M1AFS600-1FGG484 vs AFS600-2FGG484 Comparaison
Comparaison détaillée côte à côte de M1AFS600-1FGG484 par Microchip Technology et AFS600-2FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS600-1FGG484 - Fusion FPGA, 600K Gates, 172 I/O | Microchip
M1AFS600-1FGG484 ✓ ActifMicrochip Technology
AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG484 ✓ ActifComparaison des spécifications
| Paramètre | M1AFS600-1FGG484 | AFS600-2FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Family | Fusion | — |
| Number of System Gates | 600K | — |
| Number of I/O | 172 | — |
| Number of RAM Bits | 110592 | — |
| Boîtier | 484-BGA (FBGA) | — |
| Core Voltage | 1.5V | — |
| Maximum Internal Frequency | 1282.05 MHz | — |
| Technology | 130nm | — |
| Type de montage | Surface Mount | Surface mount |
| Plage de température de fonctionnement | [DATA_NEEDED: Operating Temperature Range] | — |
| Statut RoHS | RoHS Compliant | — |
| Lead Free Status | Lead Free | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Flash-Based Configuration | Yes | — |
| Security | 128-bit flash-based lock, AES decryption | — |
| Device Type | — | Fusion mixed-signal field-programmable gate array (FPGA) |
| System Gates | — | 600,000 gates |
| Logic Elements | — | 110,592 logic elements |
| User I/O Count | — | 172 I/O |
| Maximum Frequency | — | 1470.59 MHz |
| Tension d'alimentation | — | 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 layers |
| Package Type | — | 484-pin FBGA |
| Package Body Size | — | 23 x 23 mm |
| Package Pitch | — | 1.0 mm |
| Programmable Logic | — | Flash-based programmable logic |
| Analog Capability | — | Configurable embedded analog blocks |
| Clock Management | — | Comprehensive clock generation and management circuitry |
| Configuration Memory | — | Large embedded flash-memory blocks |
| Température de fonctionnement | — | 0 °C to +85 °C |
| Packaging Type | — | Tray |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |