EP3CLS70F780C7N vs EP3C80F780C7N Comparaison
Comparaison détaillée côte à côte de EP3CLS70F780C7N par Intel et EP3C80F780C7N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3CLS70F780C7N | EP3C80F780C7N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $318,75 | $260,00 |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | — |
| Logic Array Blocks | 47,452 | — |
| Total Memory Bits | 3,068,928 bits | — |
| Embedded Multipliers (18x18) | 200 | — |
| Maximum User I/O | 413 | — |
| User I/O (this package) | 413 | — |
| Boîtier | 780-ball FBGA (F780) | — |
| Pins/Balls | 780 | — |
| Core Voltage | 1.2 V | — |
| Tension d'alimentation | 1.2 V | — |
| Process Node | 60 nm | — |
| Température de fonctionnement | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Transceivers | 0 (no high-speed transceivers) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Statut RoHS | Compliant | — |
| Series | — | Cyclone III |
| Family Name | — | Cyclone III |
| Number of Logic Elements | — | 81,264 |
| Number of Logic Cells / CLBs | — | 81,264 |
| Total RAM Bits | — | 2,810,880 |
| Number of I/O | — | 429 |
| Number of Gates | — | [DATA_NEEDED: gates count] |
| Voltage - Supply | — | 1.15 V to 3.3 V (core and I/O banks) |
| Boîtier / Format | — | 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch |
| Supplier Device Package | — | 780-FBGA |
| Process Technology | — | 65 nm CMOS (TSMC low-k) |
| Number of PLLs | — | 4 |
| Number of Multipliers (18x18) | — | 288 |
| Maximum Frequency | — | 472.5 MHz |
| Lead Free / RoHS | — | Lead Free (per LCSC listing) |
| Configuration Method | — | JTAG, Serial, Parallel (via Quartus Prime / Quartus II) |