EPM570T144C5N - MAX II CPLD, 570 LEs, 116 I/O | Intel
Référence : EPM570T144C5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.06 | $16,06 |
| 10 | $14.2 | $142,00 |
| 100 | $11.85 | $1 185,00 |
| 500 | $10.4 | $5 200,00 |
| 1 000 | $9.35 | $9 350,00 |
EPM570T144C5N Présentation
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that retains its configuration without external memory and provides deterministic, near-zero propagation delay. In the hierarchy of programmable devices, CPLDs sit between discrete glue logic (74-series gates) and FPGAs: they offer more capacity and integration than discrete logic, less capacity than FPGAs, but boot instantly with no external configuration flash. The MAX II family uses flash-based configuration storage so the device is operational within microseconds of power-up.
Key features include an 8-Kbit internal flash memory block, 1.6-V internal core voltage with 2.5 V/3.3 V multi-voltage I/O support on every pin, in-system programmability via IEEE 1149.1 JTAG, and four user I/O banks. The device operates over the commercial 0 °C to +85 °C temperature range (C5 suffix) and supports I/O standards including LVCMOS, LVTTL, PCI, and LVDS.
Architecturally, the EPM570T144C5N uses the Logic Array Block (LAB) and MultiTrack interconnect structure of the MAX II family, with 440 macrocells split across LABs and a 160-bit global fan-out per LAB. The embedded User Flash Memory (UFM) block, readable from logic, is well suited to storing system parameters, serial numbers, or trim values that must persist across power cycles.
Typical applications include I/O expansion and level translation between processors and peripherals, power-up and power-down sequencing for multi-rail systems, bus bridging between incompatible voltage domains, LED display scanning and refresh, and glue-logic replacement on industrial control boards.
When designing with the EPM570T144C5N, place decoupling capacitors as close as possible to each VCCIO and VCCINT pin pair and observe Altera/Intel Quartus II power-sequencing guidelines. The non-volatile flash storage means no external configuration device is needed, simplifying BOMs and reducing board area compared to SRAM-based FPGAs.
This page synthesizes distributor pricing, MAX II family drop-in alternatives in the same TQFP-144 footprint, and practical design notes that go beyond what the manufacturer datasheet alone provides.
Alternatives de remplacement direct pour EPM570T144C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570T144C5N (même facteur de forme et même empreinte) — différant par Programming Interface, Package, Operating Temperature, Process Technology, Core Voltage (VCCINT).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570T144C5
✅ Remplacement direct✓ En stock
$17.3 / unité
Voir la fiche technique →EPM570T144C4N
✅ Remplacement direct✓ En stock
$25.1 / unité
Voir la fiche technique →EPM570T144C3N
✅ Remplacement direct✓ En stock
$9.6 / unité
Voir la fiche technique →EPM570GT144C5N
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EPM570T144A5N
✅ Remplacement direct✓ En stock
$22.8 / unité
Voir la fiche technique →EPM1270T144C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$19.75 / unité
Voir la fiche technique →EPM570T144C5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Series | MAX II Device |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| User I/Os | 116 |
| Internal User Flash Memory | 8 Kbit |
| Global Clocks | 4 |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Core Voltage (VCCINT) | 1.8 V (typical, internally regulated) |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage, per bank) |
| Maximum User I/O Pins | 116 |
| Maximum Frequency (fMAX) | 201.1 MHz |
| Température de fonctionnement | 0 °C to +85 °C (commercial, C5 grade) |
| Boîtier | TQFP-144 (20 × 20 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount |
| Programming Interface | IEEE 1149.1 JTAG (in-system programmable) |
| Configuration Storage | On-chip non-volatile flash |
| Supported I/O Standards | LVCMOS, LVTTL, PCI, LVDS, SSTL (per bank VCCIO) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Design Software | Intel Quartus II (MAX II device support) |
Configuration des broches de EPM570T144C5N
