EP3C40F780C7 vs EP3C40F780C8 Comparison
Detailed side-by-side comparison of EP3C40F780C7 by Intel and EP3C40F780C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F780C7 | EP3C40F780C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $139.50 | $99.95 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | β |
| Number of Logic Cells | 39,600 | β |
| Total Memory Bits | 1,161,216 bits | 1,161,216 bits (1134 Kbit) |
| Embedded 18x18 Multipliers | 126 | 126 |
| Number of PLLs | 4 | β |
| User I/O Count | 535 | β |
| I/O Banks | 8 | β |
| Package | 780-ball FBGA (F780) | 780-ball FBGA (FineLine BGA) |
| Package Dimensions | 29 x 29 mm | β |
| Ball Pitch | 1.0 mm | β |
| Core Voltage (VCCINT) | 1.2 V | β |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V | β |
| Operating Temperature | 0C to +85C (Commercial) | β |
| Speed Grade | C7 | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) |
| Process Technology | 60 nm TSMC low-power CMOS | 65 nm low-power CMOS |
| Configuration | Active Serial / Passive Parallel (JTAG) | Serial (AS) / Parallel (AP) / JTAG |
| MSL Level | 3 (168 hours) | β |
| RoHS Status | Compliant | Compliant |
| Series | β | EP3C40 |
| Logic Elements | β | 39,600 |
| Embedded Memory | β | M9K blocks, 486 Kbit total (per family datasheet) |
| General Purpose PLLs | β | 4 |
| Global Clock Networks | β | 20 |
| Maximum User I/O Pins | β | 535 |
| User I/O Banks | β | [DATA_NEEDED: user I/O bank count] |
| Supported Memory Interfaces | β | DDR, DDR2, QDRII SRAM (via dedicated PHY) |
| Mounting Type | β | Surface Mount (BGA) |