EPM5032DI-20 vs EPM5032DM Comparaison
Comparaison détaillée côte à côte de EPM5032DI-20 par Intel et EPM5032DM par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPM5032DI-20 | EPM5032DM |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $8,75 | $15,90 |
| Family | MAX 5000 (Altera legacy EPLD) | — |
| Architecture | CMOS PAL-type EPLD with PIA | — |
| Macrocells | 32 | 32 |
| Dedicated Inputs | 7 | — |
| Bidirectional I/O Pins | 16 | — |
| Product Terms | 320 (maximum) | — |
| Flip-Flops | 16 (one per macrocell) | — |
| Fréquence d'horloge maximale | 62.5 MHz | — |
| Pin-to-Pin Delay | 20 ns (speed grade -20) | — |
| Boîtier | Ceramic DIP-20 (windowed, UV-erasable) | CDIP-28 (ceramic windowed DIP, 28-pin) |
| Température de fonctionnement | Industrial (per 'I' suffix) | -55C to +125C (military/extended, ceramic package) |
| Programming | UV-erasable CMOS, JEDEC fuse file | — |
| Development Tool | Altera MAX+PLUS II (legacy) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status for ceramic DIP variant] | Non-compliant (ceramic DIP with UV window) |
| Lead-Free | [DATA_NEEDED: lead-free status] | No (ceramic DIP contains lead) |
| Device Family | — | MAX 5000 |
| Propagation Delay (tPD) | — | 25 ns |
| Usable Gates | — | 600 to 1000 (typical) |
| Logic Inputs | — | 32 |
| Process Technology | — | CMOS EEPROM |
| Supply Voltage (VCC) | — | 5 V (typical) |
| Standby Current | — | [DATA_NEEDED: ICC standby current] |
| Programming Technology | — | UV-erasable (windowed) EEPROM |
| Logic Function | — | Combinational and registered (synchronous) |
| Output Polarity | — | Programmable |
| Program Retention | — | Non-volatile (EEPROM) |
| Type de montage | — | Through-hole (DIP) |