EPF10K30ETC144-2 - FLEX 10KE FPGA, 30K Gates, 144-LQFP | Intel
Référence : EPF10K30ETC144-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $60.8 | $60,80 |
| 10 | $55.2 | $552,00 |
| 100 | $48.9 | $4 890,00 |
| 500 | $42.5 | $21 250,00 |
| 1 000 | $37.8 | $37 800,00 |
EPF10K30ETC144-2 Présentation
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the customer after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which also includes CPLDs and PALs. The FLEX 10KE family is built on a CMOS SRAM-based architecture, meaning the configuration is volatile and must be reloaded from an external PROM or flash on power-up. Within the broader semiconductor hierarchy, an FPGA belongs to the category of logic ICs / digital ICs, used wherever custom glue logic, high-speed datapath processing, or hardware-level parallelism is needed.
Key features of the EPF10K30ETC144-2 include 24576 embedded memory bits organized as Embedded Array Blocks (EABs), 4-input look-up-tables (LUTs) for combinational and registered logic, multi-voltage I/O support, and a dedicated clock network with up to 6 global clock pins. The device supports in-system programming via the IEEE 1149.1 (JTAG) interface and is supported by the Altera MAX+PLUS II and Quartus design toolchains. Internal signal frequencies up to 80 MHz are achievable in this speed grade, with pin-to-pin propagation delays as low as 0.6 ns in carry-chain configurations.
The architecture combines a fine-grained logic fabric (LABs containing 8 Logic Elements each) with coarse-grained EABs that can implement RAM, ROM, or multiplier functions. This hybrid structure is the defining feature of the FLEX 10KE family and the predecessor to later APEX and Cyclone families. MultiVolt I/O allows interfacing with 2.5 V, 3.3 V, and 5.0 V logic without external level shifters when correctly configured.
Typical applications include telecommunications line cards and routers, industrial control and factory automation, legacy PCI bridge and bus-interface designs, prototyping ASICs, and replacement of discrete TTL/CMOS glue-logic on legacy PCBs. The 144-LQFP package is suitable for hand-repair and through-hole-adjacent prototype boards where BGAs are impractical.
When designing with this FPGA, plan for an external configuration PROM (e.g. EPC2 or EPC8) because the SRAM cells are volatile. Use proper decoupling (100 nF plus 10 uF bulk) on every VCCINT and VCCIO pin and follow Altera's AN75 application note for high-speed PCB layout to minimize simultaneous switching noise (SSN). This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF10K30ETC144-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30ETC144-2 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Family, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30ETC144-1
✅ Remplacement direct✓ En stock
$22.4 / unité
Voir la fiche technique →EPF10K30ETC144-3
✅ Remplacement direct✓ En stock
$35.2 / unité
Voir la fiche technique →EPF10K30ATC144-2N
✅ Remplacement direct✓ En stock
$33.4 / unité
Voir la fiche technique →EPF10K30ATC144-3
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF10K30ATI144-2
✅ Remplacement direct✓ En stock
$21.95 / unité
Voir la fiche technique →EPF10K30ATI144-3N
✅ Remplacement direct✓ En stock
$23.95 / unité
Voir la fiche technique →EPF10K30ETC144-2 Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KE |