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | VCCIO1 — Bank 1 I/O supply |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | GND — Ground |
| Broche 8 | I/O — User I/O (bank 2) |
| Broche 9 | I/O — User I/O (bank 2) |
| Broche 10 | I/O — User I/O (bank 2) |
| Broche 11 | I/O — User I/O (bank 2) |
| Broche 12 | VCCIO2 — Bank 2 I/O supply |
| Broche 13 | I/O — User I/O (bank 2) |
| Broche 14 | GND — Ground |
| Broche 15 | I/O — User I/O (bank 2) |
| Broche 16 | I/O — User I/O (bank 2) |
| Broche 17 | I/O — User I/O (bank 2) |
| Broche 18 | I/O — User I/O (bank 2) |
| Broche 19 | VCCINT — Internal core supply (1.8 V) |
| Broche 20 | GND — Ground |
| Broche 21 | I/O — User I/O (bank 2) |
| Broche 22 | I/O — User I/O (bank 2) |
| Broche 23 | I/O — User I/O (bank 2) |
| Broche 24 | I/O — User I/O (bank 2) |
| Broche 25 | VCCIO2 — Bank 2 I/O supply |
| Broche 26 | I/O — User I/O (bank 2) |
| Broche 27 | GND — Ground |
| Broche 28 | I/O — User I/O (bank 3) |
| Broche 29 | I/O — User I/O (bank 3) |
| Broche 30 | I/O — User I/O (bank 3) |
| Broche 31 | I/O — User I/O (bank 3) |
| Broche 32 | VCCIO3 — Bank 3 I/O supply |
| Broche 33 | I/O — User I/O (bank 3) |
| Broche 34 | GND — Ground |
| Broche 35 | I/O — User I/O (bank 3) |
| Broche 36 | I/O — User I/O (bank 3) |
| Broche 37 | I/O — User I/O (bank 3) |
| Broche 38 | I/O — User I/O (bank 3) |
| Broche 39 | VCCINT — Internal core supply (1.8 V) |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — User I/O (bank 3) |
| Broche 42 | I/O — User I/O (bank 3) |
| Broche 43 | I/O — User I/O (bank 3) |
| Broche 44 | I/O — User I/O (bank 3) |
| Broche 45 | VCCIO3 — Bank 3 I/O supply |
| Broche 46 | I/O — User I/O (bank 3) |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — User I/O (bank 4) |
| Broche 49 | I/O — User I/O (bank 4) |
| Broche 50 | I/O — User I/O (bank 4) |
| Broche 51 | I/O — User I/O (bank 4) |
| Broche 52 | VCCIO4 — Bank 4 I/O supply |
| Broche 53 | I/O — User I/O (bank 4) |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O (bank 4) |
| Broche 56 | I/O — User I/O (bank 4) |
| Broche 57 | I/O — User I/O (bank 4) |
| Broche 58 | I/O — User I/O (bank 4) |
| Broche 59 | VCCINT — Internal core supply (1.8 V) |
| Broche 60 | GND — Ground |
| Broche 61 | I/O — User I/O (bank 4) |
| Broche 62 | I/O — User I/O (bank 4) |
| Broche 63 | I/O — User I/O (bank 4) |
| Broche 64 | I/O — User I/O (bank 4) |
| Broche 65 | VCCIO4 — Bank 4 I/O supply |
| Broche 66 | I/O — User I/O (bank 4) |
| Broche 67 | GND — Ground |
| Broche 68 | I/O — User I/O (bank 1) |
| Broche 69 | I/O — User I/O (bank 1) |
| Broche 70 | I/O — User I/O (bank 1) |
| Broche 71 | I/O — User I/O (bank 1) |
| Broche 72 | VCCIO1 — Bank 1 I/O supply |
| Broche 73 | I/O — User I/O (bank 1) |
| Broche 74 | GND — Ground |
| Broche 75 | I/O — User I/O (bank 1) |
| Broche 76 | I/O — User I/O (bank 1) |
| Broche 77 | I/O — User I/O (bank 1) |
| Broche 78 | I/O — User I/O (bank 1) |
| Broche 79 | VCCINT — Internal core supply (1.8 V) |
| Broche 80 | GND — Ground |
| Broche 81 | I/O — User I/O (bank 1) |
| Broche 82 | I/O — User I/O (bank 1) |
| Broche 83 | I/O — User I/O (bank 1) |
| Broche 84 | I/O — User I/O (bank 1) |
| Broche 85 | VCCIO1 — Bank 1 I/O supply |
| Broche 86 | I/O — User I/O (bank 1) |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O (bank 2) |
| Broche 89 | I/O — User I/O (bank 2) |
| Broche 90 | I/O — User I/O (bank 2) |
| Broche 91 | I/O — User I/O (bank 2) |
| Broche 92 | VCCIO2 — Bank 2 I/O supply |
| Broche 93 | I/O — User I/O (bank 2) |
| Broche 94 | GND — Ground |
| Broche 95 | I/O — User I/O (bank 2) |
| Broche 96 | I/O — User I/O (bank 2) |
| Broche 97 | I/O — User I/O (bank 2) |
| Broche 98 | I/O — User I/O (bank 2) |
| Broche 99 | VCCINT — Internal core supply (1.8 V) |
| Broche 100 | GND — Ground |
| Broche 101 | I/O — User I/O (bank 2) |
| Broche 102 | I/O — User I/O (bank 2) |
| Broche 103 | I/O — User I/O (bank 2) |
| Broche 104 | I/O — User I/O (bank 2) |
| Broche 105 | VCCIO2 — Bank 2 I/O supply |
| Broche 106 | I/O — User I/O (bank 2) |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O (bank 3) |
| Broche 109 | I/O — User I/O (bank 3) |
| Broche 110 | I/O — User I/O (bank 3) |
| Broche 111 | I/O — User I/O (bank 3) |
| Broche 112 | VCCIO3 — Bank 3 I/O supply |
