M1AFS250-1FG256I vs M1AFS250-FG256I Comparaison
Comparaison détaillée côte à côte de M1AFS250-1FG256I par Microchip Technology et M1AFS250-FG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS250-1FG256I | M1AFS250-FG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $96,50 | $33,10 |
| Series | Fusion (M1 - with ARM Cortex-M1) | Fusion |
| System Gates | 250000 gates | — |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | — |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | — |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| Température de fonctionnement | -40C to +85C (industrial, suffix I) | -40C ~ +100C (TJ) |
| Speed Grade | -1 | [DATA_NEEDED: speed grade] |
| Boîtier | 256-LBGA (FBGA) | — |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| Type de montage | Surface Mount | Surface Mount |
| Supplier Device Package | 256-LBGA | 256-FPBGA (17x17) |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Number of Gates | — | 250000 |
| Number of I/O | — | 114 |
| Total RAM Bits | — | 36864 |
| Number of Logic Elements | — | [DATA_NEEDED: Number of Logic Elements] |
| Tension d'alimentation | — | 1.425V ~ 1.575V |
| Boîtier / Format | — | 256-LBGA |
| Packaging | — | Tray |
| Product Status | — | Active |
| Manufacturer Lead Time | — | 16 weeks |
| Process Technology | — | 130nm, 7-layer metal, flash-based CMOS |
| System Performance | — | 350 MHz |
| Core | — | ARM Cortex-M1 |
| Statut RoHS | — | RoHS Non-Compliant |
| Lead Free Status | — | Contains Lead |