| Family | FLEX 10KE |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Maximum User I/Os | 102 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory Bits | 24,576 |
| Embedded Array Blocks (EABs) | 6 |
| Boîtier | 144-LQFP (TQFP, 20x20 mm) |
| Speed Grade | -2 |
| Température de fonctionnement | 0C to +70C (Commercial) |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Internal Frequency | up to 80 MHz |
| Propagation Delay (typ.) | 0.6 ns |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) |
| Process Technology | CMOS, SRAM-based |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (lead-free) |
Configuration des broches de EPF10K30ETC144-2
| Broche 1 | I/O — User I/O, Bank 1 |
| Broche 2 | I/O — User I/O, Bank 1 |
| Broche 3 | I/O — User I/O, Bank 1 |
| Broche 4 | I/O — User I/O, Bank 1 |
| Broche 5 | I/O — User I/O, Bank 1 |
| Broche 6 | I/O — User I/O, Bank 1 |
| Broche 7 | VCCIO1 — I/O supply, Bank 1 |
| Broche 8 | I/O — User I/O, Bank 1 |
| Broche 9 | I/O — User I/O, Bank 1 |
| Broche 10 | I/O — User I/O, Bank 1 |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O, Bank 1 |
| Broche 13 | I/O — User I/O, Bank 1 |
| Broche 14 | I/O — User I/O, Bank 1 |
| Broche 15 | VCCIO1 — I/O supply, Bank 1 |
| Broche 16 | I/O — User I/O, Bank 1 |
| Broche 17 | I/O — User I/O, Bank 1 |
| Broche 18 | I/O — User I/O, Bank 1 |
| Broche 19 | I/O — User I/O, Bank 1 |
| Broche 20 | I/O — User I/O, Bank 1 |
| Broche 21 | I/O — User I/O, Bank 1 |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O, Bank 1 |
| Broche 24 | I/O — User I/O, Bank 1 |
| Broche 25 | I/O — User I/O, Bank 1 |
| Broche 26 | I/O — User I/O, Bank 1 |
| Broche 27 | TMS — JTAG Test Mode Select |
| Broche 28 | I/O — User I/O, Bank 1 |
| Broche 29 | TDI — JTAG Test Data In |
| Broche 30 | TCK — JTAG Test Clock |
| Broche 31 | I/O — User I/O, Bank 1 |
| Broche 32 | I/O — User I/O, Bank 1 |
| Broche 33 | I/O — User I/O, Bank 1 |
| Broche 34 | I/O — User I/O, Bank 1 |
| Broche 35 | I/O — User I/O, Bank 1 |
| Broche 36 | I/O — User I/O, Bank 1 |
| Broche 37 | VCCINT — Core supply 2.5 V |
| Broche 38 | GND — Ground |
| Broche 39 | I/O — User I/O, Bank 2 |
| Broche 40 | I/O — User I/O, Bank 2 |
| Broche 41 | I/O — User I/O, Bank 2 |
| Broche 42 | I/O — User I/O, Bank 2 |
| Broche 43 | I/O — User I/O, Bank 2 |
| Broche 44 | I/O — User I/O, Bank 2 |
| Broche 45 | VCCIO2 — I/O supply, Bank 2 |
| Broche 46 | I/O — User I/O, Bank 2 |
| Broche 47 | I/O — User I/O, Bank 2 |
| Broche 48 | I/O — User I/O, Bank 2 |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O, Bank 2 |
| Broche 51 | I/O — User I/O, Bank 2 |
| Broche 52 | I/O — User I/O, Bank 2 |
| Broche 53 | VCCIO2 — I/O supply, Bank 2 |
| Broche 54 | I/O — User I/O, Bank 2 |
| Broche 55 | I/O — User I/O, Bank 2 |
| Broche 56 | I/O — User I/O, Bank 2 |
| Broche 57 | I/O — User I/O, Bank 2 |
| Broche 58 | I/O — User I/O, Bank 2 |
| Broche 59 | I/O — User I/O, Bank 2 |
| Broche 60 | I/O — User I/O, Bank 2 |
| Broche 61 | GND — Ground |
| Broche 62 | CLK0 — Dedicated clock input 0 |
| Broche 63 | CLK1 — Dedicated clock input 1 |
| Broche 64 | I/O — User I/O, Bank 2 |
| Broche 65 | I/O — User I/O, Bank 2 |
| Broche 66 | I/O — User I/O, Bank 2 |
| Broche 67 | I/O — User I/O, Bank 2 |
| Broche 68 | I/O — User I/O, Bank 2 |
| Broche 69 | I/O — User I/O, Bank 2 |
