EP3CLS70F780C7N vs EP3C80F780C7N Vergleich
Detaillierter Direktvergleich von EP3CLS70F780C7N von Intel und EP3C80F780C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS70F780C7N | EP3C80F780C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $318,75 | $260,00 |
| Family | Cyclone III LS | — |
| Logic Elements | 70,208 | — |
| Logic Array Blocks | 47,452 | — |
| Total Memory Bits | 3,068,928 bits | — |
| Embedded Multipliers (18x18) | 200 | — |
| Maximum User I/O | 413 | — |
| User I/O (this package) | 413 | — |
| Gehäuse | 780-ball FBGA (F780) | — |
| Pins/Balls | 780 | — |
| Core Voltage | 1.2 V | — |
| Versorgungsspannung | 1.2 V | — |
| Process Node | 60 nm | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Transceivers | 0 (no high-speed transceivers) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | — |
| Series | — | Cyclone III |
| Family Name | — | Cyclone III |
| Number of Logic Elements | — | 81,264 |
| Number of Logic Cells / CLBs | — | 81,264 |
| Total RAM Bits | — | 2,810,880 |
| Number of I/O | — | 429 |
| Number of Gates | — | [DATA_NEEDED: gates count] |
| Voltage - Supply | — | 1.15 V to 3.3 V (core and I/O banks) |
| Gehäuse / Bauform | — | 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch |
| Supplier Device Package | — | 780-FBGA |
| Process Technology | — | 65 nm CMOS (TSMC low-k) |
| Number of PLLs | — | 4 |
| Number of Multipliers (18x18) | — | 288 |
| Maximum Frequency | — | 472.5 MHz |
| Lead Free / RoHS | — | Lead Free (per LCSC listing) |
| Configuration Method | — | JTAG, Serial, Parallel (via Quartus Prime / Quartus II) |