EPF10K50STC144-3 - FLEX 10KS 50K-Gate FPGA 2880 Cells | Altera
Référence : EPF10K50STC144-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $29.25 | $292,50 |
| 100 | $26 | $2 600,00 |
| 500 | $23.4 | $11 700,00 |
| 1 000 | $20.8 | $20 800,00 |
EPF10K50STC144-3 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. The FLEX 10KS architecture is a hierarchical SRAM-based PLD that combines fine-grain logic elements (LEs) grouped into Logic Array Blocks (LABs) with embedded array blocks (EABs) for memory functions. Within the broader taxonomy, the FLEX 10KS sits below modern Cyclone and Stratix families but above simple CPLDs, targeting glue-logic, bus-bridging, and medium-density state-machine designs.
Key features include 360 LABs, 102 maximum user I/Os, JTAG IEEE Std. 1149.1 boundary-scan support built-in, and on-chip configuration memory. The 144-LQFP (also referenced as LFQFP / TQFP) package is a plastic gull-wing surface-mount form factor rated for commercial operating temperature. The SRAM-based configuration is volatile, requiring an external configuration device (EPC) at power-up. A built-in Joint Test Action Group (JTAG) boundary-scan test circuit is compliant with IEEE Std. 1149.1-1990 and consumes no additional device logic.
The EPF10K50STC144-3 -3 speed grade offers tighter propagation delay than the -2 grade of the same family, making it preferred for designs that approach the upper frequency ceiling of 166.67 MHz. The architecture is implemented in a 0.22 um CMOS process, and the device is intended for commercial (0C to 70C) operating environments.
Typical applications include telecommunications interface cards, industrial control and bridging logic, mid-density bus controllers, and legacy system upgrades. Design considerations for this device include mandatory configuration ROM selection (EPC1/EPC2 family), careful power-supply sequencing of 2.5V core and 5.0V I/O rails, and I/O bank planning against the available 102 user pins. Note: the FLEX 10K family is mature and was succeeded by ACEX 1K, Cyclone, and MAX families in the Altera (now Intel PSG) roadmap.
This page synthesizes distributor pricing, drop-in alternatives, pinout references, and practical design notes for the EPF10K50STC144-3 that are not found in a single manufacturer datasheet.
Alternatives de remplacement direct pour EPF10K50STC144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K50STC144-3 (même facteur de forme et même empreinte) — différant par Package, Series, Family, Process Technology, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K50STC144-2
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EPF10K50ETC144-3
✅ Remplacement direct✓ En stock
$29.9 / unité
Voir la fiche technique →EPF10K50ETC144-1
✅ Remplacement direct✓ En stock
$18.9 / unité
Voir la fiche technique →EPF10K30ETC144-3
✅ Remplacement direct✓ En stock
$35.2 / unité
Voir la fiche technique →EPF10K30ETI144-3
✅ Remplacement direct✓ En stock
$29.8 / unité
Voir la fiche technique →EP1K50TC144-3N
✅ Remplacement direct✓ En stock
$9.15 / unité
Voir la fiche technique →EPF10K50STC144-3 Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KS |
| Family | FLEX 10K |
| Typical Gates | 50,000 |
| Logic Elements / Cells | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| On-chip RAM Bits | 40,960 |
| Maximum User I/Os | 102 |
| Internal Operating Frequency | 166.67 MHz |
| Propagation Delay | 0.6 ns (typical) |
| Speed Grade | -3 |
| Core Voltage | 2.5 V |
| I/O Voltage | 5.0 V (3.3 V LVTTL/LVCMOS compatible) |
| Process Technology | 0.22 um CMOS, SRAM-based |
| Boîtier | 144-LQFP (also called LFQFP / TQFP) |
| Température de fonctionnement | 0 C to 70 C (commercial) |
| Type de montage | Surface Mount (Gull-wing leads) |
| Configuration | SRAM (volatile, requires external EPC) |
| JTAG Boundary Scan | Built-in, IEEE Std. 1149.1-1990 compliant |
Configuration des broches de EPF10K50STC144-3
| Broche 1 | I/O — User I/O pin (bank assignments per datasheet) |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | VCCINT — Core supply (2.5 V) |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | I/O — User I/O pin |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | I/O — User I/O pin |
| Broche 21 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | GND — Ground |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | I/O — User I/O pin |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | VCCINT — Core supply (2.5 V) |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | I/O — User I/O pin |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | I/O — User I/O pin |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | GND — Ground |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | I/O — User I/O pin |
| Broche 91 | I/O — User I/O pin |
| Broche 92 | I/O — User I/O pin |
