EP3SE260H780C2N vs EP3SE50F780C2N Comparaison
Comparaison détaillée côte à côte de EP3SE260H780C2N par Intel et EP3SE50F780C2N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3SE260H780C2N | EP3SE50F780C2N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3 600,00 | $278,90 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 47,500 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | 488 |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.9 V to 1.1 V |
| Boîtier | 780-BGA FCBGA | 780-ball FC-FBGA (FBGA-780) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Plage de température de fonctionnement | Commercial (0C to +85C) | — |
| Speed Grade | C2 | C2 |
| Niveau MSL | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | — |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Family | — | Stratix III Enhanced (E) |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| Embedded Memory | — | 5,760,000 bits |
| DSP Blocks | — | Yes (number not in source data) |
| Transceiver Channels | — | 12 (data rate not in source data) |
| Process Technology | — | 65 nm CMOS |
| Maximum Internal Clock Frequency | — | 600 MHz |
| Temperature Grade | — | Commercial (C2) |
| Lead Free | — | Yes |
| Configuration Mode | — | Passive Serial / Fast Passive Parallel |