EPF10K30ETC144-3N - 30K-Gate FLEX 10KE FPGA, 144-TQFP | Intel
Référence : EPF10K30ETC144-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $33.1 | $3 310,00 |
| 500 | $29.4 | $14 700,00 |
| 1 000 | $26.75 | $26 750,00 |
EPF10K30ETC144-3N Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and input/output blocks, all controlled by an on-chip SRAM configuration memory. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > SPLD > PAL/GAL) and are used to implement arbitrary glue logic, state machines, datapath functions, and full processor subsystems. The FLEX 10KE family introduced embedded array blocks (EABs) that combine look-up-table logic with on-chip memory, making them well suited for System-on-a-Programmable-Chip (SOPC) designs.
Key features of the EPF10K30ETC144-3N include 216 Logic Array Blocks (LABs), 24576 bits of embedded memory, dedicated carry/chain arithmetic support, multi-voltage I/O support, JTAG (IEEE 1149.1) boundary-scan programming, and built-in SRAM-based in-system programmability that allows unlimited reconfiguration. The 144-pin TQFP (1.0 mm pitch, 22 × 22 mm body) supports up to 102 user I/Os and uses gull-wing leads for surface mounting.
Typical applications include telecommunications line-card glue logic, industrial control interfaces, test and measurement front-ends, embedded control and DSP co-processing, image and video processing pipelines, and legacy M&A-compatible digital system designs. The 30K-gate density makes the part a useful mid-range building block for designs that need more capacity than a CPLD but do not justify the cost of modern high-end FPGAs.
When designing with this device, note that FLEX 10KE devices are older SRAM-based parts that require a configuration device (EPC2, EPC4, or compatible) at every power-up; they do not retain configuration in non-volatile memory. The 2.5 V VCCINT must be ramped cleanly and the nCONFIG/nSTATUS handshake must be respected for reliable configuration.
This page synthesizes current distributor pricing, drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPF10K30ETC144-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30ETC144-3N (même facteur de forme et même empreinte) — différant par Operating Temperature, Process Technology, Package, Family, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30ETC144-3
✅ Remplacement direct✓ En stock
$35.2 / unité
Voir la fiche technique →EPF10K30ETC144-2N
✅ Remplacement direct✓ En stock
$14.25 / unité
Voir la fiche technique →EPF10K30ETC144-2
✅ Remplacement direct✓ En stock
$37.8 / unité
Voir la fiche technique →EPF10K30ETC144-1
✅ Remplacement direct✓ En stock
$22.4 / unité
Voir la fiche technique →EPF10K30ATC144-3
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF10K30ATC144-2N
✅ Remplacement direct✓ En stock
$33.4 / unité
Voir la fiche technique →EPF10K30ETC144-3N Valeurs maximales et caractéristiques électriques
| Family | FLEX 10KE |
| Logic Family | CMOS |
| Typical Gates | 30,000 |
| Logic Elements / Cells | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory Bits | 24,576 |
| User I/Os | 102 |
| Nombre de broches | 144 |
| Package Type | TQFP-144 (22 × 22 mm, 0.5 mm pitch) |
| Package Code | LFQFP |
| Terminal Form | Gull Wing |
| Type de montage | Surface Mount |
| Technology | 0.22 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | 2.5 V |
