EPF10K50ETC144-3 - FLEX 10KE 50K Gates 144-TQFP FPGA | Intel
Référence : EPF10K50ETC144-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $45.5 | $45,50 |
| 10 | $41.2 | $412,00 |
| 100 | $37.8 | $3 780,00 |
| 500 | $33.5 | $16 750,00 |
| 1 000 | $29.9 | $29 900,00 |
EPF10K50ETC144-3 Présentation
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O cells are defined by a user-supplied bitstream after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) - alongside CPLDs, PALs, and GALs - and represent the highest-density, highest-performance tier used for glue logic, custom DSP, ASIC prototyping, and full system integration. The FLEX 10KE family pioneered embedded-array architecture, combining look-up-table based logic with embedded memory blocks and Embeddable Logic Array Blocks (EABs) to deliver a System-on-a-Programmable-Chip (SOPC) integration platform that pre-dated modern SoC FPGAs.
Key features include 102 user I/O pins (274 maximum in the family), 0.22 µm CMOS process technology, 166.67 MHz maximum internal frequency, 0.6 ns propagation delay, 2.5 V core supply, and SameFrame pin compatibility across the FLEX 10KE family for design migration. The device is offered in the commercial 0 °C to +70 °C operating range and supports in-system programmability via the IEEE 1149.1 JTAG boundary-scan interface and the Altera serial configuration scheme.
The EPF10K50ETC144-3 is built on a 0.22 µm four-metal-layer CMOS process, with 3.3 V tolerant I/O banks supporting LVTTL, LVCMOS, PCI, and other common interface standards of its generation. Its SRAM-based configuration memory allows unlimited reconfiguration but requires a configuration PROM or microcontroller to load the bitstream at power-up. The -3 speed grade corresponds to a faster device-bin than the -4 grade, enabling higher Fmax for clocked logic paths.
Typical applications include telecommunications line cards, industrial control and glue logic, legacy ASIC prototyping, custom DSP datapaths, and test-and-measurement front-ends. Designers value the FLEX 10KE family for deterministic pin-to-pin timing and abundant memory for small to medium-density designs where modern FPGA tools would be overkill. The 144-pin TQFP package also makes the part hand-solderable for prototyping.
When designing with this part, note that the SRAM configuration cells must be loaded from a serial or parallel PROM on every power-up; plan a configuration clock source and ensure all unused I/O pins are configured as inputs with weak pull-ups to avoid floating-input quiescent current. The SameFrame pin migration path is supported only with the 484-pin FineLine BGA package, so TQFP-144 designs are not directly migratable to higher I/O-count packages without board rework.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternatives within the FLEX 10KE family, and practical design notes not found in the manufacturer datasheet - all cross-referenced against XAIPART's internal FLEX 10K part database.
Alternatives de remplacement direct pour EPF10K50ETC144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K50ETC144-3 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Embedded Array Blocks (EABs), Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K50ETC144-3N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K50ETC144-1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$18.9 / unité
Voir la fiche technique →EPF10K30ETC144-3
✅ Remplacement direct✓ En stock
$35.2 / unité
Voir la fiche technique →EPF10K30ETC144-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$26.75 / unité
Voir la fiche technique →EPF10K30ETC144-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$37.8 / unité
Voir la fiche technique →EPF10K50ETC144-3 Valeurs maximales et caractéristiques électriques
| Family | FLEX 10KE |
| Typical Gate Count | 50,000 gates |
| Logic Elements / Cells | 2,880 |
| Total Memory Bits | 40,960 bits |
| Logic Array Blocks (LABs) | 360 |
