EPF10K50STC144-3 vs EPF10K30ETI144-3 Comparaison
Comparaison détaillée côte à côte de EPF10K50STC144-3 par Altera et EPF10K30ETI144-3 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K50STC144-3 | EPF10K30ETI144-3 |
|---|---|---|
| Marque | Altera | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $20,80 | $29,80 |
| Series | FLEX 10KS | FLEX-10KE |
| Family | FLEX 10K | FLEX-10KE Embedded Programmable Logic Device |
| Typical Gates | 50,000 | — |
| Logic Elements / Cells | 2,880 | — |
| Logic Array Blocks (LABs) | 360 | 216 |
| On-chip RAM Bits | 40,960 | — |
| Maximum User I/Os | 102 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Internal Operating Frequency | 166.67 MHz | — |
| Propagation Delay | 0.6 ns (typical) | — |
| Speed Grade | -3 | — |
| Core Voltage | 2.5 V | — |
| I/O Voltage | 5.0 V (3.3 V LVTTL/LVCMOS compatible) | — |
| Process Technology | 0.22 um CMOS, SRAM-based | — |
| Boîtier | 144-LQFP (also called LFQFP / TQFP) | 144-LQFP (LFQFP) |
| Température de fonctionnement | 0 C to 70 C (commercial) | -40C to +85C (Industrial) |
| Type de montage | Surface Mount (Gull-wing leads) | Surface Mount (Gull Wing) |
| Configuration | SRAM (volatile, requires external EPC) | — |
| JTAG Boundary Scan | Built-in, IEEE Std. 1149.1-1990 compliant | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (Sn/Pb lead finish) |
| Logic Elements | — | 1728 |
| Embedded RAM | — | 24,576 bits |
| Embedded Array Blocks (EABs) | — | 6 |
| Maximum User I/O | — | 102 |
| Maximum Equivalent Gates | — | 119,000 |
| Pin-to-Pin Delay (Speed Grade) | — | 12.5 ns |
| Supply Voltage (Core) | — | 2.5 V / 3.3 V |
| I/O Voltage Tolerance | — | 5.0 V / 3.3 V / 2.5 V (multi-volt) |
| Package Height | — | 1.6 mm |
| Lead Finish | — | Tin/Lead (Sn/Pb) |
| Configuration Method | — | SRAM (volatile) + JTAG IEEE 1149.1 |