EPF10K50ETC144-3 vs EPF10K30ETC144-3N Comparaison
Comparaison détaillée côte à côte de EPF10K50ETC144-3 par Intel et EPF10K30ETC144-3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K50ETC144-3 | EPF10K30ETC144-3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $29,90 | $26,75 |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gate Count | 50,000 gates | — |
| Logic Elements / Cells | 2,880 | 1,728 |
| Total Memory Bits | 40,960 bits | — |
| Logic Array Blocks (LABs) | 360 | 216 |
| User I/O Pins (this package) | 102 | — |
| Max User I/O (family) | 274 pins | — |
| Nombre de broches | 144 | 144 |
| Package Type | TQFP-144 (also referred to as 144-LQFP) | TQFP-144 (22 × 22 mm, 0.5 mm pitch) |
| Propagation Delay | 0.6 ns | 0.6 ns (typical) |
| Maximum Internal Frequency | 166.67 MHz | — |
| Internal Frequency (per DigChip summary) | 66.67 MHz | — |
| Process Technology | 0.22 µm CMOS | — |
| Core Supply Voltage | 2.5 V | — |
| Logic Family | CMOS | CMOS |
| Température de fonctionnement | 0 °C to +70 °C (Commercial) | 0 °C to 70 °C (Commercial) |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Memory | SRAM (volatile) | Volatile SRAM (requires external configuration device) |
| JTAG Support | IEEE 1149.1 boundary scan | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Typical Gates | — | 30,000 |
| Embedded Memory Bits | — | 24,576 |
| User I/Os | — | 102 |
| Package Code | — | LFQFP |
| Terminal Form | — | Gull Wing |
| Technology | — | 0.22 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| Internal Frequency | — | [DATA_NEEDED: internal frequency max] |
| Programming Method | — | JTAG (IEEE 1149.1), in-system SRAM configuration |