H5ANAG6NBJR-UHC vs H5ANAG6NAMR-UHC Comparaison
Comparaison détaillée côte à côte de H5ANAG6NBJR-UHC par SK hynix et H5ANAG6NAMR-UHC par SK hynix. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | H5ANAG6NBJR-UHC | H5ANAG6NAMR-UHC |
|---|---|---|
| Marque | SK hynix | SK hynix |
| Catégorie | DRAM | Memory ICs |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $8,09 | $4,50 |
| Type de mémoire | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | — |
| Organisation de la mémoire | 256M x 16 | 1G x 16 |
| Interface | DDR4 (CMOS) | — |
| Boîtier | PBGA96 / FBGA-96 (TFBGA) | FBGA-96 (PBGA96) |
| Package Dimensions | 13 mm length (per JESD-30 R-PBGA-B96) | — |
| Access Mode | Multi Bank, Page Burst | — |
| Température de fonctionnement | -40C to +95C | [DATA_NEEDED: operating temperature range] |
| Refresh | Auto / Self Refresh | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| Data Mask | Supported (DM function) | — |
| Asynchronous Reset | Supported | — |
| On-Chip Termination | Dynamic ODT | — |
| ZQ Calibration | Supported | — |
| Write Leveling | Supported | — |
| CRC | Supported | — |
| Supply Voltage Class | DDR4 (1.2 V class) | — |
| Statut RoHS | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| REACH Compliance | Compliant | — |
| ECCN | EAR99 | — |
| HTS Code | 8542.32.00.36 | — |
| Latence CAS | [DATA_NEEDED: CAS Latency] | [DATA_NEEDED: CL for UHC bin] |
| Max Data Rate | [DATA_NEEDED: Max Data Rate] | — |
| Memory Density | — | 16 Gbit (2 GB) |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Supply Voltage (VDD) | — | 1.2 V |
| Architecture | — | CMOS DDR4 with bank groups |
| Power Class | — | Normal Power |
| Type de montage | — | Surface Mount (BGA solder ball) |
| Type d'interface | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| Statut du cycle de vie | — | Active production |