M1AFS600-1FGG484 vs AFS600-2FGG484 对比

详细并排对比 M1AFS600-1FGG484 出自 Microchip Technology 和 AFS600-2FGG484 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
M1AFS600-1FGG484 M1AFS600-1FGG484 - Fusion FPGA, 600K Gates, 172 I/O | Microchip

M1AFS600-1FGG484 - Fusion FPGA, 600K Gates, 172 I/O | Microchip

M1AFS600-1FGG484 ✓ 量产中
Microchip Technology
AFS600-2FGG484 AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip

AFS600-2FGG484 ✓ 量产中

规格对比

参数 M1AFS600-1FGG484 AFS600-2FGG484
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Family Fusion —
Number of System Gates 600K —
Number of I/O 172 —
Number of RAM Bits 110592 —
封装 484-BGA (FBGA) —
Core Voltage 1.5V —
Maximum Internal Frequency 1282.05 MHz —
Technology 130nm —
安装类型 Surface Mount Surface mount
工作温度范围 [DATA_NEEDED: Operating Temperature Range] —
RoHS 状态 RoHS Compliant —
Lead Free Status Lead Free —
Embedded Processor ARM Cortex-M1 —
Flash-Based Configuration Yes —
Security 128-bit flash-based lock, AES decryption —
Device Type — Fusion mixed-signal field-programmable gate array (FPGA)
System Gates — 600,000 gates
Logic Elements — 110,592 logic elements
User I/O Count — 172 I/O
Maximum Frequency — 1470.59 MHz
电源电压 — 1.5 V
Process Technology — 130 nm CMOS
Metal Layers — 7 layers
Package Type — 484-pin FBGA
Package Body Size — 23 x 23 mm
Package Pitch — 1.0 mm
Programmable Logic — Flash-based programmable logic
Analog Capability — Configurable embedded analog blocks
Clock Management — Comprehensive clock generation and management circuitry
Configuration Memory — Large embedded flash-memory blocks
工作温度 — 0 °C to +85 °C
Packaging Type — Tray
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

数据手册与资源

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