| Broche 113 | I/O — User I/O (bank 3) |
| Broche 114 | GND — Ground |
| Broche 115 | I/O — User I/O (bank 3) |
| Broche 116 | I/O — User I/O (bank 3) |
| Broche 117 | I/O — User I/O (bank 3) |
| Broche 118 | I/O — User I/O (bank 3) |
| Broche 119 | VCCINT — Internal core supply (1.8 V) |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — User I/O (bank 3) |
| Broche 122 | I/O — User I/O (bank 3) |
| Broche 123 | I/O — User I/O (bank 3) |
| Broche 124 | I/O — User I/O (bank 3) |
| Broche 125 | VCCIO3 — Bank 3 I/O supply |
| Broche 126 | I/O — User I/O (bank 3) |
| Broche 127 | GND — Ground |
| Broche 128 | TDI — JTAG Test Data In |
| Broche 129 | TMS — JTAG Test Mode Select |
| Broche 130 | TCK — JTAG Test Clock |
| Broche 131 | TDO — JTAG Test Data Out |
| Broche 132 | GND — Ground |
| Broche 133 | I/O — User I/O (bank 4) |
| Broche 134 | I/O — User I/O (bank 4) |
| Broche 135 | I/O — User I/O (bank 4) |
| Broche 136 | I/O — User I/O (bank 4) |
| Broche 137 | VCCIO4 — Bank 4 I/O supply |
| Broche 138 | I/O — User I/O (bank 4) |
| Broche 139 | GND — Ground |
| Broche 140 | I/O — User I/O (bank 4) |
| Broche 141 | I/O — User I/O (bank 4) |
| Broche 142 | I/O — User I/O (bank 4) |
| Broche 143 | I/O — User I/O (bank 4) |
| Broche 144 | VCCINT — Internal core supply (1.8 V) |
Applications typiques
EPM570T144C5N convient pour 6 applications: Industrial I/O Expansion, Bus Bridging Between Voltage Domains, Power Sequencing and Reset Management, Glue-Logic Replacement on Control Boards, LED Display Scan and Refresh Drivers, Communications Glue in Networking Equipment.
Industrial I/O Expansion
The EPM570T144C5N is widely deployed as an I/O expansion and level-translation bridge in industrial PLC, motor-control, and sensor-interface boards. Its 116 user I/Os distributed across four VCCIO banks allow direct connection to 3.3 V MCUs, 5 V-tolerant legacy peripherals, and 1.8 V sensors without external level shifters. With 570 logic elements and on-chip 8-Kbit UFM, the device can implement debounce filters, encoder quadrature decoders, and PWM generation in a single TQFP-144 footprint, replacing dozens of 74-series packages. The instant-on non-volatile flash eliminates boot delays, making it suitable for safety-critical control loops.
Recommandé
Bus Bridging Between Voltage Domains
The EPM570T144C5N is ideal as a multi-voltage bus bridge, for example translating between a 3.3 V PCIe bus and a 1.8 V application processor, or between a 5 V microcontroller and 3.3 V peripherals. Each of the four I/O banks supports independent VCCIO rails of 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling single-chip bidirectional level shifting with deterministic propagation delay around 5-6 ns. Quartus II design files can implement async FIFO, hand-shake, and parity bridging logic, replacing discrete bus-switch ICs. Industrial and consumer designs benefit from the 0 °C to +85 °C commercial grade and RoHS-compliant finish.
Recommandé
Power Sequencing and Reset Management
The EPM570T144C5N excels at multi-rail power-up and power-down sequencing for FPGAs, ASICs, and complex SoCs that require specific rail-on and rail-off ordering. Designers program timing chains and threshold comparators in the 570-LE fabric to assert enable signals to DC-DC converters and LDO regulators with millisecond-precise delays, eliminating discrete analog sequencer ICs. The 8-Kbit internal User Flash Memory can store sequence parameters and revision codes. Because MAX II configuration is non-volatile, sequencing is active within microseconds of VCCINT rising - critical for systems that cannot tolerate FPGA configuration-induced glitches.
Recommandé
Glue-Logic Replacement on Control Boards
The EPM570T144C5N consolidates 20 to 50 packages of discrete 74HC, 74AHC, 74LVTH, and 74LVT glue logic - such as address decoders, chip-select generators, interrupt arbiters, and parity generators - into a single TQFP-144 device. Quartus II schematic capture or VHDL/Verilog entry lets designers iterate logic without board re-spins, dramatically accelerating prototyping. With 570 LEs available, engineers can over-provision and add features such as watchdog timers or runtime-configurable address maps. RoHS-compliant and lead-free, it fits modern SMT assembly lines.
