EP3C40F780C7 vs EP3C40F780C8 Comparaison
Comparaison détaillée côte à côte de EP3C40F780C7 par Intel et EP3C40F780C8 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3C40F780C7 | EP3C40F780C8 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $139,50 | $99,95 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Number of Logic Cells | 39,600 | — |
| Total Memory Bits | 1,161,216 bits | 1,161,216 bits (1134 Kbit) |
| Embedded 18x18 Multipliers | 126 | 126 |
| Number of PLLs | 4 | — |
| User I/O Count | 535 | — |
| I/O Banks | 8 | — |
| Boîtier | 780-ball FBGA (F780) | 780-ball FBGA (FineLine BGA) |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V | — |
| Température de fonctionnement | 0C to +85C (Commercial) | — |
| Speed Grade | C7 | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) |
| Process Technology | 60 nm TSMC low-power CMOS | 65 nm low-power CMOS |
| Configuration | Active Serial / Passive Parallel (JTAG) | Serial (AS) / Parallel (AP) / JTAG |
| Niveau MSL | 3 (168 hours) | — |
| Statut RoHS | Compliant | Compliant |
| Series | — | EP3C40 |
| Logic Elements | — | 39,600 |
| Embedded Memory | — | M9K blocks, 486 Kbit total (per family datasheet) |
| General Purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O Pins | — | 535 |
| User I/O Banks | — | [DATA_NEEDED: user I/O bank count] |
| Supported Memory Interfaces | — | DDR, DDR2, QDRII SRAM (via dedicated PHY) |
| Type de montage | — | Surface Mount (BGA) |