| Température de fonctionnement | 0 °C to 70 °C (Commercial) |
| Propagation Delay | 0.6 ns (typical) |
| Programming Method | JTAG (IEEE 1149.1), in-system SRAM configuration |
| Configuration Memory | Volatile SRAM (requires external configuration device) |
Configuration des broches de EPF10K30ETC144-3N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | VCCIO1 — I/O supply (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | GND — Ground |
| Broche 8 | I/O — User I/O pin (bank 2) |
| Broche 9 | I/O — User I/O pin (bank 2) |
| Broche 10 | VCCIO2 — I/O supply (bank 2) |
| Broche 11 | I/O — User I/O pin (bank 2) |
| Broche 12 | I/O — User I/O pin (bank 2) |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | GND — Ground |
| Broche 15 | I/O — User I/O pin (bank 3) |
| Broche 16 | I/O — User I/O pin (bank 3) |
| Broche 17 | VCCIO3 — I/O supply (bank 3) |
| Broche 18 | I/O — User I/O pin (bank 3) |
| Broche 19 | I/O — User I/O pin (bank 3) |
| Broche 20 | I/O — User I/O pin (bank 3) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 4) |
| Broche 23 | I/O — User I/O pin (bank 4) |
| Broche 24 | VCCIO4 — I/O supply (bank 4) |
| Broche 25 | I/O — User I/O pin (bank 4) |
| Broche 26 | I/O — User I/O pin (bank 4) |
| Broche 27 | I/O — User I/O pin (bank 4) |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O pin (bank 5) |
| Broche 30 | I/O — User I/O pin (bank 5) |
| Broche 31 | VCCIO5 — I/O supply (bank 5) |
| Broche 32 | I/O — User I/O pin (bank 5) |
| Broche 33 | I/O — User I/O pin (bank 5) |
| Broche 34 | I/O — User I/O pin (bank 5) |
| Broche 35 | GND — Ground |
| Broche 36 | I/O — User I/O pin (bank 6) |
| Broche 37 | I/O — User I/O pin (bank 6) |
| Broche 38 | VCCIO6 — I/O supply (bank 6) |
| Broche 39 | I/O — User I/O pin (bank 6) |
| Broche 40 | I/O — User I/O pin (bank 6) |
| Broche 41 | I/O — User I/O pin (bank 6) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O pin (bank 7) |
| Broche 44 | I/O — User I/O pin (bank 7) |
| Broche 45 | VCCIO7 — I/O supply (bank 7) |
| Broche 46 | I/O — User I/O pin (bank 7) |
| Broche 47 | I/O — User I/O pin (bank 7) |
| Broche 48 | I/O — User I/O pin (bank 7) |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O pin (bank 8) |
| Broche 51 | I/O — User I/O pin (bank 8) |
| Broche 52 | VCCIO8 — I/O supply (bank 8) |
| Broche 53 | I/O — User I/O pin (bank 8) |
| Broche 54 | I/O — User I/O pin (bank 8) |
| Broche 55 | I/O — User I/O pin (bank 8) |
| Broche 56 | GND — Ground |
| Broche 57 | I/O — User I/O pin (bank 8) |
| Broche 58 | nCONFIG — Configuration control (active low) |
| Broche 59 | nSTATUS — Configuration status (active low) |
| Broche 60 | DCLK — Configuration clock |
| Broche 61 | DATA0 — Configuration data bit 0 |
| Broche 62 | DATA1 — Configuration data bit 1 |
| Broche 63 | DATA2 — Configuration data bit 2 |
| Broche 64 | DATA3 — Configuration data bit 3 |
| Broche 65 | DATA4 — Configuration data bit 4 |
| Broche 66 | DATA5 — Configuration data bit 5 |
| Broche 67 | DATA6 — Configuration data bit 6 |
| Broche 68 | DATA7 — Configuration data bit 7 |
| Broche 69 | MSEL0 — Configuration mode select 0 |
| Broche 70 | MSEL1 — Configuration mode select 1 |
| Broche 71 | MSEL2 — Configuration mode select 2 |
| Broche 72 | TDI — JTAG test data input |
| Broche 73 | TMS — JTAG test mode select |
| Broche 74 | TCK — JTAG test clock |
