H5ANAG6NBJR-UHC vs H5ANAG6NAMR-UHC Comparison
Detailed side-by-side comparison of H5ANAG6NBJR-UHC by SK hynix and H5ANAG6NAMR-UHC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5ANAG6NBJR-UHC | H5ANAG6NAMR-UHC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | DRAM | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8.09 | $4.50 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | — |
| Organization | 256M x 16 | 1G x 16 |
| Interface | DDR4 (CMOS) | — |
| Package | PBGA96 / FBGA-96 (TFBGA) | FBGA-96 (PBGA96) |
| Package Dimensions | 13 mm length (per JESD-30 R-PBGA-B96) | — |
| Access Mode | Multi Bank, Page Burst | — |
| Operating Temperature | -40C to +95C | [DATA_NEEDED: operating temperature range] |
| Refresh | Auto / Self Refresh | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| Data Mask | Supported (DM function) | — |
| Asynchronous Reset | Supported | — |
| On-Chip Termination | Dynamic ODT | — |
| ZQ Calibration | Supported | — |
| Write Leveling | Supported | — |
| CRC | Supported | — |
| Supply Voltage Class | DDR4 (1.2 V class) | — |
| RoHS Status | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| REACH Compliance | Compliant | — |
| ECCN | EAR99 | — |
| HTS Code | 8542.32.00.36 | — |
| CAS Latency | [DATA_NEEDED: CAS Latency] | [DATA_NEEDED: CL for UHC bin] |
| Max Data Rate | [DATA_NEEDED: Max Data Rate] | — |
| Memory Density | — | 16 Gbit (2 GB) |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Supply Voltage (VDD) | — | 1.2 V |
| Architecture | — | CMOS DDR4 with bank groups |
| Power Class | — | Normal Power |
| Mounting Type | — | Surface Mount (BGA solder ball) |
| Interface Type | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| Lifecycle Status | — | Active production |