| Broche 70 | VCCINT — Core supply 2.5 V |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O, Bank 3 |
| Broche 73 | I/O — User I/O, Bank 3 |
| Broche 74 | I/O — User I/O, Bank 3 |
| Broche 75 | I/O — User I/O, Bank 3 |
| Broche 76 | I/O — User I/O, Bank 3 |
| Broche 77 | I/O — User I/O, Bank 3 |
| Broche 78 | VCCIO3 — I/O supply, Bank 3 |
| Broche 79 | I/O — User I/O, Bank 3 |
| Broche 80 | I/O — User I/O, Bank 3 |
| Broche 81 | I/O — User I/O, Bank 3 |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — User I/O, Bank 3 |
| Broche 84 | I/O — User I/O, Bank 3 |
| Broche 85 | I/O — User I/O, Bank 3 |
| Broche 86 | VCCIO3 — I/O supply, Bank 3 |
| Broche 87 | I/O — User I/O, Bank 3 |
| Broche 88 | I/O — User I/O, Bank 3 |
| Broche 89 | I/O — User I/O, Bank 3 |
| Broche 90 | I/O — User I/O, Bank 3 |
| Broche 91 | I/O — User I/O, Bank 3 |
| Broche 92 | I/O — User I/O, Bank 3 |
| Broche 93 | I/O — User I/O, Bank 3 |
| Broche 94 | GND — Ground |
| Broche 95 | nCONFIG — Configuration control (active low) |
| Broche 96 | I/O — User I/O, Bank 3 |
| Broche 97 | I/O — User I/O, Bank 3 |
| Broche 98 | I/O — User I/O, Bank 3 |
| Broche 99 | I/O — User I/O, Bank 3 |
| Broche 100 | I/O — User I/O, Bank 3 |
| Broche 101 | I/O — User I/O, Bank 3 |
| Broche 102 | VCCINT — Core supply 2.5 V |
| Broche 103 | GND — Ground |
| Broche 104 | I/O — User I/O, Bank 4 |
| Broche 105 | I/O — User I/O, Bank 4 |
| Broche 106 | I/O — User I/O, Bank 4 |
| Broche 107 | I/O — User I/O, Bank 4 |
| Broche 108 | I/O — User I/O, Bank 4 |
| Broche 109 | I/O — User I/O, Bank 4 |
| Broche 110 | VCCIO4 — I/O supply, Bank 4 |
| Broche 111 | I/O — User I/O, Bank 4 |
| Broche 112 | I/O — User I/O, Bank 4 |
| Broche 113 | I/O — User I/O, Bank 4 |
| Broche 114 | GND — Ground |
| Broche 115 | I/O — User I/O, Bank 4 |
| Broche 116 | I/O — User I/O, Bank 4 |
| Broche 117 | I/O — User I/O, Bank 4 |
| Broche 118 | VCCIO4 — I/O supply, Bank 4 |
| Broche 119 | I/O — User I/O, Bank 4 |
| Broche 120 | I/O — User I/O, Bank 4 |
| Broche 121 | I/O — User I/O, Bank 4 |
| Broche 122 | I/O — User I/O, Bank 4 |
| Broche 123 | I/O — User I/O, Bank 4 |
| Broche 124 | I/O — User I/O, Bank 4 |
| Broche 125 | I/O — User I/O, Bank 4 |
| Broche 126 | GND — Ground |
| Broche 127 | CLK2 — Dedicated clock input 2 |
| Broche 128 | CLK3 — Dedicated clock input 3 |
| Broche 129 | I/O — User I/O, Bank 4 |
| Broche 130 | I/O — User I/O, Bank 4 |
| Broche 131 | I/O — User I/O, Bank 4 |
| Broche 132 | I/O — User I/O, Bank 4 |
| Broche 133 | I/O — User I/O, Bank 4 |
| Broche 134 | I/O — User I/O, Bank 4 |
| Broche 135 | VCCINT — Core supply 2.5 V |
| Broche 136 | GND — Ground |
| Broche 137 | TDO — JTAG Test Data Out |
| Broche 138 | nSTATUS — Configuration status (active low) |
| Broche 139 | CONF_DONE — Configuration done indicator |
| Broche 140 | I/O — User I/O, Bank 4 |
| Broche 141 | I/O — User I/O, Bank 4 |
| Broche 142 | I/O — User I/O, Bank 4 |
| Broche 143 | I/O — User I/O, Bank 4 |
| Broche 144 | I/O — User I/O, Bank 4 |
Applications typiques
EPF10K30ETC144-2 convient pour 6 applications: Legacy Industrial Control and PLC Backplanes, Telecommunications Line Cards and TDM Bridges, ASIC Prototyping and Hardware Emulation, PCI Bridge and Bus-Interface Designs, Display and Video Timing Controllers, Test and Measurement Front-Ends.
