EPF10K130EFC484-3 vs EPF10K100EFC484-3N Comparação
Comparação detalhada lado a lado de EPF10K130EFC484-3 por Intel e EPF10K100EFC484-3N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EPF10K130EFC484-3 | EPF10K100EFC484-3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | NRND | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $178,92 | $142,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 6,656 | — |
| Typical Gate Count | 130,000 system gates | — |
| Logic Array Blocks (LABs) | 832 | 624 |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | — |
| Maximum User I/O | 369 | — |
| Supply Voltage (Core) | 3.3 V | — |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | — |
| Propagation Delay | 0.6 ns (per LE) | — |
| Speed Grade | -3 | -3 (fastest commercial bin) |
| Temperatura de operação | 0 C to +70 C (commercial) | — |
| Encapsulamento | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA (FC484 / FBGA-484) |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | SRAM (external EPROM/Flash/JTAG required at power-up) |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Family | CMOS (SRAM-based) | — |
| Logic Elements / Cells | — | 4992 |
| Total Gates | — | 100,000 |
| Embedded Memory (EAB) | — | 49,152 bits (12 EABs) |
| User I/Os | — | 338 |
| Process Technology | — | 0.22 µm CMOS |
| Core Voltage (VCCINT) | — | 2.5 V |
| I/O Voltage (VCCIO) | — | MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank) |
| Internal Performance | — | 200 MHz |
| Temperature Grade | — | Commercial (0 °C to +70 °C) |
| Lead-Free / RoHS | — | Yes (N suffix = lead-free) |