| Broche 93 | I/O — User I/O pin |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | I/O — User I/O pin |
| Broche 96 | I/O — User I/O pin |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | I/O — User I/O pin |
| Broche 99 | VCCINT — Core supply (2.5 V) |
| Broche 100 | I/O — User I/O pin |
| Broche 101 | I/O — User I/O pin |
| Broche 102 | I/O — User I/O pin |
| Broche 103 | I/O — User I/O pin |
| Broche 104 | I/O — User I/O pin |
| Broche 105 | I/O — User I/O pin |
| Broche 106 | I/O — User I/O pin |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O pin |
| Broche 109 | I/O — User I/O pin |
| Broche 110 | I/O — User I/O pin |
| Broche 111 | I/O — User I/O pin |
| Broche 112 | I/O — User I/O pin |
| Broche 113 | I/O — User I/O pin |
| Broche 114 | I/O — User I/O pin |
| Broche 115 | I/O — User I/O pin |
| Broche 116 | I/O — User I/O pin |
| Broche 117 | I/O — User I/O pin |
| Broche 118 | I/O — User I/O pin |
| Broche 119 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 120 | I/O — User I/O pin |
| Broche 121 | I/O — User I/O pin |
| Broche 122 | I/O — User I/O pin |
| Broche 123 | I/O — User I/O pin |
| Broche 124 | I/O — User I/O pin |
| Broche 125 | I/O — User I/O pin |
| Broche 126 | I/O — User I/O pin |
| Broche 127 | GND — Ground |
| Broche 128 | I/O — User I/O pin |
| Broche 129 | I/O — User I/O pin |
| Broche 130 | I/O — User I/O pin |
| Broche 131 | I/O — User I/O pin |
| Broche 132 | I/O — User I/O pin |
| Broche 133 | I/O — User I/O pin |
| Broche 134 | I/O — User I/O pin |
| Broche 135 | I/O — User I/O pin |
| Broche 136 | I/O — User I/O pin |
| Broche 137 | I/O — User I/O pin |
| Broche 138 | I/O — User I/O pin |
| Broche 139 | VCCINT — Core supply (2.5 V) |
| Broche 140 | I/O — User I/O pin |
| Broche 141 | I/O — User I/O pin |
| Broche 142 | I/O — User I/O pin |
| Broche 143 | I/O — User I/O pin |
| Broche 144 | I/O — User I/O pin |
Applications typiques
EPF10K50STC144-3 convient pour 6 applications: Telecommunications Interface Card, Industrial Control and Bridging Logic, Mid-Density Bus Controller, Legacy System Upgrade and Repair, Test and Measurement Equipment, Aerospace Ground Equipment and Avionics Test.
Telecommunications Interface Card
The EPF10K50STC144-3's 50,000-gate density and 2,880 logic elements are well-suited to telecom interface cards implementing channelized protocols, framing logic, and physical-layer adaptation. Its 102 user I/Os accommodate parallel data buses and serial control interfaces; the 166.67 MHz internal frequency supports high-speed glue logic. Compared with discrete 74-series logic, the FLEX 10KS reduces board area while keeping timing deterministic. The 144-LQFP package enables standard SMT assembly on existing telecom backplanes without BGA rework. For legacy T1/E1, SONET framing, and HDLC controllers, this device remains a validated choice in carrier-grade equipment.
Recommandé
Industrial Control and Bridging Logic
Industrial PLC and motion-controller backplanes use the EPF10K50STC144-3 to bridge legacy fieldbuses (Profibus, Modbus, CAN) to modern Ethernet or PCI backplanes. The 40,960 bits of on-chip RAM allow buffer storage for packet reassembly and rate matching between asynchronous domains. With 102 user I/Os, the device can interface directly to opto-isolated 24V industrial I/O banks and provide deterministic glue logic for scan-cycle timing. The commercial 0C-70C operating range covers most factory-floor environments; for harsher industrial sites the industrial-grade EPF10K30ETI144-3 alternative should be considered.
Recommandé
Mid-Density Bus Controller
The EPF10K50STC144-3 fits mid-density bus-controller roles such as VME, ISA-to-PCI bridges, and custom backplane arbiters. Its 50K-gate capacity accommodates state-machine-based arbitration, address decoding, and interrupt handling for several bus masters. The 166.67 MHz internal frequency and 0.6 ns propagation delay (typical) allow zero-wait-state operation with 33 MHz PCI peripherals. The 144-LQFP package's generous lead pitch simplifies rework and inspection on legacy backplane designs. Designers transitioning to PCI Express should migrate to Cyclone IV GX or later families.
Recommandé
Legacy System Upgrade and Repair
The EPF10K50STC144-3 is widely used as a repair/maintenance part for legacy equipment originally designed around the FLEX 10KS family. Field engineers stock this part for board-level replacement in production lines, military electronics, and aerospace ground equipment where PCB redesign is impractical. Because the die is mature and pinout-stable, original Altera-generated bitstreams can be reloaded from a configuration EPROM without firmware changes. XAIPART and authorized distributors maintain stock specifically for long-life-cycle repair scenarios; expect broker pricing for low-volume orders.
