EPM570T144C3 - MAX II CPLD 440 LE 5.4ns TQFP-144 | Intel
Référence : EPM570T144C3 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $51.99 | $51,99 |
| 10 | $47.5 | $475,00 |
| 100 | $38.25 | $3 825,00 |
| 500 | $31.9 | $15 950,00 |
| 1 000 | $27.4 | $27 400,00 |
EPM570T144C3 Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the architecture of PAL/GAL with macro-cell arrays. It belongs to the broader category of programmable logic devices (PLDs), which sit alongside FPGAs as alternatives to fixed-function ASICs for glue logic, interface bridging, and state-machine implementation. CPLDs are characterized by instant-on behavior, deterministic timing, and high fan-in macrocells, making them ideal for control-plane applications.
Key features of the EPM570T144C3 include 440 Logic Elements distributed across 8 Logic Array Blocks, 160 user I/O pins, and 4.0 Kbits of user flash memory. The device supports in-system programmability (ISP) via IEEE 1149.1 JTAG, MultiVolt I/O for interfacing between 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic domains, and operates over a commercial temperature range of 0 °C to +85 °C. The C3 speed grade provides a 5.4 ns tPD1 timing budget for high-speed control applications.
Architecturally, the EPM570T144C3 uses a non-volatile flash-based lookup table structure within each Logic Element, providing single-chip functionality without a separate boot PROM. The MultiVolt core and I/O allow mixed-voltage system integration, while the JTAG interface supports boundary-scan test and on-board reconfiguration in production environments.
Typical applications include bus interface bridging, power-up sequencing for multi-rail systems, I/O expansion and decoding logic, LED display drivers, and glue-logic replacement for discrete 74-series TTL. The wide I/O count and instant-on nature also suit industrial control and motor-drive front-end logic.
When designing with this part, ensure that the Quartus II or Intel Quartus Prime toolchain is used for synthesis and fitting; design files compiled for the MAX II device family are required. Decoupling capacitors should be placed close to all VCCINT and VCCIO pins.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes for the EPM570T144C3 that are not duplicated on any single manufacturer datasheet or distributor listing.
Alternatives de remplacement direct pour EPM570T144C3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570T144C3 (même facteur de forme et même empreinte) — différant par Programming Interface, Operating Temperature, Package, Process Technology, Maximum User I/O Pins.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570T144C3N
✅ Remplacement direct✓ En stock
$9.6 / unité
Voir la fiche technique →EPM570T144C4N
✅ Remplacement direct✓ En stock
$25.1 / unité
Voir la fiche technique →EPM570T144C5N
✅ Remplacement direct✓ En stock
$9.35 / unité
Voir la fiche technique →EPM570GT144C3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.5 / unité
Voir la fiche technique →EPM570F256C3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.85 / unité
Voir la fiche technique →EPM570T144C3 Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Device | EPM570 |
| Logic Elements (LEs) | 440 |
| Macro Cells | 440 |
| Maximum User I/O Pins | 160 |
| User Flash Memory | 4.0 Kbits |
| Logic Array Blocks (LABs) | 8 |
| Speed Grade | C3 (5.4 ns tPD1) |
| Process Technology | 0.18 µm |
| Core Voltage (VCCINT) | 3.3 V (internal regulator generates 2.5 V core) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) |
| Maximum Frequency (internal) | 304 MHz |
| Propagation Delay (tPD1) | 5.4 ns |
| Boîtier | 144-pin TQFP (20 mm × 20 mm × 1.4 mm) |
| Operating Temperature (Commercial) | 0 °C to +85 °C |
| Programming Interface | IEEE 1149.1 JTAG (ISP) |
| Configuration | Non-volatile, instant-on (single-chip) |
Configuration des broches de EPM570T144C3
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 3) |
| Broche 59 | I/O — User I/O pin (bank 3) |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | GND — Ground |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | I/O — User I/O pin (bank 4) |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 75 | I/O — User I/O pin (bank 4) |
| Broche 76 | I/O — User I/O pin (bank 4) |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | I/O — User I/O pin (bank 4) |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O pin (bank 1) |
| Broche 83 | I/O — User I/O pin (bank 1) |
| Broche 84 | I/O — User I/O pin (bank 1) |
| Broche 85 | I/O — User I/O pin (bank 1) |
| Broche 86 | I/O — User I/O pin (bank 1) |
| Broche 87 | I/O — User I/O pin (bank 1) |
| Broche 88 | I/O — User I/O pin (bank 1) |
| Broche 89 | I/O — User I/O pin (bank 1) |
| Broche 90 | I/O — User I/O pin (bank 1) |
| Broche 91 | I/O — User I/O pin (bank 1) |
| Broche 92 | I/O — User I/O pin (bank 1) |
| Broche 93 | VCCINT — Internal core voltage (3.3 V, internal regulator generates 2.5 V core) |