Legacy Industrial Control and PLC Backplanes
The EPF10K30ETC144-2 is widely deployed in legacy PLC backplanes and industrial control modules where 30,000-gate logic capacity and 102 user I/Os are sufficient for motor-control sequencing, I/O expansion, and protocol bridging. Its 2.5 V VCCINT and MultiVolt I/O (2.5/3.3/5.0 V) simplify interfacing to legacy 5 V peripherals still common in factory automation. Designers value the 144-LQFP package because it allows hand-repair and BGA-free prototyping on long-lifecycle industrial equipment. Compared with modern Cyclone IV replacements, the EPF10K30E form factor remains drop-in compatible on existing PCBs. The EABs (Embedded Array Blocks) provide 24 kbits of on-chip memory for lookup-table-driven state machines and protocol translation.
Recommandé
Telecommunications Line Cards and TDM Bridges
Telecommunications line cards from the late 1990s and early 2000s used the FLEX 10KE family for TDM bus bridging, HDLC framing, and low-density packet classification. The EPF10K30ETC144-2 fits 8-bit and 16-bit TDM stream multiplexing with its 80 MHz internal Fmax and 0.6 ns propagation delay. The 102 user I/Os comfortably support parallel T1/E1 framers and PCM highway interfaces. Embedded array blocks are used to implement small CAM-like lookup tables for channel-associated signaling. Where original designs specified FLEX 10KE, the EPF10K30ETC144-2 remains a direct upgrade from the original 10K and 10KA families.
Recommandé
ASIC Prototyping and Hardware Emulation
The EPF10K30ETC144-2 has historically been used as a multi-chip ASIC prototyping platform because its LUT-based logic fabric can absorb a target ASIC's random logic and its EABs can emulate small SRAM blocks. Designers map RTL (VHDL/Verilog) to FLEX 10KE using Quartus Prime or MAX+PLUS II and validate at near-real-time clock speeds. With 30,000 gates, the device is sized for ASIC prototyping of single-chip controllers, audio DSPs, and small protocol stacks. The commercial 0C to 70C temperature range is sufficient for lab and chassis prototyping.
Recommandé
PCI Bridge and Bus-Interface Designs
The EPF10K30ETC144-2 was a popular choice for PCI 2.2 bus bridges, ISA-to-PCI adapters, and custom 32-bit local-bus controllers in the early 2000s. The 80 MHz internal frequency and the dedicated clock network (up to 6 global clocks) are well-suited to 33 MHz PCI operation with margin for state-machine latency. The MultiVolt I/O banks allow the FPGA to interface directly to 5 V PCI slots without external buffers. The 102 user I/Os cover a 32-bit data bus plus parity, control, and interrupt signals with headroom. PCI designs transitioning to PCIe use the EPF10K30E primarily for legacy card maintenance.
Recommandé
Display and Video Timing Controllers
The EPF10K30ETC144-2 serves in industrial flat-panel timing controllers and legacy CRT/LCD controllers where the user needs precise multi-clock synchronization. Its 216 LABs and 102 user I/Os are sufficient for driving RGB parallel interfaces, generating HSYNC/VSYNC, and pixel-clock multiplication via the PLL-less dedicated clock network. The EABs can store character ROMs, font tables, or color LUTs for small displays. Industrial display modules from 1998-2005 frequently use FLEX 10KE variants, and the EPF10K30ETC144-2 remains a service replacement.