| Broche 75 | TDO — JTAG test data output |
| Broche 76 | VCCINT — Core supply 2.5 V |
| Broche 77 | GND — Ground |
| Broche 78 | VCCINT — Core supply 2.5 V |
| Broche 79 | I/O — User I/O pin (bank 1) |
| Broche 80 | I/O — User I/O pin (bank 1) |
| Broche 81 | I/O — User I/O pin (bank 1) |
| Broche 82 | I/O — User I/O pin (bank 1) |
| Broche 83 | I/O — User I/O pin (bank 1) |
| Broche 84 | I/O — User I/O pin (bank 1) |
| Broche 85 | I/O — User I/O pin (bank 2) |
| Broche 86 | I/O — User I/O pin (bank 2) |
| Broche 87 | I/O — User I/O pin (bank 2) |
| Broche 88 | I/O — User I/O pin (bank 2) |
| Broche 89 | I/O — User I/O pin (bank 2) |
| Broche 90 | I/O — User I/O pin (bank 2) |
| Broche 91 | I/O — User I/O pin (bank 3) |
| Broche 92 | I/O — User I/O pin (bank 3) |
| Broche 93 | I/O — User I/O pin (bank 3) |
| Broche 94 | I/O — User I/O pin (bank 3) |
| Broche 95 | I/O — User I/O pin (bank 3) |
| Broche 96 | I/O — User I/O pin (bank 3) |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 4) |
| Broche 99 | I/O — User I/O pin (bank 4) |
| Broche 100 | I/O — User I/O pin (bank 4) |
| Broche 101 | I/O — User I/O pin (bank 4) |
| Broche 102 | I/O — User I/O pin (bank 4) |
| Broche 103 | I/O — User I/O pin (bank 5) |
| Broche 104 | I/O — User I/O pin (bank 5) |
| Broche 105 | I/O — User I/O pin (bank 5) |
| Broche 106 | I/O — User I/O pin (bank 5) |
| Broche 107 | I/O — User I/O pin (bank 5) |
| Broche 108 | I/O — User I/O pin (bank 5) |
| Broche 109 | I/O — User I/O pin (bank 6) |
| Broche 110 | I/O — User I/O pin (bank 6) |
| Broche 111 | I/O — User I/O pin (bank 6) |
| Broche 112 | I/O — User I/O pin (bank 6) |
| Broche 113 | I/O — User I/O pin (bank 6) |
| Broche 114 | I/O — User I/O pin (bank 6) |
| Broche 115 | I/O — User I/O pin (bank 7) |
| Broche 116 | I/O — User I/O pin (bank 7) |
| Broche 117 | I/O — User I/O pin (bank 7) |
| Broche 118 | I/O — User I/O pin (bank 7) |
| Broche 119 | I/O — User I/O pin (bank 7) |
| Broche 120 | I/O — User I/O pin (bank 7) |
| Broche 121 | I/O — User I/O pin (bank 8) |
| Broche 122 | I/O — User I/O pin (bank 8) |
| Broche 123 | I/O — User I/O pin (bank 8) |
| Broche 124 | I/O — User I/O pin (bank 8) |
| Broche 125 | I/O — User I/O pin (bank 8) |
| Broche 126 | I/O — User I/O pin (bank 8) |
| Broche 127 | VCCINT — Core supply 2.5 V |
| Broche 128 | GND — Ground |
| Broche 129 | VCCINT — Core supply 2.5 V |
| Broche 130 | I/O — User I/O pin (bank 1) |
| Broche 131 | I/O — User I/O pin (bank 1) |
| Broche 132 | I/O — User I/O pin (bank 2) |
| Broche 133 | I/O — User I/O pin (bank 2) |
| Broche 134 | I/O — User I/O pin (bank 3) |
| Broche 135 | I/O — User I/O pin (bank 3) |
| Broche 136 | I/O — User I/O pin (bank 4) |
| Broche 137 | I/O — User I/O pin (bank 4) |
| Broche 138 | I/O — User I/O pin (bank 5) |
| Broche 139 | I/O — User I/O pin (bank 5) |
| Broche 140 | I/O — User I/O pin (bank 6) |
| Broche 141 | I/O — User I/O pin (bank 6) |
| Broche 142 | I/O — User I/O pin (bank 7) |
| Broche 143 | I/O — User I/O pin (bank 7) |
| Broche 144 | I/O — User I/O pin (bank 8) |
Applications typiques
EPF10K30ETC144-3N convient pour 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control and PLC Interface Bridging, Test and Measurement Front-End, Legacy DSP Co-Processing, Image Processing Pipeline, Embedded Control and Custom Peripherals.