| Broche 94 | I/O — User I/O pin (bank 1) |
| Broche 95 | I/O — User I/O pin (bank 1) |
| Broche 96 | I/O — User I/O pin (bank 1) |
| Broche 97 | I/O — User I/O pin (bank 1) |
| Broche 98 | I/O — User I/O pin (bank 1) |
| Broche 99 | I/O — User I/O pin (bank 1) |
| Broche 100 | I/O — User I/O pin (bank 1) |
| Broche 101 | GND — Ground |
| Broche 102 | I/O — User I/O pin (bank 2) |
| Broche 103 | I/O — User I/O pin (bank 2) |
| Broche 104 | I/O — User I/O pin (bank 2) |
| Broche 105 | I/O — User I/O pin (bank 2) |
| Broche 106 | I/O — User I/O pin (bank 2) |
| Broche 107 | I/O — User I/O pin (bank 2) |
| Broche 108 | I/O — User I/O pin (bank 2) |
| Broche 109 | I/O — User I/O pin (bank 2) |
| Broche 110 | I/O — User I/O pin (bank 2) |
| Broche 111 | I/O — User I/O pin (bank 2) |
| Broche 112 | I/O — User I/O pin (bank 2) |
| Broche 113 | I/O — User I/O pin (bank 2) |
| Broche 114 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 115 | I/O — User I/O pin (bank 2) |
| Broche 116 | I/O — User I/O pin (bank 2) |
| Broche 117 | I/O — User I/O pin (bank 2) |
| Broche 118 | I/O — User I/O pin (bank 2) |
| Broche 119 | I/O — User I/O pin (bank 2) |
| Broche 120 | I/O — User I/O pin (bank 2) |
| Broche 121 | GND — Ground |
| Broche 122 | TMS — JTAG Test Mode Select |
| Broche 123 | TDI — JTAG Test Data In |
| Broche 124 | TCK — JTAG Test Clock |
| Broche 125 | I/O — User I/O pin (bank 4) |
| Broche 126 | I/O — User I/O pin (bank 4) |
| Broche 127 | I/O — User I/O pin (bank 4) |
| Broche 128 | I/O — User I/O pin (bank 4) |
| Broche 129 | I/O — User I/O pin (bank 4) |
| Broche 130 | I/O — User I/O pin (bank 4) |
| Broche 131 | I/O — User I/O pin (bank 4) |
| Broche 132 | I/O — User I/O pin (bank 4) |
| Broche 133 | I/O — User I/O pin (bank 4) |
| Broche 134 | I/O — User I/O pin (bank 4) |
| Broche 135 | I/O — User I/O pin (bank 4) |
| Broche 136 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 137 | I/O — User I/O pin (bank 4) |
| Broche 138 | I/O — User I/O pin (bank 4) |
| Broche 139 | I/O — User I/O pin (bank 4) |
| Broche 140 | I/O — User I/O pin (bank 4) |
| Broche 141 | TDO — JTAG Test Data Out |
| Broche 142 | I/O — User I/O pin (bank 4) |
| Broche 143 | I/O — User I/O pin (bank 4) |
| Broche 144 | I/O — User I/O pin (bank 4) |
Applications typiques
EPM570T144C3 convient pour 7 applications: Bus Interface Bridging, Power-Up Sequencing Controller, Address Decoding and Chip-Select Generation, Industrial Control and Motor-Drive Front-End Logic, LED Display Driver and Multiplexing, Legacy TTL/CMOS Glue Logic Replacement, I/O Expansion for Microcontrollers.
Bus Interface Bridging
The EPM570T144C3 is well suited to bus-bridging tasks where a microprocessor must connect to peripherals with mismatched bus widths or voltages. Its 5.4 ns tPD1 propagation delay comfortably handles asynchronous 8/16/32-bit handshakes up to ~50 MHz, and its MultiVolt I/O supports direct 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling without level shifters. With 160 user I/O available in the TQFP-144, designers can implement full 32-bit address/data muxing plus control signal glue in a single device.
Recommandé
Power-Up Sequencing Controller
Power-up sequencers require deterministic timing and instant-on behavior - exactly the strengths of the EPM570T144C3. Because the device is non-volatile, it begins executing its state machine within microseconds of VCCINT reaching regulation, well before most analog rails stabilize. Its 440 LE are more than sufficient to implement multi-rail PG (power-good) chains with programmable delays using internal logic and a JTAG-updatable delay parameter. Compared with discrete RC sequencing networks, the CPLD approach enables in-system re-tuning without board rework.
Recommandé
Address Decoding and Chip-Select Generation
The EPM570T144C3 is a classic choice for address decoding in microcontroller and microprocessor systems where multiple peripherals share a bus. Its 5.4 ns tPD1 propagation delay introduces minimal wait-state insertion, and its 160 user I/O accommodate the wide address ranges typical of 32-bit cores. Designers can implement any decoding logic - full binary, partial, or windowed - and update it via JTAG ISP without re-spinning the board, dramatically shortening prototype iterations.
Recommandé
Industrial Control and Motor-Drive Front-End Logic
Industrial control panels often require deterministic glue logic for sensor conditioning, fault aggregation, and drive enable signals. The EPM570T144C3 supports up to 160 I/O, enabling direct interface to 24 V opto-isolated inputs and 3.3 V logic outputs via MultiVolt banks. Its instant-on non-volatile configuration prevents inrush misbehavior on cold-boot, and its 5.4 ns tPD1 timing supports deterministic fault-interlock response. For extended temperature ranges, the I-grade EPM570T144I3 variant is preferred where available in the same footprint.
