Maximum Operating Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial (I2) |
| Package Type | 1152-ball FC-FBGA (flip-chip) | — |
| Terminal Form | Ball | — |
| Terminal Pitch | [DATA_NEEDED: ball pitch] | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Configuration Architecture | Enhanced Configuration (EPC) devices supported | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | Compliant | Compliant |
| Family | — | Stratix II GX |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Array Blocks (LABs) | — | 4,548 |
| Total Embedded RAM Bits | — | 4,520,448 bits |
| User I/Os | — | 558 |
| 封装 | — | 1152-BBGA (FC-FBGA, flip-chip) |
| Core Voltage | — | 1.2 V |
| Process Node | — | 90 nm |
| Transceivers | — | Up to 12 high-speed serial channels (family spec) |
| Lead-Free | — | Yes |
| 生命周期状态 | — | Active (Stratix II GX family) |