EPM5032DI-20 vs EPM5032DM Comparison

Detailed side-by-side comparison of EPM5032DI-20 by Intel and EPM5032DM by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPM5032DI-20 EPM5032DM
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family MAX 5000 (Altera legacy EPLD) —
Architecture CMOS PAL-type EPLD with PIA —
Macrocells 32 32
Dedicated Inputs 7 —
Bidirectional I/O Pins 16 —
Product Terms 320 (maximum) —
Flip-Flops 16 (one per macrocell) —
Maximum Clock Frequency 62.5 MHz —
Pin-to-Pin Delay 20 ns (speed grade -20) —
Package Ceramic DIP-20 (windowed, UV-erasable) CDIP-28 (ceramic windowed DIP, 28-pin)
Operating Temperature Industrial (per 'I' suffix) -55C to +125C (military/extended, ceramic package)
Programming UV-erasable CMOS, JEDEC fuse file —
Development Tool Altera MAX+PLUS II (legacy) —
RoHS Status [DATA_NEEDED: RoHS compliance status for ceramic DIP variant] Non-compliant (ceramic DIP with UV window)
Lead-Free [DATA_NEEDED: lead-free status] No (ceramic DIP contains lead)
Device Family — MAX 5000
Propagation Delay (tPD) — 25 ns
Usable Gates — 600 to 1000 (typical)
Logic Inputs — 32
Process Technology — CMOS EEPROM
Supply Voltage (VCC) — 5 V (typical)
Standby Current — [DATA_NEEDED: ICC standby current]
Programming Technology — UV-erasable (windowed) EEPROM
Logic Function — Combinational and registered (synchronous)
Output Polarity — Programmable
Program Retention — Non-volatile (EEPROM)
Mounting Type — Through-hole (DIP)

Datasheets & Resources

Browse All Products Create BOM Request Quote