M1AFS250-1FG256I vs M1AFS250-FG256I Comparación
Comparación detallada lado a lado de M1AFS250-1FG256I por Microchip Technology y M1AFS250-FG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS250-1FG256I | M1AFS250-FG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $96,50 | $33,10 |
| Series | Fusion (M1 - with ARM Cortex-M1) | Fusion |
| System Gates | 250000 gates | — |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | — |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | — |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| Temperatura de funcionamiento | -40C to +85C (industrial, suffix I) | -40C ~ +100C (TJ) |
| Speed Grade | -1 | [DATA_NEEDED: speed grade] |
| Encapsulado | 256-LBGA (FBGA) | — |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Supplier Device Package | 256-LBGA | 256-FPBGA (17x17) |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Number of Gates | — | 250000 |
| Number of I/O | — | 114 |
| Total RAM Bits | — | 36864 |
| Number of Logic Elements | — | [DATA_NEEDED: Number of Logic Elements] |
| Tensión de alimentación | — | 1.425V ~ 1.575V |
| Encapsulado / Carcasa | — | 256-LBGA |
| Packaging | — | Tray |
| Product Status | — | Active |
| Manufacturer Lead Time | — | 16 weeks |
| Process Technology | — | 130nm, 7-layer metal, flash-based CMOS |
| System Performance | — | 350 MHz |
| Core | — | ARM Cortex-M1 |
| Estado RoHS | — | RoHS Non-Compliant |
| Lead Free Status | — | Contains Lead |