EPF10K130EFC484-3 vs EPF10K100EFC484-3N Comparaison
Comparaison détaillée côte à côte de EPF10K130EFC484-3 par Intel et EPF10K100EFC484-3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K130EFC484-3 | EPF10K100EFC484-3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $178,92 | $142,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 6,656 | — |
| Typical Gate Count | 130,000 system gates | — |
| Logic Array Blocks (LABs) | 832 | 624 |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | — |
| Maximum User I/O | 369 | — |
| Supply Voltage (Core) | 3.3 V | — |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | — |
| Propagation Delay | 0.6 ns (per LE) | — |
| Speed Grade | -3 | -3 (fastest commercial bin) |
| Température de fonctionnement | 0 C to +70 C (commercial) | — |
| Boîtier | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA (FC484 / FBGA-484) |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | SRAM (external EPROM/Flash/JTAG required at power-up) |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Family | CMOS (SRAM-based) | — |
| Logic Elements / Cells | — | 4992 |
| Total Gates | — | 100,000 |
| Embedded Memory (EAB) | — | 49,152 bits (12 EABs) |
| User I/Os | — | 338 |
| Process Technology | — | 0.22 µm CMOS |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Voltage (VCCIO) | — | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) |
| Internal Performance | — | 200 MHz |
| Temperature Grade | — | Commercial (0 °C to +70 °C) |
| Lead-Free / RoHS | — | Yes (N suffix = lead-free) |