| User I/O Pins (this package) | 102 |
| Max User I/O (family) | 274 pins |
| Nombre de broches | 144 |
| Package Type | TQFP-144 (also referred to as 144-LQFP) |
| Propagation Delay | 0.6 ns |
| Maximum Internal Frequency | 166.67 MHz |
| Internal Frequency (per DigChip summary) | 66.67 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Logic Family | CMOS |
| Température de fonctionnement | 0 °C to +70 °C (Commercial) |
| Type de montage | Surface Mount |
| Configuration Memory | SRAM (volatile) |
| JTAG Support | IEEE 1149.1 boundary scan |
Configuration des broches de EPF10K50ETC144-3
| Broche 1 | I/O — User I/O pin (bank-dependent voltage tolerance) |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | VCCINT — Core supply voltage (2.5 V) |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | I/O — User I/O pin |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | I/O — User I/O pin |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | I/O — User I/O pin |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | I/O — User I/O pin |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | VCCIO — I/O supply voltage (3.3 V) |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | GND — Ground |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | I/O — User I/O pin |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | I/O — User I/O pin |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | GND — Ground |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | I/O — User I/O pin |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | I/O — User I/O pin |
| Broche 91 | I/O — User I/O pin |
| Broche 92 | I/O — User I/O pin |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | I/O — User I/O pin |
| Broche 96 | I/O — User I/O pin |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | I/O — User I/O pin |
| Broche 99 | I/O — User I/O pin |
| Broche 100 | I/O — User I/O pin |
| Broche 101 | I/O — User I/O pin |
| Broche 102 | I/O — User I/O pin |
| Broche 103 | I/O — User I/O pin |
| Broche 104 | I/O — User I/O pin |
| Broche 105 | I/O — User I/O pin |
| Broche 106 | I/O — User I/O pin |
| Broche 107 | I/O — User I/O pin |
| Broche 108 | TDI — JTAG Test Data In |
| Broche 109 | TMS — JTAG Test Mode Select |
| Broche 110 | TCK — JTAG Test Clock |
| Broche 111 | TDO — JTAG Test Data Out |
| Broche 112 | nSTATUS — Configuration status (open-drain) |
| Broche 113 | nCONFIG — Configuration control (active-low) |
| Broche 114 | CONF_DONE — Configuration done indicator |
| Broche 115 | DCLK — Configuration clock |
| Broche 116 | DATA0 — Configuration data input |
| Broche 117 | MSEL0 — Configuration mode select 0 |
| Broche 118 | MSEL1 — Configuration mode select 1 |
| Broche 119 | nCE — Chip enable (active-low) |
| Broche 120 | nCEO — Chip enable out (for daisy chain, active-low) |
| Broche 121 | I/O — User I/O pin |
| Broche 122 | I/O — User I/O pin |
| Broche 123 | I/O — User I/O pin |
| Broche 124 | I/O — User I/O pin |
| Broche 125 | I/O — User I/O pin |
| Broche 126 | I/O — User I/O pin |
| Broche 127 | I/O — User I/O pin |
| Broche 128 | I/O — User I/O pin |
| Broche 129 | I/O — User I/O pin |
| Broche 130 | I/O — User I/O pin |
| Broche 131 | I/O — User I/O pin |
| Broche 132 | I/O — User I/O pin |
| Broche 133 | I/O — User I/O pin |
| Broche 134 | VCCINT — Core supply voltage (2.5 V) |
| Broche 135 | I/O — User I/O pin |
| Broche 136 | I/O — User I/O pin |
| Broche 137 | I/O — User I/O pin |
| Broche 138 | I/O — User I/O pin |
| Broche 139 | I/O — User I/O pin |
| Broche 140 | I/O — User I/O pin |
| Broche 141 | I/O — User I/O pin |
| Broche 142 | I/O — User I/O pin |
| Broche 143 | I/O — User I/O pin |
| Broche 144 | I/O — User I/O pin |
Applications typiques
EPF10K50ETC144-3 convient pour 6 applications: Telecommunications Line Cards, Industrial Glue Logic and Bus Controllers, Legacy ASIC Prototyping, Custom DSP Datapaths, Test and Measurement Equipment, Educational and FPGA Training Platforms.