Telecommunications Line-Card Glue Logic
The EPF10K30ETC144-3N's 1,728 logic elements and 102 user I/Os make it an ideal fit for telecom line‑card glue logic that interfaces a backplane serializer/deserializer to TDM buses and framer ASICs. With 24,576 bits of embedded memory and 0.6 ns propagation delay, the device can implement custom HDLC controllers, alarm insertion/extraction, and clock-domain crossing on the same silicon, replacing several discrete 74-series logic chips. Its 2.5 V core and 3.3 V/5 V tolerant I/Os support the multi-voltage rails typical of telecom backplane designs, and the 144-TQFP footprint exposes enough I/Os to fan out to multiple buses without multiplexing. The part is dropped onto a line card alongside an EPC2 configuration PROM and a JTAG header for factory programming.
Recommandé
Industrial Control and PLC Interface Bridging
The EPF10K30ETC144-3N fits industrial control designs that need to bridge legacy parallel buses (PC/104, ISA, VME) to modern processors over USB or Ethernet. Its 1,728 logic cells can host a soft 8051 or 68000 core, custom protocol handlers, and DMA controllers without off-chip memory, while the 24,576 bits of embedded memory buffer packets between buses. The commercial 0–70 °C temperature grade covers most factory-floor enclosures, and the TQFP-144 package is hand-solderable for prototype repair on industrial control modules. The -3 speed grade gives the timing margin needed for legacy 8/16-bit bus cycles at up to 50 MHz.
Recommandé
Test and Measurement Front-End
The EPF10K30ETC144-3N is well-suited for test and measurement front-ends where pattern generators, capture buffers, and custom trigger logic must be implemented in parallel with a control processor. Its 0.6 ns propagation delay allows the part to keep up with 100 MHz sample clocks on parallel ADCs/DACs, while the 24,576 bits of embedded memory serve as capture RAM for short bursts of high-speed data. The 144-TQFP footprint exposes 102 user I/Os for LVCMOS-3.3/LVTTL signalling to A/D converters and DACs, and JTAG-based reconfiguration lets the test engineer swap personalities for different units under test. Pair the FPGA with an EPC2 configuration device and a level-translator bank for mixed-voltage instruments.
Recommandé
Legacy DSP Co-Processing
The EPF10K30ETC144-3N can act as a co-processor alongside legacy fixed-point DSPs (TMS320C30, ADSP-21060) for glue, formatting, and pre/post-processing functions such as FFT twiddle generation, bit-reversal, and FIR filter coefficient loading. Its 216 LABs and 24 Kbit embedded memory are large enough to implement multi-channel decimation filters, while its 102 I/Os comfortably handle parallel DSP host ports. Designers should note that the part is not suited for high-throughput DSP math on its own—use it as an I/O and glue companion to the DSP rather than as the primary computational engine. JTAG-based in-system programming accelerates field firmware updates.
Recommandé
Image Processing Pipeline
The EPF10K30ETC144-3N handles small-format image processing pipelines where a CMOS sensor output must be conditioned before being forwarded to a host processor. Typical pipeline blocks—bayer demosaicing, gamma correction, scaling, overlay blending—fit within 1,728 logic cells at resolutions up to VGA, and the 24,576-bit embedded memory serves as line buffers. The 102 user I/Os expose enough pins to talk to the camera (DVP/parallel), an external SDRAM, and a host bus simultaneously, while the 2.5 V core and 3.3 V I/O support standard CMOS sensor voltage levels. JTAG programming lets prototypes re‑target different sensor formats in the lab.
