EPM570T144C3 vs EPM570T144C5N Comparaison
Comparaison détaillée côte à côte de EPM570T144C3 par Intel et EPM570T144C5N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPM570T144C3 | EPM570T144C5N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $27,40 | $9,35 |
| Family | MAX II | MAX II |
| Device | EPM570 | — |
| Logic Elements (LEs) | 440 | 570 |
| Macro Cells | 440 | — |
| Maximum User I/O Pins | 160 | 116 |
| User Flash Memory | 4.0 Kbits | — |
| Logic Array Blocks (LABs) | 8 | — |
| Speed Grade | C3 (5.4 ns tPD1) | — |
| Process Technology | 0.18 µm | 0.18 µm 6-layer-metal flash |
| Core Voltage (VCCINT) | 3.3 V (internal regulator generates 2.5 V core) | 1.8 V (typical, internally regulated) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage, per bank) |
| Maximum Frequency (internal) | 304 MHz | — |
| Propagation Delay (tPD1) | 5.4 ns | — |
| Boîtier | 144-pin TQFP (20 mm × 20 mm × 1.4 mm) | TQFP-144 (20 × 20 mm, 0.5 mm pitch) |
| Operating Temperature (Commercial) | 0 °C to +85 °C | — |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | IEEE 1149.1 JTAG (in-system programmable) |
| Configuration | Non-volatile, instant-on (single-chip) | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Series | — | MAX II Device |
| Macrocells | — | 440 |
| User I/Os | — | 116 |
| Internal User Flash Memory | — | 8 Kbit |
| Global Clocks | — | 4 |
| Propagation Delay (tPD) | — | 5.5 ns (typical, [DATA_NEEDED: exact speed grade]) |
| Maximum Frequency (fMAX) | — | 201.1 MHz |
| Température de fonctionnement | — | 0 °C to +85 °C (commercial, C5 grade) |
| Type de montage | — | Surface Mount |
| Configuration Storage | — | On-chip non-volatile flash |
| Supported I/O Standards | — | LVCMOS, LVTTL, PCI, LVDS, SSTL (per bank VCCIO) |
| Lead-Free | — | Yes |
| Niveau MSL | — | 3 (per JEDEC J-STD-020) |
| Design Software | — | Intel Quartus II (MAX II device support) |