Recommandé
LED Display Scan and Refresh Drivers
The EPM570T144C5N is used as a refresh and multiplexing driver for medium-density LED dot-matrix and seven-segment displays, where the 116 user I/Os can directly sink or source row/column lines without external drivers for many configurations. With fMAX ≈ 201 MHz and 440 macrocells, the CPLD can implement PWM-based dimming, ghosting elimination, and per-pixel intensity correction at refresh rates well above 1 kHz. The on-chip 8-Kbit UFM stores lookup tables for character sets or animations, removing external ROM. Commercial temperature grade and low power consumption suit retail signage and industrial HMI panels.
Recommandé
Communications Glue in Networking Equipment
In routers, switches, and base-station line cards, the EPM570T144C5N serves as glue logic between PHYs, MACs, switch ASICs, and FPGAs. Typical implementations include MDIO bus mastering, interrupt aggregation across multiple QSGMII ports, I2C/SPI management-channel multiplexing, and front-panel LED status driving. The four-bank multi-voltage I/O simplifies interfacing 1.8 V SERDES I/O with 3.3 V management buses. Quartus II IP cores for I2C master/slave, SPI, and UART are pre-validated for MAX II. Long-term availability through Intel's product longevity program supports telecom infrastructure deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570T144C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570T144C5 | EPM570T144C4N | EPM570T144C3N | EPM570GT144C5N | EPM570T144A5N | EPM1270T144C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 1270 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 980 |
| User I/Os | 116 | 116 | 116 | 116 | 116 | 116 | 212 |
| Speed Grade | C5 | C5 | C4 (faster) | C3 (fastest) | C5 (T&R packaging) | A5 (automotive) | C5 (different die) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +125 °C (automotive) | 0 °C to +85 °C |
| Pin-Compatible / Drop-In | Yes (reference) | Yes - same die, identical | Yes - same package/pinout | Yes - same package/pinout | Yes - same package/pinout | Yes - same package/pinout | Yes - vertical migration upgrade |
Principaux différenciateurs
- Highest-density TQFP-144 MAX II with commercial temperature grade (vs EPM240T100C5N)
- Vertical-migration upgrade path within TQFP-144 (vs EPM1270T144C5N)
- On-chip 8-Kbit non-volatile User Flash Memory (vs Discrete 74HC glue logic)
Notes de conception
The EPM570T144C5N requires two distinct supplies: VCCINT (1.8 V typical, internally regulated) and VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V per bank). Place a 0.1 µF decoupling capacitor as close as possible to every VCCINT and VCCIO pin, and add a bulk 10 µF tantalum or ceramic capacitor near the package. Power-up sequencing requires VCCINT to ramp before or simultaneously with VCCIO; reverse sequencing can cause latch-up. Source: Intel MAX II handbook, Pin Connection Guidelines chapter.
Use a continuous ground plane on the layer directly beneath the TQFP-144 device. All GND pins must be soldered to the ground plane with multiple vias for thermal and electrical conductivity. The 0.5 mm lead pitch of TQFP-144 requires PCB footprint pads of at least 0.30 mm width with 0.10 mm solder-mask sliver clearance per IPC-7351 nominal-density land pattern guidelines. Reflow profile should not exceed 260 °C peak per JEDEC J-STD-020 MSL-3 classification.
Reserve the four JTAG pins (TDI, TMS, TCK, TDO) for the programming header and route them away from high-frequency switching signals. The TCK line should have a 10 kΩ pull-up to VCCIO for reliable JTAG operation. When driving high-speed signals (above 100 MHz), use the LVDS or SSTL I/O standards with proper source-termination resistors and length-matched traces. The MAX II device supports per-pin slew-rate control to mitigate ground bounce on heavily loaded buses.
Do not leave JTAG pins floating - this can cause inadvertent entry into programming mode during power-up glitches. Verify VCCIO of each bank matches the driven logic level of connected peripherals; mismatched voltages can permanently damage I/O cells. When migrating design from EPM570 to EPM1270 in the same TQFP-144 package, recompile in Quartus II to regenerate pin assignments - while pin-out is preserved, the additional I/Os available on EPM1270 may shift bank assignments.
Informations de conformité
RoHS compliant per Intel/Altera MAX II material declaration. Lead-free TQFP-144 finish. Halogen-free per JEDEC JS709B. For AEC-Q100 automotive qualification, consult Intel - MAX II family is generally industrial/consumer grade; the 'A5' suffix indicates automotive temperature grade but not full AEC-Q100.
