EP3SE260H780C2N vs EP3SE50F780C2N 对比
详细并排对比 EP3SE260H780C2N 出自 Intel 和 EP3SE50F780C2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260H780C2N | EP3SE50F780C2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3,600.00 | $278.90 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 47,500 |
| LABs / CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 488 | 488 |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Core Voltage | 0.9 V | 0.9 V to 1.1 V |
| 封装 | 780-BGA FCBGA | 780-ball FC-FBGA (FBGA-780) |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| 工作温度范围 | Commercial (0C to +85C) | — |
| Speed Grade | C2 | C2 |
| MSL 等级 | 3 (168 hours) | — |
| Reflow Peak Time Max | 40 s | — |
| RoHS 状态 | [DATA_NEEDED: rohs status] | — |
| Lead-Free | [DATA_NEEDED: lead-free] | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 780 | — |
| Process Node | 40 nm | — |
| Family | — | Stratix III Enhanced (E) |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| Embedded Memory | — | 5,760,000 bits |
| DSP Blocks | — | Yes (number not in source data) |
| Transceiver Channels | — | 12 (data rate not in source data) |
| Process Technology | — | 65 nm CMOS |
| Maximum Internal Clock Frequency | — | 600 MHz |
| Temperature Grade | — | Commercial (C2) |
| Lead Free | — | Yes |
| Configuration Mode | — | Passive Serial / Fast Passive Parallel |