M1AFS600-1FGG484 vs AFS600-2FGG484 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M1AFS600-1FGG484 disebabkan oleh Microchip Technology dan AFS600-2FGG484 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M1AFS600-1FGG484 - Fusion FPGA, 600K Gates, 172 I/O | Microchip
M1AFS600-1FGG484 ✓ AktifMicrochip Technology
AFS600-2FGG484 - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG484 ✓ AktifPengandingan Spesifikasi
| Parametr | M1AFS600-1FGG484 | AFS600-2FGG484 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Fusion | — |
| Number of System Gates | 600K | — |
| Number of I/O | 172 | — |
| Number of RAM Bits | 110592 | — |
| Kemasan | 484-BGA (FBGA) | — |
| Core Voltage | 1.5V | — |
| Maximum Internal Frequency | 1282.05 MHz | — |
| Technology | 130nm | — |
| Jenis Pemasangan | Surface Mount | Surface mount |
| Gambaran Suhu Operasi | [DATA_NEEDED: Operating Temperature Range] | — |
| Status RoHS | RoHS Compliant | — |
| Lead Free Status | Lead Free | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Flash-Based Configuration | Yes | — |
| Security | 128-bit flash-based lock, AES decryption | — |
| Device Type | — | Fusion mixed-signal field-programmable gate array (FPGA) |
| System Gates | — | 600,000 gates |
| Logic Elements | — | 110,592 logic elements |
| User I/O Count | — | 172 I/O |
| Maximum Frequency | — | 1470.59 MHz |
| Tegangan Pemberi Arus | — | 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 layers |
| Package Type | — | 484-pin FBGA |
| Package Body Size | — | 23 x 23 mm |
| Package Pitch | — | 1.0 mm |
| Programmable Logic | — | Flash-based programmable logic |
| Analog Capability | — | Configurable embedded analog blocks |
| Clock Management | — | Comprehensive clock generation and management circuitry |
| Configuration Memory | — | Large embedded flash-memory blocks |
| Suhu Operasi | — | 0 °C to +85 °C |
| Packaging Type | — | Tray |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance] |
| REACH Compliance | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |