EPF10K200SBC600-1 vs EPF10K200EBC600-2 Comparison
Detailed side-by-side comparison of EPF10K200SBC600-1 by Intel and EPF10K200EBC600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 ObsoleteSpecification Comparison
| Parameter | EPF10K200SBC600-1 | EPF10K200EBC600-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $425.00 | $198.00 |
| Family | FLEX-10KS | β |
| Series | EPF10K200 | FLEX-10KE |
| Logic Elements / Cells | 9,984 | β |
| Gate Count (typical) | 200,000 gates | β |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Number of User I/Os | 470 | β |
| Number of Logic Cells | 4,992 | β |
| Embedded RAM (bits) | 24,576 (across EABs) | β |
| Max Internal Frequency | 250 MHz | β |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Process Technology | 0.22 Β΅m CMOS | 0.30 Β΅m CMOS |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (typ. 2.5 V) | β |
| Speed Grade | -1 (fastest commercial) | β |
| Operating Temperature | 0 Β°C to 70 Β°C (Commercial) | 0Β°C to +70Β°C (Commercial) |
| Package | 600-ball BGA, 45 Γ 45 mm, 1.27 mm pitch | β |
| Mounting Type | Surface Mount | Surface Mount |
| JTAG Support | IEEE Std 1149.1 | β |
| Configuration | Serial via EPC2/EPC8 configuration devices | β |
| RoHS Status | Non-compliant (per third-party listing) | unknown |
| Logic Family | β | CMOS (SRAM-based) |
| Typical Gate Count | β | 200,000 gates |
| Logic Elements (LEs) | β | 9984 |
| Embedded Memory (EAB) | β | 98304 bits (96 Kbits) |
| Maximum User I/O | β | 470 pins |
| Supply Voltage | β | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | β | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | β | 600-ball BGA (BGA-600) |
| Package Dimensions | β | 45 Γ 45 mm |
| Ball Pitch | β | 1.27 mm |
| Package Height | β | 1.1 mm max |
| Configuration Method | β | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | β | Obsolete |