Recommandé
LED Display Driver and Multiplexing
The EPM570T144C3 can drive LED matrix displays by multiplexing rows and columns with precise timing. Its 304 MHz maximum internal frequency and 5.4 ns tPD1 allow high-refresh-rate PWM generation for color-mixing or large dot-matrix panels. With 160 user I/O, the device can directly sink 16+ row/column lines per panel without external drivers, and the JTAG ISP allows firmware-updates for new display patterns without re-soldering.
Recommandé
Legacy TTL/CMOS Glue Logic Replacement
Designers often replace dozens of discrete 74-series TTL or 4000-series CMOS packages with a single EPM570T144C3, simplifying the BOM and reducing PCB area. The 440 LE are sufficient to implement encoders, decoders, multiplexers, latches, and small state machines that previously occupied a board corner. Because the configuration is non-volatile and field-updatable via JTAG, design bugs found in production can be patched without reworking the PCB.
Recommandé
I/O Expansion for Microcontrollers
When a microcontroller runs out of GPIO, the EPM570T144C3 can add up to 160 individually configurable I/O lines through a simple SPI or parallel interface. Each pin supports MultiVolt signaling, allowing the CPLD to talk to 1.8 V sensors and 3.3 V MCUs from a single device. The 5.4 ns tPD1 timing keeps I/O skew well under one SPI clock period, and the JTAG interface enables runtime I/O test and reconfiguration for safety-critical applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570T144C3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570T144C3N | EPM570T144C4N | EPM570T144C5N | EPM570GT144C3 | EPM570F256C3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 | TQFP-144 compatible (FineLine BGA migration) |
| Speed Grade | C3 (5.4 ns tPD1) | C3 (5.4 ns) | C4 (~6.5 ns) | C5 (~8.0 ns) | C3 (5.4 ns) | C3 (5.4 ns) |
| Logic Elements | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O Pins (max) | 160 | 160 | 160 | 160 | 160 | 160 |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Lead-Free / RoHS | Unknown | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free, legacy G-suffix) | Depends on sub-suffix (N) |
Principaux différenciateurs
- Instant-on non-volatile configuration eliminates external boot PROM (vs EPM570F256C3 (FineLine BGA migration option))
- 160 user I/O pins in a 0.5 mm pitch TQFP - highest count in MAX II family for this package (vs EPM240T100C3 (TQFP-100))
- MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V in a single device (vs Discrete 74-series TTL glue logic)
Notes de conception
The EPM570T144C3 requires a 3.3 V supply on VCCINT (an internal LDO generates the 2.5 V core), and each of the four I/O banks (VCCIO1-4) may be powered independently at 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Place one 0.1 µF decoupling capacitor within 2 mm of every VCCINT and VCCIO pin, plus a single 10 µF bulk capacitor per bank to suppress switching transients during ISP programming. Avoid powering VCCIO at a voltage not supported by the chosen I/O standard.
The 144-pin TQFP package has a 0.5 mm pitch and 20 mm × 20 mm body, which demands careful trace escape routing. Use 0.15 mm/0.20 mm trace/space between TQFP fingers and fan out to inner power planes on the second layer. Keep all four I/O bank supplies (VCCIO1-4) on a single plane region if possible, and provide at least one continuous GND plane beneath the device for return-path integrity during JTAG boundary-scan.
Pin 1 is located at the top-left of the TQFP-144 package when the dot marker is oriented to the upper-left. The JTAG signals TCK (pin 124), TMS (pin 122), TDI (pin 123), and TDO (pin 141) must be routed away from high-frequency switching signals and length-matched within 25 mm to avoid boundary-scan failures. A 10 kΩ pull-up on TDI and TMS, plus a 10 kΩ pull-up on TDO, is recommended for stable JTAG operation.
Do not confuse the speed-grade suffix C3 (fastest, 5.4 ns) with C5 (slowest, ~8.0 ns) when substituting across production runs - timing closure may fail. The 'T' prefix in EPM570T144 indicates TQFP package, while 'G' and 'F' prefixes denote legacy lead-free and FineLine BGA migration options. Always re-validate the Quartus II fitter report after a speed-grade or package-marker change.
Although CPLD outputs have slower edge rates than FPGAs (typically 2-3 ns), the 5.4 ns tPD1 timing budget assumes a 50 pF load. For high-fanout signals driving more than eight inputs or external cables, add a series 22 Ω damping resistor close to the CPLD output to limit overshoot and ringing. For MultiVolt I/O banks, mix only compatible voltage standards in the same bank - mixing 1.5 V and 3.3 V in one bank is not allowed.
Informations de conformité
RoHS/lead-free status was not confirmed in the verified web data; the EPM570T144C3N variant is documented as Pb-free. AEC-Q100 is not applicable to a general-purpose commercial CPLD. Conflict-minerals statement available from Intel's Corporate Responsibility Report.
