EPF10K200SBC600-1 vs EPF10K200EBC600-2 Comparaison
Comparaison détaillée côte à côte de EPF10K200SBC600-1 par Intel et EPF10K200EBC600-2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 ObsoleteComparaison des spécifications
| Paramètre | EPF10K200SBC600-1 | EPF10K200EBC600-2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $425,00 | $198,00 |
| Family | FLEX-10KS | — |
| Series | EPF10K200 | FLEX-10KE |
| Logic Elements / Cells | 9,984 | — |
| Gate Count (typical) | 200,000 gates | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Number of User I/Os | 470 | — |
| Number of Logic Cells | 4,992 | — |
| Embedded RAM (bits) | 24,576 (across EABs) | — |
| Max Internal Frequency | 250 MHz | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Process Technology | 0.22 µm CMOS | 0.30 µm CMOS |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (typ. 2.5 V) | — |
| Speed Grade | -1 (fastest commercial) | — |
| Température de fonctionnement | 0 °C to 70 °C (Commercial) | 0°C to +70°C (Commercial) |
| Boîtier | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch | — |
| Type de montage | Surface Mount | Surface Mount |
| JTAG Support | IEEE Std 1149.1 | — |
| Configuration | Serial via EPC2/EPC8 configuration devices | — |
| Statut RoHS | Non-compliant (per third-party listing) | unknown |
| Logic Family | — | CMOS (SRAM-based) |
| Typical Gate Count | — | 200,000 gates |
| Logic Elements (LEs) | — | 9984 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Maximum User I/O | — | 470 pins |
| Tension d'alimentation | — | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Package Dimensions | — | 45 × 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Configuration Method | — | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | — | Obsolete |