Recommandé
Test and Measurement Equipment
ATE and bench-instrument designers used the EPF10K50STC144-3 as a flexible pattern-generator and protocol-decoder engine because the 50K-gate density fits complex stimulus sequences and timing generators in a single chip. The 2,880 logic elements and 40,960 RAM bits enable deep capture buffers, while 102 user I/Os drive front-panel connectors and ATE pin electronics. The 5V-tolerant I/O simplified interface to legacy TTL/CMOS instrumentation without level shifters. For modern PXI-based testers, migrate to Cyclone V or MAX 10 with on-chip ADCs and better Quartus tool support.
Recommandé
Aerospace Ground Equipment and Avionics Test
The EPF10K50STC144-3 historically populated avionics test benches, radar-signal simulators, and ground-control interfaces where 5V-tolerant I/O and commercial-grade temperature screening were acceptable. Its deterministic 0.6 ns propagation delay (typical) allows tight ARINC 429 and MIL-STD-1553 protocol timing without clock-multiplication tricks. Long-life-cycle aerospace programs continue to procure this part via authorized brokers; aerospace-qualified screening (e.g., EPF10K50STI144-3 industrial grade) is recommended when available. Plan forward migration to radiation-tolerant Microsemi/Actel or modern Xilinx UltraScale for new flight hardware.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K50STC144-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K50STC144-2 | EPF10K50ETC144-3 | EPF10K50ETC144-1 | EPF10K30ETC144-3 | EPF10K30ETI144-3 | EP1K50TC144-3N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-LQFP | 144-LQFP (same) | 144-LQFP (same) | 144-LQFP (same) | 144-LQFP (same) | 144-LQFP (same) | 144-LQFP (same) |
| Family | FLEX 10KS | FLEX 10KS | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | ACEX 1K |
| Typical Gates | 50,000 | 50,000 (same) | 50,000 (same) | 50,000 (same) | 30,000 (-40%) | 30,000 (-40%) | 50,000 (same) |
| Logic Elements / Cells | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 (-40%) | 1,728 (-40%) | 2,880 |
| Speed Grade | -3 (fastest) | -2 (slower) | -3 (same) | -1 (slowest) | -3 (same) | -3 (same) | -3 (same) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0 C to 70 C (commercial) | 0 C to 70 C | 0 C to 70 C | 0 C to 70 C | 0 C to 70 C | -40 C to 85 C (industrial) | 0 C to 70 C |
| Lifecycle Status | Obsolete (mature family) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | NRND / Last-time-buy |
Principaux différenciateurs
- Highest speed grade (-3) of the FLEX 10KS family (vs EPF10K50STC144-2)
- FLEX 10KS architecture with 5V I/O tolerance (vs EPF10K50ETC144-3 (FLEX 10KE))
- Forward-migration path to ACEX 1K in same footprint (vs EP1K50TC144-3N (ACEX 1K))
Notes de conception
The EPF10K50STC144-3 requires a tightly regulated 2.5V core supply (VCCINT) and a separate I/O supply (VCCIO) that can be 3.3V or 5.0V. Power-up sequencing must bring VCCINT up before or simultaneously with VCCIO to avoid I/O latch-up. Decouple every VCCINT pin with 0.1 uF ceramic plus 10 uF bulk tantalum placed within 5 mm of the package leads. The configuration device (EPC1/EPC2) should be powered from the same VCCIO rail to ensure clean configuration at power-up.
Do not assume FLEX 10KS pinout is drop-in compatible with FLEX 10KE (EPF10K50ETC144-3) without checking the datasheet. Although both share the 144-LQFP package, certain dedicated pins (MSEL, CLK, JTAG) may differ between the KS and KE variants. Also note that this device is SRAM-volatile; without a configuration EPROM the FPGA loads garbage logic and may drive I/O randomly at power-up, which can damage downstream components if protection diodes are not present.
Route all 102 user I/O traces with controlled impedance (50 ohm single-ended for LVTTL) and match length groups if used as source-synchronous buses. Place the EPC configuration EPROM within 25 mm of the FPGA to avoid configuration-clock skew issues. Provide a global ground plane directly under the 144-LQFP thermal pad; although the LQFP has no exposed pad like QFN, ground stitching vias should surround the package to suppress VCCIO switching noise.
Informations de conformité
FLEX 10KS family was launched before RoHS/REACH enforcement on Altera FPGA products; RoHS and lead-free status marked unknown - verify with distributor for current production date code. Not AEC-Q100 qualified (commercial grade only).