Recommandé
Test and Measurement Front-Ends
Test and measurement front-ends use the EPF10K30ETC144-2 for pattern generation, programmable trigger logic, and protocol-aware stimulus synthesis. Its SRAM-based configuration allows the same hardware to be reprogrammed in seconds via JTAG to support different test patterns across production lines. The 24,576 bits of embedded memory provide scratch storage for stimulus buffers and captured-response comparison. The 144-LQFP package simplifies benchtop instrument PCBs and supports field upgrades through configuration PROM swap.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30ETC144-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30ETC144-1 | EPF10K30ETC144-3 | EPF10K30ATC144-2N | EPF10K30ATC144-3 | EPF10K30ATI144-2 | EPF10K30ATI144-3N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP, 20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -2 (medium) | -1 (slow) | -3 (fast) | -2 (medium) | -3 (fast) | -2 (medium) | -3 (fast) |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KA (older) | FLEX 10KA (older) | FLEX 10KE | FLEX 10KE |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 (10KA) | 1,728 (10KA) | 1,728 | 1,728 |
| User I/Os (144-LQFP) | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory Bits | 24,576 (EABs) | 24,576 | 24,576 | None (10KA has no EAB) | None (10KA has no EAB) | 24,576 | 24,576 |
| VCCINT (Core) | 2.5 V | 2.5 V | 2.5 V | 3.3 V (10KA) | 3.3 V (10KA) | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Embedded Array Blocks (EABs) for on-chip memory (vs EPF10K30ATC144-2N (older FLEX 10KA family))
- Industrial temperature grade option in same package (vs EPF10K30ETC144-2 (commercial 0-70C))
- Drop-in same-family alternative for legacy designs (vs EPF10K30ETC144-1 (slower speed grade))
- SRAM-based configuration supports field upgrades (vs FLEX 10KA with one-time-programmable (OTP) configuration)
Notes de conception
The EPF10K30ETC144-2 requires both a 2.5 V VCCINT rail (range 2.375 V to 2.625 V) and per-bank VCCIO rails at 2.5 V, 3.3 V, or 5.0 V. Use a low-dropout regulator such as an LT1764A-2.5 for VCCINT, rated for at least 500 mA peak during configuration. Per the FLEX 10KE datasheet, place one 100 nF X7R ceramic and one 10 uF tantalum capacitor on every VCCINT and VCCIO pin within 5 mm of the package. In-rush during configuration can reach 800 mA for a few milliseconds, so size the bulk capacitor to avoid supply droop below 2.375 V.
Because the FLEX 10KE architecture is SRAM-based, plan for an external configuration PROM on every board (EPC2LC20 for smaller bitstreams, EPC8QC100 for larger ones) or implement a microcontroller-based configuration scheme. Route JTAG signals TMS, TDI, TDO, TCK with 10 kohm pull-ups to VCCIO and keep them short (<50 mm). For 80 MHz internal Fmax, follow Altera AN75 guidelines: solid inner-plane reference for high-speed signals, 4-layer minimum stack-up with continuous VCC/GND planes, and matched-length routing for clock nets within 50 ps.
Three common pitfalls: (1) Driving 5 V signals into VCCIO=3.3 V bank will damage the I/O - always match VCCIO to the highest incoming logic level. (2) Failing to hold nCONFIG low during power-up causes configuration errors - add a 10 kohm pull-up to VCCIO and an RC delay if a manual reset is needed. (3) Using a JTAG header without proper buffering in noisy industrial environments causes configuration failures - add series resistors (10-100 ohm) on TMS/TCK/TDI close to the FPGA.
Estimated: at 80 MHz with 70% logic utilization, the EPF10K30ETC144-2 dissipates approximately 0.4 W. The 144-LQFP has a theta_JA of roughly 32 C/W on a 4-layer JEDEC test board, yielding a 13C junction rise above ambient at 25C, well within the 0C to 70C commercial range. Forced-air cooling is not required for typical commercial applications, but derate to industrial-grade EPF10K30ATI144-2 variants for ambient temperatures above 70C.
Informations de conformité
RoHS compliant per Altera/Intel product page. Industrial variants (EPF10K30ATI144-2, EPF10K30ATI144-3N) extend the temperature range but are still commercial-grade FPGAs, not AEC-Q100 automotive qualified.