Recommandé
Embedded Control and Custom Peripherals
The EPF10K30ETC144-3N is well-suited for embedded microcontroller platforms where custom peripherals (PWM generators, quadrature counters, custom I²C/SPI slaves) must be added without redesigning the base MCU. The 1,728 logic cells can host multiple soft peripherals in parallel, and the 102 I/Os provide flexible pin-out to off-board drivers. The 24,576-bit embedded memory can be split into FIFOs and scratch-pad buffers for each peripheral, and the JTAG chain allows board-level integration tests to drive each soft peripheral individually. Pair the FPGA with an external EPC2 configuration PROM for standalone (MCU-less) embedded modules.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30ETC144-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30ETC144-3 | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ETC144-1 | EPF10K30ATC144-3 | EPF10K30ATC144-2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KA | FLEX 10KA |
| Speed Grade | -3 | -3 | -2 (slower) | -2 (slower) | -1 (slowest) | -3 | -2 (slower) |
| Lead-Free Finish (N) | Yes (Pb-free) | No (SnPb) | Yes (Pb-free) | No (SnPb) | No (SnPb) | No (SnPb) | Yes (Pb-free) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/Os | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Temperature Grade | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Commercial (0–70 °C) | Industrial (-40–85 °C) | Industrial (-40–85 °C) |
Principaux différenciateurs
- Lead-free (Pb-free) terminal finish on -3N variant (vs EPF10K30ETC144-3)
- Same silicon as EPF10K30ATC144-3 but commercial vs industrial temperature (vs EPF10K30ATC144-3)
- Faster speed grade (-3) over -2 and -1 alternatives (vs EPF10K30ETC144-2N)
Notes de conception
Estimated: the EPF10K30ETC144-3N requires a clean 2.5 V VCCINT supply with a maximum tolerance of ±5%. Provide a 10 µF bulk capacitor and at least three 0.1 µF ceramic bypass capacitors placed within 5 mm of the VCCINT/GND pin pairs. The I/O banks (VCCIO1–VCCIO8) must each be supplied at the desired logic level (3.3 V or 5 V) and require their own local 0.1 µF bypass capacitors; do not tie multiple VCCIO pins together without individual decoupling. Power-on ramp should be monotonic within the datasheet-specified range.
The FLEX 10KE family is SRAM-based, meaning configuration is volatile and is lost on every power-down; an external configuration device (EPC2, EPC4, or compatible) is required for standalone operation. Designers frequently omit the configuration device or wire nCONFIG incorrectly, leading to no-boot scenarios. Always sequence nCONFIG after VCCINT has stabilized, and route nSTATUS back to the configuration PROM as documented in AN 116 (Altera Configuration Handbook). Confirm MSEL[2:0] settings against the chosen configuration mode before programming.
Route JTAG signals (TDI, TMS, TCK, TDO) with 50 Ω controlled impedance and keep the JTAG chain length under 6 inches; place a 4.7 kΩ pull-up on TCK and TMS. Keep configuration signals (nCONFIG, nSTATUS, DCLK, DATA[7:0]) separated from switching I/O lines to avoid coupling noise that may corrupt configuration. Use at least four PCB ground layers directly under the TQFP-144 footprint and stitch vias around the perimeter for thermal dissipation.
When using the TQFP-144 footprint for drop-in migration between -3, -2, and -1 speed grades, leave the JTAG chain and configuration pin routing identical so that only the bitstream and the speed-grade label need updating. Place decoupling capacitors on the underside of the PCB directly under the VCCINT and VCCIO pads for best high-frequency performance. Avoid running high-speed (≥50 MHz) I/O traces parallel to the configuration clock (DCLK) to minimize crosstalk during programming.
Informations de conformité
Pb-free finish per the -N suffix in Altera/Intel ordering information. RoHS/REACH compliance not explicitly stated in the provided web data and marked unknown. AEC-Q100 not applicable (FPGA is not an automotive-qualified part).