Telecommunications Line Cards
The EPF10K50ETC144-3's 50K-gate logic capacity, 360 LABs, and embedded memory blocks make it well suited to mid-1990s through mid-2000s telecom line-card designs implementing TDM framing, HDLC controllers, and ATM segmentation-and-reassembly (SAR) engines. Its 166.67 MHz Fmax and 0.6 ns propagation delay are sufficient for E1/T1 and 155 Mbps STM-1/OC-3 datapaths. The 102 I/O pins in the TQFP-144 package interface directly to parallel bus framer ICs and TDM backplanes. Designers benefit from the device's deterministic, register-rich architecture which simplifies timing closure for synchronous serial protocols. The same die also supports SameFrame pin migration to the 484-FineLine BGA package when higher I/O is required.
Recommandé
Industrial Glue Logic and Bus Controllers
The EPF10K50ETC144-3 was widely deployed as a flexible 'glue logic' replacement for multiple 74-series TTL parts on industrial control boards, implementing custom address decoding, wait-state generation, and bus arbitration between microprocessors, memory, and peripherals. Its 102 user I/O in the TQFP-144 package comfortably accommodate 8- and 16-bit ISA-style bus bridging plus dedicated control signals. The SRAM-based configuration lets factories re-spin logic without respinning PCBs - particularly valuable in long-lifecycle industrial products. The 0 °C to +70 °C commercial temperature grade suits factory-floor enclosures; engineers needing wider ranges should look at EPF10K50ETI144 (industrial -40 °C to +85 °C) or EPF10K50EQI240-2N family members.
Recommandé
Legacy ASIC Prototyping
The 50K-gate density and 0.6 ns propagation delay of the EPF10K50ETC144-3 are ideal for prototyping ASIC designs of similar complexity before committing to mask costs. Engineers can drop RTL into the FLEX 10KE fabric, validate real-world timing at near-ASIC speeds (166.67 MHz Fmax), and iterate on the bitstream in minutes via JTAG. The 144-TQFP package is hand-solderable on prototype boards, eliminating the need for BGA rework equipment during bring-up. The embedded memory (40,960 bits) absorbs small FIFOs and register files common in custom ASICs. Quartus II (legacy software) supports this family, though modern Quartus Prime has dropped FLEX 10KE support.
Recommandé
Custom DSP Datapaths
The EPF10K50ETC144-3's 360 LABs and 40,960 embedded memory bits enable moderate-density digital signal processing - FIR/IIR filters, FFT butterfly engines, and baseband demodulators. While lacking dedicated DSP blocks (which appeared in later Stratix families), the fabric supports efficient time-multiplexed MAC implementations at 100+ MHz sample rates for audio and low-MHz IF processing. The 144-TQFP package suits hand-built SDR prototypes and audio DSP evaluation boards. Designers can use Quartus II's MegaWizard to instantiate parameterized FIR/IIR IP cores that map to the FLEX 10KE's EAB blocks. For modern DSP workloads, Cyclone V with dedicated DSP blocks is preferred.
Recommandé
Test and Measurement Equipment
The EPF10K50ETC144-3's high I/O count (102 pins), fast propagation delay, and reconfigurable fabric make it well suited to test-and-measurement instruments - logic analyzer probes, pattern generators, protocol exercisers, and custom fixture controllers. Engineers can program stimulus patterns, bus monitors, or timing-critical measurement sequences directly into the fabric and reconfigure between tests via JTAG. The 2.5 V core with 3.3 V-tolerant I/O interfaces cleanly to TTL/CMOS test buses of its era. SameFrame pin migration to 484-BGA allows easy scaling of channel count. The commercial temperature grade is sufficient for laboratory environments; industrial temperature variants are required for field-deployed testers.
