M1AFS600-2FG256 vs AFS600-FGG256 Comparaison
Comparaison détaillée côte à côte de M1AFS600-2FG256 par Microchip Technology et AFS600-FGG256 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ Actif
Comparaison des spécifications
| Paramètre | M1AFS600-2FG256 | AFS600-FGG256 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Unknown |
| Series | M1AFS600 (Fusion) | — |
| System Gates | 600000 gates | 600,000 gates |
| Logic Elements | 110592 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Number of I/Os | 119 I/O | — |
| Core Supply Voltage | 1.5 V | — |
| Technology | 130 nm flash-based | — |
| Boîtier / Format | 256-LBGA (FBGA-256) | — |
| Style de montage | SMD/SMT | — |
| Operating Temperature - Minimum | 0 C | — |
| Operating Temperature - Maximum | +70 C | — |
| Packaging | Tray | — |
| Analog Peripherals | Configurable analog block (Fusion mixed-signal) | — |
| On-chip Memory | Large flash memory blocks | — |
| Clock Management | On-chip clock generation and management (PLL) | — |
| Configuration | Flash-based, live at power-up, no external config PROM required | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum fabric operating frequency] | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Cells | — | 13,824 cells |
| I/O Count | — | 119 I/Os |
| Tension d'alimentation | — | 1.5 V |
| Logic Family | — | CMOS |
| Process Technology | — | 130 nm |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Flash-based nonvolatile memory |
| Configuration Feature | — | Live at Power-Up (LAPU) |
| Fréquence d'horloge maximale | — | 1098.9 MHz |
| Température de fonctionnement | — | 0°C to 70°C |
| Package Type | — | 256-pin FBGA |
| Package Pitch | — | 1.0 mm |
| Type de montage | — | Surface mount |
| Packing Media | — | Tray |
| RoHS | — | Compliant |