Recommandé
Educational and FPGA Training Platforms
The EPF10K50ETC144-3 remains useful in university FPGA curriculum and self-study where the simplicity of the FLEX 10KE architecture (no hard cores, no transceivers) helps students learn fundamentals of RTL synthesis, timing closure, and bitstream configuration without tool-chain complexity. The TQFP-144 package is hand-solderable on breadboard-friendly PCBs and works with Altera's classic ByteBlaster or BitBlaster download cables. Quartus II Web Edition (legacy free tool) supports this device. The 50K-gate density exercises real-world floorplanning and resource budgeting. Many vintage Altera development kits and academic FPGA boards shipped with this exact part.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K50ETC144-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K50ETC144-3N | EPF10K50ETC144-1 | EPF10K30ETC144-3 | EPF10K30ETC144-3N | EPF10K30ETC144-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Typical Gate Count | 50,000 | 50,000 | 50,000 | 30,000 (-40%) | 30,000 (-40%) | 30,000 (-40%) |
| Logic Cells | 2,880 | 2,880 | 2,880 | 1,728 (-40%) | 1,728 (-40%) | 1,728 (-40%) |
| Speed Grade | -3 | -3 | -1 (slower) | -3 | -3 | -2 (slower) |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| RoHS / Lead-Free | Original (non-RoHS) | Yes (RoHS) | Original (non-RoHS) | Original (non-RoHS) | Yes (RoHS) | Original (non-RoHS) |
Principaux différenciateurs
- Highest-density FLEX 10KE variant in TQFP-144 (vs EPF10K30ETC144-3)
- Faster -3 speed grade vs slower bins (vs EPF10K50ETC144-1)
- Lead-free / RoHS-compliant variant exists for new builds (vs EPF10K50ETC144-3N)
Notes de conception
The EPF10K50ETC144-3 requires two supplies: VCCINT at 2.5 V (±5%) for the core logic and VCCIO at 3.3 V (±5%) for the I/O banks. Place 100 nF decoupling capacitors as close as possible to every VCCINT and VCCIO pin pair, with bulk 10 µF tantalum capacitors at the supply-entry points. Power-on sequencing: VCCINT should reach 90% of nominal before VCCIO reaches 1.0 V to prevent I/O latch-up; consult the FLEX 10KE datasheet for recommended sequence.
Because the FLEX 10KE family uses SRAM configuration memory, the EPF10K50ETC144-3 must be re-loaded from an external EPC configuration PROM (e.g., EPC2, EPC8) or a microcontroller on every power-up. Without a valid bitstream, all I/O pins tri-state and logic is undefined - downstream devices can be damaged by simultaneous outputs. Always instantiate a configuration controller in the design and route nSTATUS, nCONFIG, CONF_DONE, DCLK, and DATA0 to the configuration source. Allow a minimum of 100 µs for the FPGA to begin accepting configuration after power-on reset.
The 144-pin TQFP uses 0.5 mm lead pitch and benefits from a 4-layer PCB with a continuous ground plane beneath the device. Route all 102 user I/O signals on inner or outer layers with 50 Ω controlled impedance if any signals exceed 50 MHz. Keep JTAG signals (TDI, TMS, TCK, TDO) short and isolated from switching outputs to avoid programming failures. Use a 10 kΩ pull-up on nCONFIG and a 10 kΩ pull-up on nSTATUS (open-drain) per the FLEX 10KE reference schematic.
I/O banks on the FLEX 10KE support LVTTL, LVCMOS, and PCI signaling at 3.3 V. Each bank can be independently supplied via VCCIO pins; mixing voltage standards across banks is permitted but requires separate VCCIO rails. Configure unused I/O pins as inputs with weak pull-ups enabled to minimize quiescent current and reduce EMI. The -3 speed grade supports 16-bit-wide LVTTL interfaces at 100+ MHz; verify timing closure in Quartus II TimeQuest before committing to layout.
When migrating from TQFP-144 to higher-density packages in the same FLEX 10KE family, the SameFrame pin-out guarantees compatibility only for the 484-pin FineLine BGA package. Migration from 144-TQFP to 240-QFP or 256-BGA requires PCB rework. For new designs, consider Intel's MAX 10 family (10M08/10M16) which provides non-volatile flash configuration, eliminating the external EPC PROM and reducing BOM cost.
Informations de conformité
Original EPF10K50ETC144-3 is SnPb (non-RoHS). RoHS-compliant variant is EPF10K50ETC144-3N (same die, Pb-free finish). AEC-Q100 not applicable for FPGAs in this family. Halogen-free status not stated in available web data.
